Patents Examined by Nguyen T. Ha
  • Energy storage structure, method of manufacturing a support structure for same, and microelectronic assembly and system containing same
    Patent number: 9409767
    Abstract: An energy storage structure includes an energy storage device containing at least one porous structure (110, 120, 510, 1010) that contains multiple channels (111, 121), each one of which has an opening (112, 122) to a surface (115, 116, 515, 516, 1015, 1116) of the porous structure, and further includes a support structure (102, 402, 502, 1002) for the energy storage device. In a particular embodiment, the porous structure and the support structure are both formed from a first material, and the support structure physically contacts a first portion (513, 813, 1213) of the energy storage device and exposes a second portion (514, 814, 1214) of the energy storage device.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: August 9, 2016
    Assignee: Intel Corporation
    Inventors: Donald S. Gardner, Zhaohui Chen, Wei C. Jin, Eric C. Hannah, John L. Gustafson, Tomm V. Aldridge
  • Supercapacitor devices formed by depositing metal oxide materials onto carbon substrates
    Patent number: 9406449
    Abstract: Supercapacitors have composite electrodes that include a porous carbonaceous material such as graphene onto which a metal oxide pseudocapacitor material is deposited in the form of nano-scale particles or a nano-scale film. The composite electrodes exhibit excellent specific capacitance, even at high scan rates.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: August 2, 2016
    Assignee: Regents of the University of Colorado, a Body Corporate
    Inventors: Ming Xie, Steven M. George, Mattias J. Young, Xiang Sun, Jie Lian, Gongkai Wang
  • Multilayer ceramic capacitor and board having the same mounted thereon
    Patent number: 9384892
    Abstract: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween and alternately exposed to the first or second side surface; and a first external electrode disposed on the first side surface and electrically connected to the first internal electrodes and a second external electrode disposed on the second side surface and electrically connected to the second internal electrodes. When length of the ceramic body is L and length of the first and second external electrodes in the length direction of the ceramic body is L1, 0.2?L1/L?0.96 is satisfied.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: July 5, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyo Kwang Lee, Sang Soo Park, Young Ghyu Ahn, Byoung Hwa Lee
  • Tantalum capacitor and method of manufacturing the same
    Patent number: 9384899
    Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: July 5, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Ho Kwak, Hun Chol Jung, Jeong Oh Hong, Sung Soo Cha, Hee Dong Myung, Hee Sung Choi
  • Multilayer ceramic device
    Patent number: 9378891
    Abstract: Disclosed herein is a multilayer ceramic device including a device body having lateral surfaces and circumferential surfaces connecting the lateral surfaces, an internal electrode disposed in a length direction of the device body within the device body, an external electrode having a front portion covering the lateral surface and a band portion extending from the front portion to cover a portion of the circumferential surface, and a reinforcement pattern extending from the lateral surface toward the interior of the device body and having a length longer than a width of the band portion.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: June 28, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Jin Jang, Jin Hyung Lim, Hae Sock Chung, Doo Young Kim, Sang Hyun Park, Won Seh Lee
  • Solid electrolytic capacitor and method for manufacturing the same
    Patent number: 9378896
    Abstract: A solid electrolytic capacitor includes a porous sintered body made of a valve metal, a dielectric layer on the porous sintered body, a solid electrolyte layer on the dielectric layer, and a cathode layer on the solid electrolyte layer. The solid electrolyte layer includes an inner electrode layer covering the dielectric layer inside the porous sintered body and an outer electrode layer covering the inner electrode layer outside the porous sintered body. The outer electrode layer includes a solid particle containing layer formed by applying a dispersion material liquid containing a conductive polymer dispersion material, solid particles and a solvent to the inner electrode layer and then removing the solvent.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: June 28, 2016
    Assignee: ROHM CO., LTD.
    Inventor: Naotsugu Sugimura
  • Capacitor with multiple elements for multiple replacement applications
    Patent number: 9378893
    Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 28, 2016
    Assignee: American Radionic Company, Inc.
    Inventor: Robert M. Stockman
  • Multilayer ceramic electronic part, board having the same mounted thereon, and manufacturing method thereof
    Patent number: 9373446
    Abstract: A multilayer ceramic electronic part may include: a ceramic body; an active layer including a plurality of first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween; an upper cover layer formed on an upper portion of the active layer; a lower cover layer formed on a lower portion of the active layer and having a thickness thicker than that of the upper cover layer; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive layers extended from both end surfaces of the ceramic body onto upper and lower main surfaces thereof; and first and second insulation layers formed on the first and second conductive layers disposed on both end surfaces of the ceramic body.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: June 21, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Soo Park, Young Ghyu Ahn, Doo Young Kim
  • Routing of MEMS variable capacitors for RF applications
    Patent number: 9373447
    Abstract: Utilizing a variable capacitor for RF and microwave applications provides for multiple levels of intra-cavity routing that advantageously reduce capacitive coupling. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: June 21, 2016
    Assignee: CAVENDISH KINETICS, INC.
    Inventors: Roberto Gaddi, Robertus Petrus Van Kampen, Richard L. Knipe, Anartz Unamuno
  • Self-protected low-voltage capacitor
    Patent number: 9362051
    Abstract: The capacitor (2) according to the invention comprises: an enclosure (4); an insulating material (6) contained in the enclosure (4); a capacitive device (8) comprising two conductive layers and at least one dielectric layer formed from a dielectric material and inserted between the two conductive layers; and a protection device (12) comprising a mechanism (40) for disconnecting the capacitive device (8) in case of overpressure in the enclosure (4); and characterized in that it further comprises, inside the enclosure (4), a degassing material (58) capable of releasing gas at a degassing temperature (Tgaz) below the decomposition temperature of the dielectric material to generate an overpressure in the enclosure (4).
