Abstract: A memory device includes a memory array comprising a plurality of wordlines and a regulator circuit selectively coupled to the plurality of wordlines, wherein the regulator circuit is configured to perform a detection routine to sample a load current from a selected wordline of the plurality of wordlines and generate a measured output voltage, wherein the measured output voltage modulates with respect to the load current. The memory device further includes a comparator circuit coupled to the regulator circuit, wherein the comparator circuit is configured to generate a comparison result based on a difference between the measured output voltage and a reference voltage and a local media controller coupled to the comparator circuit, wherein the local media controller is configured to identify a presence of a defect on the selected wordline in response to the comparison result satisfying a threshold condition.

Abstract: A memory device includes a first block including a first memory cell and a first word line connected to the first memory cell, a second block including a second memory cell and a second word line connected to the second memory cell, and a control circuit. The control circuit applies a first voltage to each of the first and second word lines to supply a first erase pulse having a first erase intensity to each of the first and second blocks, when a first erase operation is executed, and applies the first voltage to the first word line and a second voltage higher than the first voltage to the second word line, to supply the first erase pulse to the first block and a second erase pulse having a second erase intensity less than the first erase intensity to the second block, when a second erase operation is executed.

Abstract: A SEDRAM-based stacked Cache system is integrated in multiple layers of wafers bonded together and includes a Cache, a Cache controller and a SEDRAM controller; the multiple layers of wafers includes a SEDRAM wafer structure and a processor wafer structure; a SEDRAM unit is integrated in each layer of SEDRAM wafer in the SEDRAM wafer structure and configured as a storage space of the Cache; a CPU, the Cache controller, the SEDRAM controller and a memory controller are integrated in the processor wafer structure.

Abstract: An integrated circuit includes a memory and peripheral circuits with a temperature sensor used to automatically adjust operating voltages. The temperature sensor includes a first circuit to generate a temperature-dependent voltage (TDV) that is dependent on an operating temperature of the integrated circuit, and a second circuit to generate a plurality of temperature reference voltages, based on or more codes. One or more comparator circuits compare individual ones of the plurality of reference voltages with the TDV, to generate one or more comparison signals that are indicative of the operating temperature of the integrated circuit.

Abstract: According to one embodiment, there is provided a memory card including a first surface, a second surface, and 1st to Nth terminal groups. The first surface includes first to Nth rows, where N is an integer of two or greater. The second surface faces the opposite side from the first surface. The 1st to Nth terminal groups are placed in the first to Nth rows. The 1st terminal group includes terminals to which differential clock signals are assigned, terminals to which single-ended signals are assigned, and a terminal to which a first power supply voltage is assigned. Kth terminal group, where K is an integer no smaller than two and no greater than N, includes terminals to which differential data signals are assigned.

Abstract: A semiconductor device includes a relay chip configured to be connected to a host; a first chip connected to the relay chip via a first channel; and a second chip connected to the relay chip via a second channel. The relay chip is configured to receive, from the host, a first enable signal for selecting the first channel and a second enable signal for selecting the second channel. During a first period in which the first enable signal is maintained at a non-active level and the second enable signal is maintained at an active level, the relay chip is configured to perform, in parallel, a first data transfer operation via the first channel and a first command issuing operation via the second channel.

Abstract: A non-volatile semiconductor memory device includes non-volatile storage elements and one or more control circuits in communication with the non-volatile storage elements. The one or more control circuits are configured to determine for a program iteration of a program operation on a word line whether a condition is met and in response to determining that the condition is met, identify one or more memory cells of the word line that are in an erased state that have a threshold voltage higher than an erase threshold voltage and perform the program iteration of the program operation. The program iteration includes applying a first bitline inhibit voltage to bitlines connected to the identified one or more memory cells and a second bitline inhibit voltage to bitlines connected to one or more memory cells that are in the erased state that do not have a threshold voltage higher than the erase threshold voltage.

Abstract: To increase the speed of programming of a multi-plane non-volatile memory, it is proposed to accelerate the programming of the last one or more data states for one or more slow planes.

Abstract: A memory device has a magnetic tunnel junction (MTJ) element that includes a free layer structure, a free/pinned layer structure, and a tunnel barrier structure between the free layer structure and the free/pinned layer structure. A first electrode is coupled to the free layer structure, and a second electrode is coupled to the free/pinned layer structure. Processing circuitry is operatively coupled to the MTJ element. The processing circuitry is configured to apply a voltage to the MTJ element to modulate magnetic anisotropy using an electric field, to enable writing with reduced write currents; issue a charge current to the MTJ element to induce spin-dependent writing and magnetic spin accumulation in the free layer structure to set a bit state of the MTJ element, using spin-transfer torque into the free layer structure; and remove the voltage from the MTJ element that modulates the magnetic anisotropy, to perform a write operation.

