Abstract: The present invention relates to spring members positioned in an insulated housing for providing an electrical path from leadless integrated circuit package to a printed circuit board. More particularly the spring members are uniquely constructed in a complex geometric shape to exert forces on contact mating surfaces within closely specified maximum and minimum values and not distort the housing or the printed circuit board.
Type:
Grant
Filed:
October 4, 1976
Date of Patent:
October 4, 1977
Assignee:
AMP Incorporated
Inventors:
William Samuel Scheingold, Frank Christian Youngfleish