Abstract: A device for peeling off at least one protective film from a plate-shaped object, a detachment device with at least one roller exerting a pressure force on the protective film in the edge region of the plate-shaped object and thereby detaches the protective film, the protective film being at least partially lifted from the plate-shaped object with at least one adhesive tape and taken up by at least one drum in rotating motion, wherein the device has at least one swiveling contact arm and a stamp arranged thereon having a stamp surface for applying the adhesive tape.

Abstract: A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.