Abstract: A method for providing specific chemical functional groups on a substrate surface is provided. In the method a vaporized material is introduced into a reaction zone to produce a plasma. Selective species of the plasma are prevented from contacting the substrate surface while the remaining species are contacted with the substrate.

Abstract: A method and an apparatus for brushing electrodes such as cathodes used in the electrowinning of zinc and copper wherein opposite surfaces of laterally moving electrodes are cleaned in the area of solution lines with a first pair of stationary, opposed, rotating auxiliary brushes and immediately thereafter the opposite surfaces of stationary electrodes are cleaned below the solution line and between edge sticks with a second pair of vertically moving, opposed, rotating main brushes. The main brushes are pivotally mounted on a pair of vertically-reciprocal carriages having means to center an electrode therebetween.

Abstract: A workpiece to be treated, for example, an engine cylinder, is held vertically with a liquid-tight seal in a treatment device including a head which is fixed in the working plane of a work bench, and a counterhead supported from the work bench by a bracket which can be raised hydraulically. The device is selectively connectible, through control valves and circulation pumps, to reservoirs containing different treatment liquids. The liquids enter the cylinder in an ascending flow through the head in such a way as to avoid swirling movements. Preferably, several treatment devices are arranged to work in synchronism.

Abstract: Apparatus is disclosed, for mechanically agitating, in a non-reciprocating manner, a permalloy composition used in an electroplating procedure, in such a way as to apply a film of improved uniformity of composition and thickness thus avoiding limitations of prior electroplating processes which, due to uneven boundary layer flow patterns caused by reciprocating agitation, result in non-uniformities in film composition and thickness.

Abstract: A device for electroplating portions of a continuously moving, cathodically connecting workpiece as it is moved past a plurality of anodically connected spray nozzles characterized by the spray nozzles comprising precious metal and being positioned one after another in a row along the direction of movement of the workpiece with each of the nozzles having an individual stream of electrolytes emerging unimpeded therefrom. The continuously moving workpiece is positioned so that selected portions thereof are moved along the row of nozzles to be contacted by the stream of electrolyte emerging from the individual nozzles for a free and unimpeded electroplating of the portions contacted by the streams.

Abstract: In a tank of aluminizing electroplating cells which may contain racks for articles, operated with aprotic oxygen-free and water-free organo-aluminum electrolytes, a lining of individual segments coated with resistant materials (enamel or electrolyte-resistant plastics) is provided as an electrically insulating protective device. The outer edges of the side baffles, coated all around, are bent round toward the outside and are held together by connecting straps which are bent round toward the inside. The individual bottom segments coated all around lie on top of each other overlapping in roof tile fashion. The protective device may also include a similarly insulated band arranged all around the cell.

Abstract: An electroplating mask support structure of particular use in the plating of semiconductor chip lead frames in which a support bar has a number of support stations thereon with masking die containing cavities in the stations.

Abstract: A plating mask of molded unitary configuration with electrolyte admitting openings held to very accurate position and dimension by a molding process in which the mask is formed between two separable molds with forms supported therebetween to exclude material from both mask penetrating and transverse circulation passageways.