Abstract: In a method for reducing a solid feedstock (110), such as a solid metal compound, feedstock is arranged on upper surfaces of elements (60, 80, 81) in a bipolar cell stack contained within a housing (25). A molten salt electrolyte is circulated through the housing so that it contacts the elements of the bipolar stack and the feedstock. A potential is applied to terminal electrodes (50, 60) of the bipolar stack such that the upper surfaces of the elements become cathodic and the lower surfaces of the elements become anodic. The applied potential is sufficient to cause reduction of the feedstock. The invention also provides an apparatus for implementing the method.

Abstract: The invention relates to a method, an apparatus and a computer program for electrochemical machining where a removal of cathode depositions is performed in a fully automated way by means of an application of optimal pulses of a suitable polarity.

Abstract: A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

Abstract: An apparatus and method for generating hydrogen. The hydrogen generator includes a cylindrical body and two end plates defining a cavity therein. A plurality of elements are disposed within the cavity including an outer and inner gaskets, an outer and inner electrodes, and a proton exchange membrane. A bladder inflated within the cavity compresses the elements together and into firm contact with the inner wall of the body. A plurality of elongated bolts compresses the end plates against the ends of the cylindrical body. The hydrogen generator includes a water inlet port, an oxygen and water outlet port, and a hydrogen port extending. Connecting a DC voltage across the electrodes and pumping distilled water into the water inlet port produces hydrogen gas that can be used to fuel an internal combustion engine or a fuel cell.

Abstract: Disclosed is a manufacturing process of a sintered iron-copper base porous alloy and of an oil-impregnated sintered bearings, having the steps of: preparing a mixed powder comprising an iron powder, and at least one of a copper powder and a copper alloy powder; forming the mixed powder into a green compact; and sintering the green compact to obtain a sintered iron-copper base porous alloy. The iron powder contains a porous iron powder which has a particle size of 177 microns or less and a specific surface area of 110 to 500 m2/kg according to a gas adsorption method. The sintered compact has high intercommunicating porosity and low permeability, and it is sized to prepare the sintered bearing into which a lubricating oil is impregnated.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver. REEXAMINATION RESULTS The questions raised in reexamination proceedings Nos. 90/012,336 and 90/009,934, filed Jun. 4, 2012 and Aug.