Abstract: A mixed-signal in-memory computing sub-cell only requires 9 transistors for 1-bit multiplication. A computing cell is constructed from a plurality of such sub-cells that share a common computing capacitor and a common transistor. A MAC array for performing MAC operations, includes a plurality of the computing cells each activating the sub-cells therein in a time-multiplexed manner. A differential version of the MAC array provides improved computation error tolerance and an in-memory mixed-signal computing module for digitalizing parallel analog outputs of the MAC array and for performing other tasks in the digital domain. An ADC block in the computing module makes full use of capacitors in the MAC array, allowing the computing module to have a reduced area and suffer from fewer computational errors.

Abstract: A resistive random-access memory (RRAM) circuit includes an RRAM device configured to output a cell current responsive to a bit line voltage, and a current limiter including an input terminal coupled to the RRAM device, first and second parallel current paths configured to conduct the cell current between the input terminal and a reference voltage node, and an amplifier configured to generate a first signal responsive to a voltage level at the input terminal and a reference voltage level. Each of the first and second current paths includes a switching device configured to selectively conduct a portion of the cell current responsive to the first signal.

Abstract: A bottom-pinned spin-orbit torque magnetic random access memory (SOT-MRAM) is provided in the present invention, including a substrate, a bottom electrode layer on the substrate, a magnetic tunnel junction (MTJ) on the bottom electrode layer, a spin-orbit torque (SOT) layer on the MTJ, a capping layer on the SOT layer, and an injection layer on the capping layer, wherein the injection layer is divided into individual first part and second part, and the first part and the second part are connected respectively with two ends of the capping layer.

Abstract: Systems, methods, circuits, and apparatuses for managing integrated circuits in memory devices are provided. In one aspect, an integrated circuit includes: a latch circuit including a latch and a sensing transistor coupled to the latch, and a compensation circuit coupled to the sensing transistor. The sensing transistor includes a gate terminal coupled to a sensing node and an additional terminal coupled to the compensation circuit, and the compensation circuit is configured to apply a control voltage to the additional terminal to compensate for a variation of a threshold voltage of the sensing transistor.

Abstract: In certain aspects, a three-dimensional (3D) memory device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes an array of memory cells, a first peripheral circuit of the array of memory cells, and a polysilicon layer between the array of memory cells and the first peripheral circuit. The first peripheral circuit includes a first transistor. The second semiconductor structure includes a second peripheral circuit of the array of memory cells. The second peripheral circuit includes a second transistor.

Abstract: A semiconductor storage device is provided. The semiconductor storage device includes a first voltage supply line coupled to a gate electrode of a first memory transistor through a first transistor, a first signal supply line coupled to a gate electrode of the first transistor, a first capacitor coupled to the gate electrode of the first memory transistor, and a first wiring coupled between the gate electrode of the first memory transistor and the first transistor through the first capacitor. In a write operation on the first memory transistor, at a second timing after a first timing, a voltage present on the first signal supply line decreases from a second voltage to a fourth voltage lower than the second voltage, and at a third timing after the second timing, the voltage present on the first wiring increases from a third voltage to a fifth voltage higher than the third voltage.

Abstract: An apparatus includes a memory cell array including a plurality of word lines each coupled to a plurality of memory cells, and a control circuit which is configured to activate first and second internal signals in a time-division manner in response to a first external command A first number of the word lines arc selected in response to the first internal signal, and a second number of the word line is selected in response to the second internal signal. The second number is smaller than the first number.

Abstract: In certain aspects, a three-dimensional (3D) memory device includes a first semiconductor structure, a second semiconductor structure, a third semiconductor structure, and a first bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes an array of memory cells. The second semiconductor structure includes a first peripheral circuit of the array of memory cells. The first peripheral circuit includes a first transistor. A third semiconductor structure includes a second peripheral circuit of the array of memory cells. The second peripheral circuit includes a second transistor. The first semiconductor structure, the second semiconductor structure, and the third semiconductor structure are stacked over one another.

Abstract: A memory device and an operation method thereof are provided. The memory device includes memory cells, each having a static random access memory (SRAM) cell and a non-volatile memory cell. The SRAM cell is configured to store complementary data at first and second storage nodes. The non-volatile memory cell is configured to replicate and retain the complementary data before the SRAM cell loses power supply, and to rewrite the replicated data to the first and second storage nodes of the SRAM cell after the power supply of the SRAM cell is restored.

Abstract: Combinations of resistive change elements and resistive change element arrays thereof are described. Combinational resistive change elements and combinational resistive change element arrays thereof are described. Devices and methods for programming and accessing combinations of resistive change elements are described. Devices and methods for programming and accessing combinational resistive change elements are described.

Abstract: Memory devices might include a first storage element, a second storage element, a data line, and a controller. The first storage element is to store a first data bit. The second storage element is to store a second data bit. The data line is selectively connected to the first storage element, the second storage element, and a memory cell. The controller is configured to apply one of four voltage levels to the data line based on the first data bit and the second data bit.