Patents Examined by P. Ghosh
  • Method of achieving selective inhibition and control of adhesion in thick-film conductors
    Patent number: 5122929
    Abstract: A technique for providing controlled adhesion of a portion of a printed conductor to a circuit board employs an inhibitor layer between the circuit board and the portion of the printed conductor where such controlled adhesion is desired. The inhibitor layer is formed using a mixture of finely divided alumina powder and a glass frit, which are both suspended in an organic screening agent. An electrical module connected between controllably adherent conductor portions is thereby able to move to relative mechanical stresses.
    Type: Grant
    Filed: January 17, 1989
    Date of Patent: June 16, 1992
    Assignee: Delco Electronics Corporation
    Inventors: Ponnusamy Palanisamy, Dwadasi H. R. Sarma, John A. Hearn, Dwight L. Schwarz