Patents Examined by P. J. Ryan
  • Patent number: 4908258
    Abstract: A high capacitance flexible dielectric sheet material is comprised of a monolayer of multilayer or single layer high dielectric (for example ceramic) chips or pellets of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive to define a cohesive sheet with the polymer binding the array of high dielectric (for example ceramic) chips together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces. The end result is a relatively flexible high capacitance dielectric film or sheet material which is drillable, platable, printable, etchable, laminable and reliable.
    Type: Grant
    Filed: August 1, 1988
    Date of Patent: March 13, 1990
    Assignee: Rogers Corporation
    Inventor: Jorge M. Hernandez
  • Patent number: 4908259
    Abstract: This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after the roughing of the surface of the primary molded article, and then, the molded article is inserted into the mold and molded so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal.
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: March 13, 1990
    Assignee: Sankyo Kasei Kabushiki Kaisha
    Inventor: Tetsuo Yumoto
  • Patent number: 4908251
    Abstract: A reinforcement type porous sheet comprising(a) a laminated sheet comprising a hot melt type porous sheet and a plastic porous sheet, and(b) a porous substrate bonded to the hot melt type porous sheet.
    Type: Grant
    Filed: September 1, 1987
    Date of Patent: March 13, 1990
    Assignee: Nitto Denko Corporation
    Inventors: Mituo Iimura, Masatoshi Heguri, Satoru Gunji, Kenji Ikehara
  • Patent number: 4906511
    Abstract: Disclosed is an aluminum nitride circuit board which is advantageously used as a carrier for a part emitting a large volume of heat, the substrate of the circuit board is a sintered aluminum nitride substrate which comprises a basal part and projection rising from the basal part and offering a surface for application of a metallizing composition, a metallized layer thereof is formed on the upper side of the projection by applying the metallizing composition thereon and forming the applied layer of the composition by firing, the metallizing composition applied on the upper side of the projection is prevented from sagging down the lateral side of the basal part owing to the step formed with the projection and the basal part, the preclusion of the otherwise inevitable sagging of the composition contributes greatly to improving the circuit board's voltage withstanding property.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: March 6, 1990
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideki Sato, Masakazu Hatori, Nobuyuki Mizunoya
  • Patent number: 4906512
    Abstract: An electrical multilayer component comprising a sintered monolithic body and a method for the manufacture of the component.The sintered monolithic ceramic body of the electrical multilayer component includes cavities which alternate between layers, and are open toward end faces which are on opposite sides. The cavities also open toward lateral surfaces of the ceramic body over their entire lengths. The cavities contain ceramic particles which are distributed therethrough to act as supporting elements and are completely filled with a metal or metal alloy whose melting temperature is considerably lower than the sintering temperature of the ceramic body. The metal or alloy has the property of wetting the surfaces of the ceramic layers in the cavities in the molten condition. Contact elements are then applied to the end faces, the contact elements being impervious to the metal melt. Spaces free of metal are present in the cavities at the lateral surfaces of the ceramic body.
    Type: Grant
    Filed: June 17, 1988
    Date of Patent: March 6, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventor: Erich Roess
  • Patent number: 4906462
    Abstract: A deodorant composition comprising (A) an acidic phosphoric acid compound and (B) a copper compound and as desired, (C) a reducing agent, and a deodorant composite material comprising a substrate and the deodorant composition included therein.
    Type: Grant
    Filed: November 10, 1987
    Date of Patent: March 6, 1990
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Yoshiaki Miki, Tsunehisa Ueda, Tadao Natsuume
  • Patent number: 4906498
    Abstract: A flexible optical recording material in the shape of tape or floppy disk comprising an optically isotropic laminate (A) comprising at least one thermoplastic gas-impermeable synthetic resin film layer (1) and at least one cured crosslinking resin layer (2), said layers having been formed by casting and having a retardation value of not less than 80 nm as a whole, and a recording layer (B) disposed on at least one side of said optically isotropic laminate.
    Type: Grant
    Filed: August 26, 1988
    Date of Patent: March 6, 1990
    Assignee: Fujimori Kogyo Co., Ltd.
