Abstract: Systems and methods for uniquely identifying fluid-phase products by endowing them with fingerprints composed of dispersed colloidal particles, and by reading out those fingerprints on demand using Total Holographic Characterization. A library of chemically inert colloidal particles is developed that can be dispersed into soft materials, the stoichiometry of the mixture encoding user-specified information, including information about the host material. Encoded information then can be recovered by high-speed analysis of holographic microscopy images of the dispersed particles. Specifically, holograms of individual colloidal spheres are analyzed with predictions of the theory of light scattering to measure each sphere's radius and refractive index, thereby building up the distribution of particle properties one particle at a time. A complete analysis of a colloidal fingerprint requires several thousand single-particle holograms and can be completed in ten minutes.

Abstract: An optical system including an enclosure including a front end and a rear end, a first pair of apertures configured to be disposed on a front plane on the front end of the enclosure and a single optical lens system disposed between the front end and the rear end of the enclosure, wherein the first pair of apertures are configured to allow sets of light rays into the enclosure through the single optical lens system to be cast on an image plane as first and second spots, the image plane being parallel to the front plane, if the first and second spots are concentrically disposed, the sets of light rays are determined to be parallelly disposed with respect to one another, otherwise the sets of light rays are determined to not be parallelly disposed with one another.

Abstract: Provided is a method of evaluating electrode quality, which includes: providing a plurality of electrodes which include a current collector and an active material layer formed on the current collector and have not been roll-pressed; measuring a color coordinate value of the active material layer of each of the plurality of electrodes using an optical instrument and calculating an average value; and evaluating the electrodes as good products when a difference between the color coordinate value measured from the individual electrodes and the average value is no more than a predetermined value and as defective when the difference exceeds the predetermined value.

Abstract: A method includes: determining height Z1 of a focus by an optical microscope having autofocus function which uses irradiation light of wavelength ?0 to adjust the focus; determining a wavelength ?1 of irradiation light used for obtaining observation image of second thin film; obtaining observation image of second thin film by using irradiation light of the wavelength ?1, while altering heights of the focus with the Z1 as reference point; calculating standard deviation of reflected-light intensity distribution within the observation image, obtaining height Z2 of the focus corresponding to a peak position where standard deviation is greatest, and calculating a difference ?Z between Z1 and Z2; correcting the autofocus function with ?Z as a correction value; and using the corrected autofocus function to adjust the focus, obtaining the observation image of the second thin film, and calculating the film thickness distribution from the reflected-light intensity distribution within the observation image.

Abstract: A method for determining properties of a sample (12) by ellipsometry includes positioning the sample (12) in an ellipsometer (10) so that a surface normal (n) of a measurement region of the sample surface is tilted relative to a reference axis (z) of the ellipsometer (10) and measuring a Mueller matrix for the measurement region. The method then includes creating an equation system by equating the measured Mueller matrix and a matrix product formed of: a rotation matrix about an input rotation angle (?); an isotropic Mueller matrix in normalized NCS form and a rotation matrix about an output rotation angle (??). The method then solves the equation system for the parameters representing the sample properties to be determined. The input rotation angle (?) and the output rotation angle (??) are set as parameters independent of one another when setting up the equation system.

Abstract: Disclosed are methods and systems correcting bulk-motion artifacts in phase-based functional OCT images. The disclosed methods and systems are based on the use of the standard deviation of the phase shift signal present in phase-based OCT imaging. When applied with functional OCT techniques such as OCT angiography, Doppler OCT, and OCT elastography, the disclosed methods provide improved image quality and decreased computational cost compared to other methods of bulk motion compensation.

Abstract: An optical system may include a light source to provide a beam of light. The optical system may include a reflector to receive and redirect the beam of light. The optical system may include a light gate having an opening to permit the beam of light, from the reflector, to travel through the opening. The optical system may include a light sensor to receive a portion of the beam of light after the beam of light travels through the opening, and convert the portion of the beam of light to a signal. The optical system may include a processing device to determine whether a notch of a wafer is in an allowable position based on the signal.

Abstract: A light source device includes a semiconductor laser that has a first end surface and a second end surface parallel to each other and forming a first resonator, and an optical system that is disposed on an optical path of laser light emitted from the semiconductor laser, that forms a second resonator with the second end surface of the semiconductor laser, and that has a reflection characteristic in which a reflectance with respect to light having a previously specified wavelength width centered at a specified center wavelength of the semiconductor laser is higher than the reflectance of the first end surface.

Abstract: An apparatus includes a photonic integrated circuit, which includes at least one splitter configured to split at least one input beam into multiple input beamlets and multiple phase modulators configured to phase-shift at least some of the input beamlets. The apparatus also includes an array of optical amplifiers configured to amplify the phase-shifted input beamlets and generate amplified beamlets. The apparatus further incudes a beam combiner configured to combine the amplified beamlets and generate an output beam. In addition, the apparatus includes a controller configured to control the phase modulators in order to adjust phasing of the phase-shifted input beamlets.

