Abstract: The present invention relates to an extension recycling method by the technology of bar embedment with glue for wood columns and an apparatus thereof, the method comprising: classification of short wood, sawing of short wood, drying of short wood, assembling and sorting of short wood, connection in series of short wood under pressure, processing of short wood, and marking of stand columns. The apparatus is a short wood connection machine comprising a main body, rotating rollers, pressing cylinders, pressing plates and a planing frame. By using the present method, short wood can be connected into a strut, so that the abandoned short wood can be recycled to save natural resources. Due to the apparatus and the connecting member of the present invention, the process of connecting short wood into a strut can be completed conveniently, which have the advantages of simple structure, convenient processing and easy manufacturing.
Type:
Grant
Filed:
September 30, 2013
Date of Patent:
November 7, 2017
Assignee:
INTERNATIONAL CENTER FOR BAMBOO AND RATTAN
Inventors:
Zhengjun Sun, Zhijia Liu, Yan Yan, Huanrong Liu, Weifeng Guo, Yujing Nie, Xiubiao Zhang
Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.
Type:
Grant
Filed:
April 15, 2010
Date of Patent:
December 30, 2014
Assignee:
Suss Microtec Lithography, GmbH
Inventors:
Gregory George, Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles
Abstract: The present invention is directed to a paint color sample display device for the illustration of paint colors and a method for making such a color display device. The color display device may be a color fan deck which displays color on each side of the blades of the fan deck. The fan blades include a painted polymeric film laminated to both sides of a base paper to form a painted film/base paper/painted film laminate for the fan blades.