Patents Examined by Nichael Datskovsky
  • Heat dissipating device
    Patent number: 7193849
    Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: March 20, 2007
    Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Li-Fu Xu, Chih-Hao Yang, Ching-Bai Hwang