Abstract: A BGA package and a method of fabricating the BGA package is provided. The package includes a substrate having a first surface with a pattern of conductors thereon, and an opposing second surface with a die attach area thereon. A first solder mask is formed on the first surface with via openings to ball bonding pads on the conductors. A second solder mask is formed on the second surface with an opening on the die attach area. The opening in the second solder mask permits a die to be placed through the opening and adhesively bonded directly to the substrate. The die can then be wire bonded to the conductors and encapsulated in an encapsulating resin. In addition solder balls can be placed in the via openings and bonded to the ball bonding pads.