Abstract: A wafer carrier for growing wafers includes a plate having a first surface and a second surface, a plurality of openings extending from the first surface to the second surface of the plate, and a porous element disposed in each of the plurality of openings, each porous element being adapted to support one or more wafers. The wafer carrier also has a blind central opening extending from the second surface toward the first surface of the plate, and a plurality of shafts extending outwardly from the blind central opening. Each shaft has a first end in communication with the blind central opening and a second end in communication with one of the porous elements for providing fluid communication between the blind central opening and one of the porous elements. Suction is formed at a surface of each porous element by drawing vacuum through the blind central opening and the shafts.

Abstract: A substrate processing apparatus is disclosed. In one embodiment, the apparatus includes a first atmospheric deposition station and a second atmospheric deposition station. The second atmospheric deposition station comprises an atmospheric pressure vapor deposition chamber. A substrate handling system is adapted to transfer substrates between the first and the second atmospheric deposition stations.