Abstract: Some embodiments relate to a system and method of estimating the viscoelasticity of a material. The system and method includes receiving a plurality of time-amplitude curves measured at a plurality of space points. The time-amplitude curves reflect time evolutions of a propagating mechanical wave. The system and method also include estimating the viscoelasticity of a material between any set of space points using the time-amplitude curves measured at those space points.

Abstract: A vibratory meter (5), and methods of manufacturing the same are provided. The vibratory meter includes a pickoff, a driver, and a flow tube (700) comprising a tube perimeter wall with: a first substantially planar section (706a), a second substantially planar section (706b) coupled to the first substantially planar section to form a first angle ?1 (704), a third substantially planar section (706c), a fourth substantially planar section (706d), and a fifth substantially planar section (706e).

Abstract: A sensor array having a lattice topology includes interconnects having an electrically-conductive layer sandwiched between two dielectric layers, the interconnects defining first-axis interconnects, second-axis interconnects, and interconnect junctions, sensor nodes located on associated interconnect junctions thereby defining an associated first-axis line and second-axis line, a sensor on an associated sensor node, a primary first-axis interconnect interface that is electrically connected to the first-axis interconnects, and a primary second-axis interconnect interface that is electrically connected to the second-axis interconnects. Each sensor node includes a first electrode that is electrically connected to an associated first-axis line, a second electrode that is electrically connected to an associated second-axis line, and a bypass bridge that electrically isolates the associated second-axis line from the associated first-axis line.

Abstract: A charge amplifier that converts a charge signal to a voltage signal includes: a first conductive member through which the charge signal propagates; a second conductive member that is provided along at least a portion of the first conductive member; an insulating member provided between the first conductive member and the second conductive member; a potential controlling voltage signal output circuit that is connected to the second conductive member, and is configured to supply a potential controlling voltage signal to the second conductive member; and an integrating circuit that includes an input terminal and an output terminal, the input terminal being connected to the first conductive member, and is configured to output the voltage signal from the output terminal.

Abstract: The wireless capacitive load cell features a two-component strain member has a spring body and force transduction plate, which deforms when a load is applied to the structure. During loading, the force transduction plate moves the cantilever spring body out of a position of rest, which results in an indenter, located within the force transduction plate, contacting a capacitive transducer. The capacitive transducer converts deformation of the strain member into an electrical signal which is correlated to a specific load value. The microelectromechanical system that accompanies the capacitive transducer processes and prepares the signal for wireless transmission. The microelectromechanical system has a capacitive transducer, signal conditioner, microcontroller unit, and telemetry system. Additional embodiments of the wireless load cell may include acceleration and temperature sensors embedded within the microelectromechanical system.

Abstract: A torque sensor module for a steering device may include: a stator fixed to a designated position of a steering shaft and configured to detect a steering angle; a rotor rotatably fixed in the stator; a signal transmitter configured to transmit torsion information between the stator and the rotator to a Hall effect IC sensor (Hall IC); a printed circuit board having the signal transmitter and the Hall IC mounted thereon; and an ECU (Electronic Control Unit) of an EPS (Electronic Power Steering), mounted on the printed circuit board.

Abstract: The invention relates to a load detection unit having a spring-elastic load carrier assembly for receiving the load (10) and a sensor (3) for the deformation of the load carrier assembly, which occurs under the load (10) that is to be detected, wherein a deformation transmission unit (6) is operatively arranged between the load carrier assembly and the sensor (3). A method, in which additionally a deformation transmission unit is used, is thus provided, which during operation picks up the deformation of the load carrier assembly and transmits it to the sensor as a changed force/path load.

Abstract: In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.

Abstract: The invention relates to uplift testing apparatus and method used to provide a quality control test to confirm adequate bonding by the mortar or adhesive to the tile and underlayment or mechanically attached tile roof systems, and, more particularly it is a direct tensile load that is applied by pulling up on the edge of the tile by using a tile testing scale.

Abstract: The invention relates to a method for the mechanical testing of a structure (1, 10) formed as one part, comprising the following steps: a) identifying a sub-element (2, 11) in the structure (1, 10) formed as one part for generating a test element (3, 3?) that is intended to undergo mechanical testing, wherein the sub-element (2, 11) only represents a portion of the structure (1, 10) formed as one part, b) determining the spatial-geometrical structure of the sub-element (2, 11), c) generating the test element (3, 3?) on the basis of the spatial-geometrical structure of the sub-element (2, 11) and at least in part or in full by way of a 3D printing process, d) carrying out at least one mechanical test on the test element (3, 3?) generated.