    Inventors: Rinjiro Ichikawa, Toshio Ishida
  • Patent number: 4906515
    Abstract: There are disclosed (1) an injection-molded thermoplastic resin article having on a surface thereof a copper foil or a copper foil circuit, wherein the thermoplastic resin comprises one of polycarbonate, polyethersulfone, and polyetherimide and an adhesive layer comprising polyvinyl butyral having a degree of polymerization of up to 1000, polyvinyl formal having a degree of polymerization of up to 1000, or a mixture or both polymers is formed either the copper foil or the copper foil circuit and the molded thermoplastic resin and (2) a process for producing such injection-molded thermoplastic resin articles.
    Type: Grant
    Filed: October 13, 1988
    Date of Patent: March 6, 1990
    Assignee: Nitto Boseki Co., Ltd.
    Inventor: Hirokazu Inoguchi
  • Patent number: 4904515
    Abstract: A semiconductor element heat-treatment member has a Si-SiC body and a SiO.sub.2 coating formed on the surface of the Si-SiC body so as to cover the Si-SiC body. The SiO.sub.2 coating has a thickness ranging between 20.ANG. and 100,000.ANG..
    Type: Grant
    Filed: May 27, 1988
    Date of Patent: February 27, 1990
    Assignee: Toshiba Ceramics Company, Limited
    Inventors: Shuitsu Matsuo, Yoshinobu Tanada, Yasumi Sasaki
  • Patent number: 4902548
    Abstract: This invention concerns a reinforcing member intended to be incorporated to a resin. This member (1) comports a layer made of high strength filament materials combined with visco-elastic elastomer filaments with high damping properties. This member is applicable to composite structures which may enter into vibration.
    Type: Grant
    Filed: September 26, 1988
    Date of Patent: February 20, 1990
    Assignee: Atomic Skifabrik A. Rohrmoser
    Inventors: Gerard Cholat-Serpoud, Franz Scherubl
  • Patent number: 4902555
    Abstract: Disclosed herein is a hybrid circuit element including a redox electrial element formed with redox materials such as biomaterials or pseud-biomaterials and a semiconductor element together with the redox electric element. The redox electrical element and the semiconductor element are provided to a common substrate and they are electrically connected to each other with electrical conductors.
    Type: Grant
    Filed: July 13, 1987
    Date of Patent: February 20, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Satoru Isoda, Osamu Tomisawa, Hiroaki Kawakubo
  • Patent number: 4902364
    Abstract: A metallized laminate and process of manufacture wherein a metallic layer or underlying ink layer appears in a pattern on the laminate. The method in a specific embodiment involves the steps of forming a laminate by coating a heat stable release coat onto a carrier sheet; coating an ink layer in a pattern on the heat stable release coating so that at least portions of the release coat remain uncovered with ink, and applying a metallic layer over the release coat so that at least a portion of the metallic layer is in direct contact with and adheres directly to the release coat. Portions of the metallic layer may be removed by an etchant. A heat activatable adhesive layer is applied over the metallic layer. The laminate so formed is heat transferable from the carrier sheet to an article.
    Type: Grant
    Filed: August 2, 1988
    Date of Patent: February 20, 1990
    Assignee: Dennison Manufacturing Company
    Inventors: Tim Parker, Dennis R. Benoit
  • Patent number: 4902554
    Abstract: In that a vulcanized rubber article (8), preferably of sheet or plate form and preferably having a relief pattern, in at least part of its surface, integrated in any surface area, inserted or settled into same, has been provided and vulcanized together with a rubber material (6) in the form of letters, signs, and digits in at least one color deviating from the rubber article (8) color composition, and that the rubber material (6) has a vulcanizing temperature range matching that of the rubber article (8), a hardwearing and washproof as well as distinct marking of the rubber article is obtained. A label to be used for the marking of the rubber article consists of a foil material (10) of a thickness of 10-100 micron upon which using a printing ink (11) of rubber material inverted text, figures and/or pictures have been printed.
    Type: Grant
    Filed: October 13, 1988
    Date of Patent: February 20, 1990
    Assignee: Milliken Research Corporation
    Inventor: Aage Lang
  • Patent number: 4900598
    Abstract: An optical disk comprises a polycarbonate substrate, a first protective layer, formed on the substrate and made of SiO.sub.2, a recording layer, formed on the first protective layer and made of an In-Sb-Te alloy, a second protective layer, formed on the recording layer and made of SiO.sub.2, and a surface protective layer, formed on the second protective layer and made of an ultraviolet curable resin. The recording layer has a composition of In.sub.50-x Sb.sub.50 Te.sub.y Au.sub.Z wherein x, y, and z are in atomic %, x=y+z, y.gtoreq.2z, and 1.ltoreq.x.ltoreq.6), In.sub.50-x Sb.sub.50-x Te.sub.y Au.sub.z (wherein 2x=y+z and 0<x.ltoreq.10), or (In.sub.100-x Sb.sub.x).sub.100-y-z Te.sub.y Au.sub.z (wherein 48.ltoreq.x.ltoreq.52 and 0.05.ltoreq.y+z.ltoreq.5).
