Patents Examined by Nguyen T. Ha
  • Patent number: 10607911
    Abstract: A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: March 31, 2020
    Assignee: Infineon Technologies AG
    Inventors: Martin Richard Niessner, Walter Hartner, Gerhard Haubner, Sebastian Pahlke
  • Patent number: 10607777
    Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: March 31, 2020
    Assignee: AVX Corporation
    Inventors: Michael Kirk, Marianne Berolini
  • Patent number: 10600580
    Abstract: An explosion-proof apparatus includes a stopper having a hollow cylindrical shape that is open at a first side and closed at a second side, and configured to be combined with an electrolytic condenser to surround an explosion-proof face of the electrolytic condenser and a lateral side connected to the explosion-proof face, through the first side, and a holder provided on the stopper to support the stopper. The first side of the stopper is separated from the explosion-proof face of the electrolytic condenser, a lateral side of the stopper has a stepped structure in which a periphery of a first region connecting to the first side is larger than a periphery of a second region connecting to the second side, and the holder is mounted on the stopper to surround at least part of the periphery of the second region of the stopper.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Yong Joo, Sung Bum Jung, Won Myung Woo
  • Patent number: 10600576
    Abstract: A wet electrolytic surface mount capacitor has a body defining an interior area and having a fill port formed through a wall of the body. A capacitive element is positioned in an interior of the body and is isolated from the body. A surface mount anode termination is in electrical communication with the capacitive element and isolated from the body. A surface mount cathode termination is in electrical communication with the body. An electrolyte is contained in the interior area of the body, and is introduced into the interior area of the body through the fill port. A fill port plug is positioned adjacent the fill port. A fill port cover compresses the fill port plug against the fill port to seal the fill port, and may be welded in place. A method of forming the capacitor is also provided.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: March 24, 2020
    Assignee: VISHAY SPRAGUE, INC.
    Inventors: Alex Eidelman, Pavel Vaisman, Gabi Shilo, Evgeny Petukhov, Andrey Mitiagin
  • Patent number: 10593477
    Abstract: A capacitor component includes: a body having a first main surface and a second main surface facing each other in a thickness direction and side surfaces facing each other in a length direction and connected to the first and second main surfaces, the body including a plurality of dielectric layers and a plurality of internal electrodes stacked in the thickness direction and alternately exposed through the side surfaces of the body with each of the plurality of dielectric layers interposed therebetween; and external electrodes disposed on the side surfaces and the second main surface of the body and electrically connected to the plurality of internal electrodes.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: March 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woo Jin Choi, Young Ghyu Ahn, Jong Duck Kim
  • Patent number: 10593483
    Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: March 17, 2020
    Assignee: KEMET Electronics Corporation
    Inventor: John Bultitude
  • Patent number: 10586655
    Abstract: An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: March 10, 2020
    Assignee: American Radionic Company, Inc.
    Inventor: Robert M. Stockman
  • Patent number: 10580584
    Abstract: A multilayer ceramic capacitor includes a body including first and second dielectric layers and having first to sixth surfaces; a second internal electrode disposed on the second dielectric layer to face the first internal electrode with the first or second dielectric layer interposed therebetween, exposed to the fourth, fifth, and sixth surfaces, and disposed to be spaced apart from the third surface by a second space; a first dielectric pattern disposed in at least a portion of the first space; a second dielectric pattern disposed in at least a portion of the second space; a side insulating layer disposed on the fifth and sixth surfaces; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, in which the first and second dielectric patterns have a color different from the first and second dielectric layers.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hoon Kim, Byung Kun Kim, Byung Chul Jang, Chang Hak Choi, Jung Deok Park
  • Patent number: 10580579
    Abstract: A multilayer ceramic capacitor includes a body a first internal electrode and a second internal electrode disposed with a dielectric layer interposed therebetween, a first connecting electrode connected to the first internal electrode through the body, a second connecting electrode connected to the second internal electrode through the body, a first external electrode disposed on one surface of the body and connected to the first connecting electrode, and a second external electrode disposed on one surface of the body, spaced apart from the first external electrode, and connected to the second connecting electrode, wherein the first and second external electrodes each include a first electrode layer disposed on the body and including ceramics, and a second electrode layer disposed on the first electrode layer and having the content of ceramics smaller than that of the first electrode layer.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Woo Song, Taek Jung Lee, Jin Kyung Joo, Hyo Youn Lee, Sung Kwon An
  • Patent number: 10580574
    Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The pair of external terminals include bonding portions disposed on a top surface of the interposer body, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer to connect the bonding portions and the mounting portions to each other. The mounting portions have lengths greater than lengths of the bonding portions in a direction of connection of the pair of external terminals.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
  • Patent number: 10573462
    Abstract: A capacitor component includes a multilayer structure including unit laminates. Each unit laminate has a plurality of internal electrodes and a first connecting electrode extending in a stacking direction of the plurality of internal electrodes and connected to portions of the plurality of internal electrodes. First connecting electrodes of unit laminates adjacent to each other among the unit laminates are connected to each other. A diameter of a first connecting electrode of at least one of the unit laminates is different from diameters of first connecting electrodes of other unit laminates.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: February 25, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Kwon An, Jin Kyung Joo, Hyo Youn Lee, Seung Woo Song, Taek Jung Lee
  • Patent number: 10566142
    Abstract: A solid electrolytic capacitor which exhibits excellent characteristics for high voltage applications of 80 WV or more and a method for manufacturing this solid electrolytic capacitor are provided. This solid electrolytic capacitor includes a capacitor element 10 which is obtained by winding an anode foil 1 and a cathode foil 2, with a separator 3 interposed therebetween, the capacitor element 10 includes a solid electrolyte layer, and a void part in the capacitor element 10 is filled with an electrolyte solution, the electrolyte solution contains an ammonium salt of an aliphatic carboxylic acid as a solute and a polyhydric alcohol as a solvent, and the addition amount of the acid serving as the solute relative to the solvent is 0.6 mol/kg or less.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: February 18, 2020
    Assignee: Nippon Chemi-Con Corporation
    Inventors: Kenta Sato, Masao Sakakura, Kazuya Koseki
  • Patent number: 10553366
    Abstract: An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections, a pressure interrupter cover assembly, and a conductor configured to electrically connect a common terminal of the multiple capacitor sections to a common cover terminal. Each first terminal of the multiple capacitor sections is electrically connected to one of a plurality of capacitor cover terminals.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: February 4, 2020
    Assignee: American Radionic Company, Inc.
