Abstract: The disclosure provides a low-density PVC plastics flooring and a preparation method thereof, which belongs to the technical field of films for floor. The disclosure provides a low-density PVC plastics flooring, which is prepared from components including, in parts by mass, 100 parts of PVC, 300-380 parts of calcium carbonate, 7-12 parts of a stabilizer, 2-8 parts of processing aid ACR, 12-16 parts of a foaming regulator, 0.1-0.5 parts of a foaming agent, 2-4 parts of G60 lubricant, and 2-4 parts of PE wax. In the disclosure, the density of the PVC plastics flooring is reduced to 1.4-1.6 g/cm3 even increasing the amount of calcium carbon, thereby greatly reducing the production cost and improving the economic efficiency.

Abstract: A processing method of natural rubber latex using creaming includes the following steps: adding a surfactant, a pH adjuster, and deionized water to natural rubber latex, adding a preservative and a creaming agent, mixing and standing a resulting mixture until phase separation occurs, and collecting an upper rubber latex phase and a lower skim latex phase, separately; diluting the upper rubber latex phase with deionized water, adding a preservative, a pH adjuster, a surfactant, and a creaming agent, mixing and standing a resulting mixture until phase separation occurs, and collecting an obtained upper rubber latex phase; and adding a preservative, a pH adjuster, a surfactant, and a creaming agent to an obtained lower skim latex phase, mixing and standing a resulting mixture until phase separation occurs, and collecting an obtained upper rubber latex phase.

Abstract: A Curable Silicone Composition, Encapsulant And Optical Semiconductor Device provides a curable silicone composition having excellent storage stability at room temperature. A curable silicone composition having (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one siloxane unit represented by SiO4/2; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule; (C) an alkyne group-containing compound; and (D) a curing catalyst, wherein the content of the resinous alkenyl group-containing organopolysiloxane (A) is 20 mass % or more based on the total mass of the organopolysiloxane components.

Abstract: The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.

Abstract: A method for forming a polymer-filler composite having advantageous bound filler content, the method comprising (a) providing a guayule cement; (b) introducing particulate filler to the guayule cement to form a solution masterbatch; and (c) desolventizing the solution masterbatch to form a polymer-filler composite.

Abstract: A plasticizer composition contains a compound according to the following formula (I) wherein the radicals R1, R2 and R3 are each independently selected from n-pentyl, 2-methylbutyl and 3-methylbutyl. The plasticizer composition can be used as plasticizer for polymers and a corresponding plastic composition contains the plasticizer composition.

Abstract: A composite material including a nanocellulose core and a metal shell is provided. The metal shell covers a surface of the nanocellulose core. The composite material is nanosized and has high mechanical strength. Additionally, a method of manufacturing the composite material is also provided.

Abstract: Provided is a resin composition that is capable of producing a cured product having excellent environmental suitability, high strength, and excellent flame retardancy, and that is suitably usable as a matrix resin for fiber-reinforced plastics. A resin composition contains (A) an epoxy resin, (B) a cyanate resin, (C) an aromatic amine curing agent that is liquid at 25° C., and (D) a phosphorus-containing compound represented by formula (1). Preferably, in formula (1), R1 and R2 each independently represent an alkyl group or an aryl group, and X and Y are an oxygen atom.