Patents Examined by P. Hassanzadef
  • Patent number: 6923886
    Abstract: The present invention relates to an improved apparatus for plasma treatment of golf ball surface. The improved apparatus comprises a cylindrical basket shaped rotating tumbler made from aluminum sheet metal that holds a plurality of golf balls within a sealed casing for surface preparation. A staggered hole pattern yields about 57% of open area in the tumbler surface to insure evacuation with minimum resistance. The holes are individually machined and have machined radiuses at each side of the sheet metal to allow for adequate coverage of a hard anodic coating which is necessary for protection of the sheet metal from the high intensity plasma.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: August 2, 2005
    Assignee: Acushnet Company
    Inventor: William Brum
  • Patent number: 6863020
    Abstract: An electrode assembly (50) and an associated plasma reactor system (10) and related methods for a variety of plasma processing applications. The electrode assembly provides control of a plasma density profile (202) within an interior region (30) of a plasma reactor chamber (20). The electrode assembly includes an upper electrode (54) having a lower surface (54L), an upper surface (54U) and an outer edge (54E). The lower surface of the upper electrode faces interior region of the plasma chamber housing the plasma (200), and thus interfaces with the plasma. The electrode assembly further includes a segmented electrode (60) arranged proximate to and preferably substantially parallel with the upper surface of the upper electrode. The segmented electrode comprises two or more separated electrode segments (62a, 62b, . . . 62n), each having an upper and lower surface. Each electrode segment is spaced apart from the upper electrode upper surface by a corresponding controlled gap (Ga, Gb, . . . Gn).
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: March 8, 2005
    Assignee: Tokyo Electron Limited
    Inventors: Andrej S. Mitrovic, Wayne L. Johnson
  • Patent number: 6761128
    Abstract: In a plasma treatment method of and apparatus for treating the surface of a treatment target substrate by utilizing glow discharge produced by supplying high-frequency power into an inside-evacuated reactor through a high-frequency power supply means, a plurality of impedance regulation means for regulating impedances on the side of the reactor and on the side of the high-frequency power supply means are provided correspondingly to the impedances of a plurality of reactors, and the high-frequency power is supplied into the reactors via the impedance regulation means corresponding to the reactors. Plasma treatment can be made in a good efficiency and a low cost on a plurality of reactors having different impedances.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: July 13, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toshiyasu Shirasuna, Tatsuyuki Aoike, Kazuyoshi Akiyama, Hitoshi Murayama, Takashi Otsuka, Daisuke Tazawa, Kazuto Hosoi, Yukihiro Abe
  • Patent number: 6321681
    Abstract: A plasma processing apparatus comprises a processing chamber having at least one opening for receiving field energy by inductive coupling, and at least one field energy source arranged to induce the field energy into the chamber via the corresponding opening. The field energy source comprises an inductor device associated with a magnetic core. The magnetic core forms a closure and gas seal for the corresponding opening.
    Type: Grant
    Filed: September 20, 1999
    Date of Patent: November 27, 2001
    Assignee: European Community (EC)
    Inventors: Pascal Colpo, François Rossi, Jean-François Daviet, Roland Ernst
  • Patent number: 6210483
    Abstract: The invention provides an apparatus for excluding unwanted deposition at the edge of a substrate which prevents excess purge gas from flowing over the surface of the substrate at the region adjacent a notch on a substrate. Another aspect of the invention provides a wider purge gas channel that prevents excess purge gas from flowing over the surface of the substrate. Still another aspect of the present invention provides a purge gas guide that includes a notch therein to prevent excess purge gas from adversely affecting deposition at the vicinity of the substrate notch.
    Type: Grant
    Filed: December 2, 1998
    Date of Patent: April 3, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Ken Tsai, Steve Ghanayem, Joseph Yudovsky, Ken Lai