    Inventor: Robert M. Stockman
  • Patent number: 10553365
    Abstract: A capacitor assembly that is capable of performing under extreme conditions, such as at high temperatures and/or high voltages, is provided. The ability to perform at high temperature is achieved in part by enclosing and hermetically sealing the capacitor element within a housing in the presence of a gaseous atmosphere that contains an inert gas, thereby limiting the amount of oxygen and moisture supplied to the solid electrolyte of the capacitor element. Furthermore, the present inventors have also discovered that the ability to perform at high voltages can be achieved through a unique and controlled combination of features relating to the formation of the anode, dielectric, and solid electrolyte. For example, the solid electrolyte is formed from a combination of a conductive polymer and a hydroxy-functional nonionic polymer.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: February 4, 2020
    Assignee: AVX Corporation
    Inventors: Martin Biler, Jan Petrzilek
  • Patent number: 10546691
    Abstract: A capacitor that includes a conductive base material with high specific surface area, a dielectric layer covering the conductive base material with high specific surface area, and an upper electrode covering the dielectric layer, in which the conductive base material with high specific surface area is formed of a metal sintered body as a whole.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: January 28, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noriyuki Inoue, Takeo Arakawa, Kensuke Aoki, Hiromasa Saeki, Koichi Kanryo, Akihiro Tsuru, Haruhiko Mori
  • Patent number: 10541086
    Abstract: A laminated ceramic capacitor has a capacitor body of roughly a rectangular solid shape defined by the length, width, and height, as well as a concaved part formed at and along the edges of one side and the other side in the height direction. An external electrode has a base conductor layer whose height-direction wrap-around part is formed inside the concaved part, and a main conductor layer whose height-direction wrap-around part is formed continuously over the height-direction wrap-around part of the base conductor layer through the planar part, except for the concaved part, of one side and the other side of the component body in the height direction. The height-direction wrap-around part of the main conductor layer has a planar connecting area constituted by a surface area over the height-direction wrap-around part of the base conductor layer and a surface area over the planar part of the component body.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 21, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yoshiaki Iijima, Sou Satou, Yasutomo Suga, Katsuo Koizumi
  • Patent number: 10522286
    Abstract: A dielectric film for a film capacitor includes a center portion made of a polymer and composite oxide particles and end portions made of only a polymer. The end portions are provided on both sides of the center portion.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: December 31, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Takahiro Saito
  • Patent number: 10510496
    Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: December 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masato Kimura, Yasuhiro Nishisaka
  • Patent number: 10497520
    Abstract: An apparatus suitable for use in an air-conditioning system and configured to provide a plurality of selectable capacitance values includes a plurality of capacitive devices and a pressure interrupter cover assembly. Each of the capacitive devices has a first capacitor terminal and a second capacitor terminal. The pressure interrupter cover assembly includes a deformable cover, a set of capacitor cover terminals, a common cover terminal, and a set of insulation structures. The apparatus also includes a conductor configured to electrically connect the second capacitor terminal of at least one of the capacitive devices to the common cover terminal.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: December 3, 2019
    Assignee: American Radionic Company, Inc.
    Inventor: Robert M. Stockman
  • Patent number: 10490362
    Abstract: A method of reducing outgassing in a supercapacitor comprised of carbon-containing electrodes and at least one ionic liquid is characterised by the steps of (a) contacting the carbon-containing electrodes with a tetrafluoroborate salt; (b) applying a potential difference across the carbon-containing electrodes whilst in contact with the salt in a cycle during which electrical charge is stored on and discharged from the electrodes; and (c) continuing further cycles of step (b) until such time as substantially no further outgassing from the system occurs.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: November 26, 2019
    Assignee: ZapGo Ltd
    Inventors: Stephen David Voller, Timothy Walder, Marappa Rajendran