    Type: Grant
    Filed: September 6, 1988
    Date of Patent: February 13, 1990
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Katsumi Suzuki
  • Patent number: 4900600
    Abstract: To enable plastic articles to be produced with long fibres, closely folded or coiled inserts are incorporated into the granulates and open up later over their entire length during plastification, thus forming a dense network in the finished plastic article.
    Type: Grant
    Filed: October 16, 1985
    Date of Patent: February 13, 1990
    Assignee: Bayer Aktiengesellschaft
    Inventor: Hans W. Depcik
  • Patent number: 4900601
    Abstract: The multi-layer body member consists of a support member, e.g. a glass fiber tissue impregnated with a thermosetting resin which is covered by a layer of thermosetting adhesive resin. In order to protect the sticky surface of the adhesive resin, a protection foil made of a meterial shrinking under the influence of heat is provided. The foil comprises slits which open to apertures after a preliminary heat treatment such that an essential portion of the sticky resin surface is freely exposed. Thus, the need to remove the protection foil prior to applying the multi-layer body member to the surface to be reinforced is removed.
    Type: Grant
    Filed: June 10, 1988
    Date of Patent: February 13, 1990
    Assignee: Gurit Essex AG
    Inventors: Paul Halg, Paul Rohrer
  • Patent number: 4900602
    Abstract: The invention relates to a printed wiring board (7) which includes at least one carbon resistor (3) formed across terminals (2a, 2b) of printed wiring circuit (2). A heat dissipating film layer (4) is formed at least on the carbon resistor (3). Thus, heat produced in the resistor (3) is effectively dissipated.
    Type: Grant
    Filed: May 9, 1988
    Date of Patent: February 13, 1990
    Assignee: Nippon CMK Corp.
    Inventors: Shin Kawakami, Satoshi Haruyama, Hirotaka Okonogi, Katsutomo Nikaido, Junichi Ichikawa
  • Patent number: 4898762
    Abstract: Film-backed pressure-sensitive adhesive tape that resembles conventional creped paper-backed masking tape but can be torn cleanly with the fingers, is prepared by extruding an isotactic polypropylene film, passing it through the nip between a rubber roll and a water-cooled embossed steel roll at a temperature and rate such that predominantly crystalline film is obtained. The embossed roll imparts a ridge-and-valley configuration to one surface of the film, valleys extending crosswise of the tape and having a depth greater than half the total film thickness. When the smooth face of the film is coated with pressure-sensitive adhesive, the resultant tape can be torn readily, using only the fingers, in a straight line crosswise of the tape. When subjected to a stretching force in the machine direction (at right angles to the ridges and valleys), the tape elongates uniformly without "necking down." A specific embodiment of this invention is a sterilization indicator tape made with the above described film.
    Type: Grant
    Filed: July 1, 1988
    Date of Patent: February 6, 1990
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Josephine S. Brown, Alan J. Sipinen
  • Patent number: 4898776
    Abstract: A synthetic board is prepared by a process of contacting lignocellulosic material with a binder and subsequently forming the treated material into a board by the application of heat and pressure, wherein (a) the binder comprises an organic polyisocyanate and a reactive hydrogen-containing component, especially an aromatic polyester polyol, and (b) the lignocellulosic material is additionally contracted with a surfactant.
    Type: Grant
    Filed: November 21, 1988
    Date of Patent: February 6, 1990
    Assignee: Jim Walter Reasearch Corp.
    Inventors: Michael G. Israel, George A. Grozdits, Kenneth G. Trout
  • Patent number: 4898766
    Abstract: A polymer film with a conductive electrode has an insulated polymer film with an electrically conductive pattern containing an electrically conductive polymer of an aromatic compound, the conductive pattern being formed on at least one major surface of the insulated film, and an internal portion extending from the at least one major surface.
    Type: Grant
    Filed: September 8, 1988
    Date of Patent: February 6, 1990
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Toshiaki Tamamura, Katsuta, Osamu Niwa, Makoto Hikita, Akio Sugita