Abstract: A sensor includes a permanent magnet mounted on a shaft, a magnetic yoke, a magnetism collecting ring, a circuit board, and a sensor housing through which the shaft is inserted. The sensor housing has a box-shaped accommodating chamber accommodating at least the circuit board via an opening that opens in a direction crossing an axial direction of the shaft. A reinforcing member connecting two wall surfaces of the accommodating chamber that face each other in the axial direction of the shaft is provided in the accommodating chamber.

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspect, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.

Abstract: Provided herein are: a movable part that is provided with coils placed correspondingly to magnets arranged in an arc shape, a pressure sensor, vertical-side hydrostatic pads, and a lateral-side hydrostatic plate and lateral-side hydrostatic pads caused to move in a manner matched to the shape of the magnets; and a stationary part that is provided with a base on which the magnets and vertical-side hydrostatic plates being opposite to the vertical-side hydrostatic pads are placed, a wall on which a lateral-side hydrostatic pad being opposite to the lateral-side hydrostatic plate is placed, a wall on which a lateral-side hydrostatic plate being opposite to the lateral-side hydrostatic pads is placed, and a wall to which an actuator coupled to the pressure sensor through a ball joint.

Abstract: The present application relates to a touch sensor with multifunctional layers and an intelligent robot. The touch sensor comprises a plurality of sensor units. Each of the sensor units comprises regions contained in four multifunctional layers. The first multifunctional layer and the third multifunctional layer are higher than the second multifunctional layer and the fourth multifunctional later, and the distance from the center of the first multifunctional layer to the center of the third multifunctional layer is greater than the distance from the center of the second multifunctional layer to the center of the fourth multifunctional layer. The first multifunctional layer and the third multifunctional layer form a capacitor C1, and the second multifunctional layer and the fourth multifunctional layer form a capacitor C2.

Abstract: A force sensor includes a first member, a second member, an intermediate member, a first elastic structure that couples the first member and the intermediate member, a second elastic structure that couples the second member and the intermediate member, and a displacement detector that measures displacements of the first member and the second member. It is possible to provide a force sensor that has high detection precision and that is compact.

Abstract: Sample holder for a material testing device, said sample holder comprising: —a holder body having an end face defining a plane; —a sample plate arranged at said end face of the holder body and arranged to receive a sample; —a clamping arrangement. According to the invention, said clamping arrangement comprises a clamping ring comprising:—a cylindrical portion sized to fit over said holder body; —an annular flange extending inwardly from an extremity of the cylindrical portion; —a plurality of resilient tongues extending inwardly from said annular flange; —a plurality of helical slots distributed around the cylindrical portion and each arranged to interact with a corresponding stud provided on said holder body, each helical slot comprising a plurality of notches provided at the edge of the slot situated away from the flange.

Abstract: The invention relates to an optical fiber sensing device (1) for sensing the distribution of the compression/deformation of a compressible/deformable element (2), comprising: an incompressible/undeformable tubular element (3) with a recess (4) extending in a length direction (X) thereof, the recess being enclosed by the tubular element, an optical fiber (5) arranged in the recess, comprising one or more light distortion structures (6), and being expandable in the length direction of the recess, one or more expandable elements (8), having a higher compressibility/deformability than the tubular element in a transverse direction (Y), arranged at one or both ends (9) of the tubular element, the optical fiber being enclosed in the expandable elements, which are arranged for expanding/contracting in the length direction, along with the optical fiber, when the expandable elements are subjected to a transverse load (F).

Abstract: A method comprises: patterning a substrate, including a conductive region, with photoresist exposed by lithography, where the substrate is mounted on a handle substrate; forming a comb structure with conductive fingers on the substrate by at least removing a portion of the conductive region of the substrate; removing the photoresist; forming, one atomic layer at a time, at least one atomic layer of at least one conductor over at least one sidewall of each conductive finger; attaching at least one insulator layer to the comb structure, and the substrate from which the comb structure is formed; and removing the handle substrate.