Abstract: A measurement system includes an atomizer, an impactor, a particle counter, and a discharge reservoir. The atomizer has a liquid intake port and a gas intake port configured to aerosolize a liquid received at the liquid intake port. The impactor has an inlet coupled to the atomizer and has a first output port and a second output port. The impactor is configured to separate droplets wherein those droplets smaller than a selected cut point are directed to the first output port and those droplets larger than the selected cut point are directed to the second output port. The particle counter is coupled to the first output port and is configured to count particles larger than at least one particle size cut point. The discharge reservoir is coupled to the second output port.

Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.

Abstract: Holographic Video Microscopy analysis of non-spherical particles is disclosed herein. Properties of the particles are determined by application of light scattering theory to holography data. Effective sphere theory is applied to provide information regarding the reflective index of a sphere that includes a target particle. Known particles may be co-dispersed with unknown particles in a medium and the holographic video microscopy is used to determine properties, such as porosity, of the unknown particles.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for a rotating optical reflector. Optical systems may have a limited field of view, and so in order to expand the area that the optical system collects data from, the field of view of the optical system may be scanned across a target area. The present disclosure is directed to a rotating optical reflector, which includes a transmissive layer which refracts light onto a reflective layer, which has a normal which is not parallel to the axis about which the optical reflector is rotated. The optical reflector may be both statically and dynamically balanced, which may allow an increased size of the optical reflector, which in turn may increase the aperture of an optical system (e.g., a lidar system) using the rotating optical reflector.

Abstract: An apparatus for measurement of Thomson scattering signals from a plasma includes a light emitting device, configured to emit a light beam into the plasma, along an axis. In addition, the apparatus includes a collector configured to collect the Thomson scattering from the plasma at an angle less than 90 degrees from the axis of the light beam. Further, the apparatus includes a sensor assembly to detect the Thomson scattering.

Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.

Abstract: A spectral-characteristic acquisition apparatus and a method of obtaining spectral characteristics. The spectral-characteristic acquisition apparatus includes a conveyor including a first conveyance roller pair disposed in a conveyance direction in which an object is conveyed and a second conveyance roller pair disposed downstream from the first conveyance roller pair in the conveyance direction, a sensor to detect that the object has reached the second conveyance roller pair, circuitry to control the second conveyance roller pair to drive by a predetermined amount with a driving force greater than a driving force of the first conveyance roller pair upon detecting that the object has reached the second conveyance roller pair by the sensor and to stop driving, and a color data obtainer to obtain color data from the object at a position where the object stops moving. In the spectral-characteristic acquisition apparatus, the circuitry estimates a spectral characteristic of the object.

Abstract: A protective film thickness measuring method includes a step of applying light to a top surface of a wafer in a state in which no protective film is formed and measuring a first reflection intensity of the light reflected from the top surface, a step of forming the protective film including a light absorbing material, a step of irradiating the protective film with exciting light of a wavelength at which the light absorbing material fluoresces and measuring a second reflection intensity including fluorescence of the protective film and the light reflected from the top surface, and a step of excluding reflection intensity of patterns formed on the top surface, by subtracting the measured first reflection intensity from the measured second reflection intensity, and calculating fluorescence intensity of the protective film.

Abstract: In some examples, a wafer bow measurement system comprises a measurement unit including: a wafer support assembly to impart rotational movement to a measured wafer supported in the measurement unit; an optical sensor; a calibration standard to calibrate the optical sensor; a linear stage actuator to impart linear direction of movement to the optical sensor; a wafer centering sensor to determine a centering of the measured wafer supported in the measurement unit; and a wafer alignment sensor to determine an alignment of the measured wafer supported in the measurement unit.

Abstract: A method includes identifying, by pre-set criteria, a first plurality of optical channels and a second plurality of optical channels using optical data generated from a plurality of optical filters of a tester tool. The method also includes determining, from the optical data, a first plurality of fluid types detected by each channel in the first plurality of optical channels using a bootstrap fluid identification technique and determining, from the optical data and the first plurality of fluid types, a second plurality of fluid types detected by each channel in the second plurality of optical channels using a guided fluid identification technique. Further, the method includes generating a spectral signature indicating fluid types for each channel within the tester tool based on the first plurality of fluid types and second plurality of fluid types.

Abstract: A spectrometer is provided. In one implementation, for example, a spectrometer comprises an excitation source, a focusing lens, a movable mirror, and an actuator assembly. The focusing lens is adapted to focus an incident beam from the excitation source. The actuator assembly is adapted to control the movable mirror to move a focused incident beam across a surface of the sample.