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: June 7, 2016
    Assignee: SCHNEIDER ELECTRIC INDUSTRIES SAS
    Inventors: Olivier Dujeu, Christophe Guillermin
  • Solid electrolytic capacitor with high temperature leakage stability
    Patent number: 9362056
    Abstract: A solid electrolytic capacitor and method for forming a solid electrolytic capacitor with high temperature leakage stability is described. The solid electrolytic capacitor has improved leakage current and is especially well suited for high temperature environments such as down-hole applications.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: June 7, 2016
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, Randolph S. Hahn, Pablo Antonio Ruiz
  • Ceramic electronic component and method for manufacturing ceramic electronic component
    Patent number: 9355762
    Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: May 31, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yosuke Terashita
  • Thin film capacitors embedded in polymer dielectric
    Patent number: 9349788
    Abstract: A substrate comprising a capacitor comprising metal electrodes and a ceramic or metal oxide dielectric layer, the capacitor being embedded in a polymer based encapsulating material and connectable to a circuit via a via post standing on said capacitor.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: May 24, 2016
    Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
    Inventors: Dror Hurwitz, Alex Huang
  • Multilayer ceramic capacitor and printed circuit board including the same
    Patent number: 9345141
    Abstract: The present invention relates to a multilayer ceramic capacitor and a printed circuit board including the same that can minimize thickness deviations of an external electrode and a multilayer ceramic. A multilayer ceramic capacitor according to an embodiment of the present invention includes a multilayer ceramic and external electrodes formed on both sides of the multilayer ceramic, wherein |Tmax?Tmin| may be less than 10 ?m, and |CTmax?CTmin| may be less than 20 ?m. (Here, Tmax is a maximum thickness of the external electrodes in a via processing area, Tmin is a minimum thickness of the external electrodes in the via processing area, CTmax is a maximum thickness of the multilayer ceramic capacitor in the via processing area, and CTmin is a minimum thickness of the multilayer ceramic capacitor in the via processing area.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: May 17, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Eun Lee, Byoung Hwa Lee, Yee Na Shin, Yul Kyo Chung
  • Additively deposited electronic components and methods for producing the same
    Patent number: 9343233
    Abstract: An exemplary embodiment of the present invention provides a passive electrical component comprising a substrate, a first electrically conductive layer, a first dielectric layer, and a second electrically conductive layer. The first electrically conductive layer can be additively deposited on the substrate. The first dielectric layer can be additively deposited on the first conducive layer. The first dielectric layer can comprise a cross-linked polymer. The second electrically conductive layer can be additively deposited on the first dielectric layer. The resonant frequency of the passive electrical component can exceed 1 gigahertz.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: May 17, 2016
    Assignee: GEORGIA TECH RESEARCH CORPORATION
    Inventors: Manos Tentzeris, Benjamin Cook
  • Conductive paste composition for external electrode and multilayer ceramic electronic component including the same
    Patent number: 9343232
    Abstract: There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: May 17, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hwan Han, Byoung Jin Chun, Kyung Pyo Hong, Hyun Hee Gu, Byung Jun Jeon
  • Capacitor for multiple replacement applications
    Patent number: 9343238
    Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six concentrically wound capacitor sections of a capacitive element each having a capacitance value. The capacitor sections each have a respective section element terminal at a first end of the capacitive element and the capacitor sections have a common element terminal at a second end of the capacitive element. A pressure interrupter cover assembly is sealingly secured to the open end a case for the element and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitive element to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: May 17, 2016
    Assignee: American Radionic Company, Inc.
    Inventor: Robert M. Stockman
  • Capacitor array and layout design method thereof
    Patent number: 9336347
    Abstract: A layout design method is provided for generating capacitor arrays being described in four steps: first, the wiring mode of unit capacitors is defined allowing the wire being connected to the upper plate to parallel that to the lower one, second, a capacitor array layout is designed with capacitors being distributed in Mh lines, Mh is the maximum of capacitors' lines, the line numbers of Class 1 to Class K capacitors are defined in the unilateral capacitor array, third, the wiring mode is set for capacitor array making sure the lengths of the wires to the upper and lower plates of unit capacitors are equal, at last, parasitic parameters are characterized in ways that verify the layout. A capacitor array is provided as well. By eliminating capacitance mismatching caused by parasitic capacitance, the method works to generate a well-matched capacitor array in an easy and efficient way.
    Type: Grant
    Filed: November 28, 2013
    Date of Patent: May 10, 2016
    Assignee: CHINA ELECTRONIC TECHNOLOGY CORPORATION, 24TH RESEARCH INSTITUTE
    Inventors: Yan Wang, Yu-Xin Wang, Gang-Yi Hu, Ting Li, Tao Liu, Guang-Bing Chen
  • Laminated ceramic electronic component
    Patent number: 9336948
    Abstract: A laminated ceramic capacitor includes a laminate including an inner layer portion including a ceramic dielectric layer and an internal electrode, and an outer layer portion defined by a ceramic dielectric layer. At both end portions of the laminate, external electrodes are connected to the internal electrode. In the outer layer portion, a glass layer is provided. An outer ceramic dielectric layer positioned outwardly of the glass layer has a different color from the color of an inner ceramic dielectric layer positioned inwardly of the glass layer.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: May 10, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Awata, Sui Uno, Takatoshi Sueto
  • Tantalum capacitor and method of manufacturing the same
    Patent number: 9336956
    Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: May 10, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Bum Cho, Kyoung Sup Choi, Hong Kyu Shin, Jeong Oh Hong, Wan Suk Yang, Hyun Sub Oh