Abstract: Printed wiring boards useful for high frequency applications are obtained by laminating a conductive foil pretreated with a silane to a polynorbornene prepreg wherein a sheet of polyolefin film derived from C.sub.2 -C.sub.4 monomers is laminated between the prepreg and the foil to the surfaces of each member. The prepreg is made by impregnating a fiberglass cloth with a ring-opening polymerized polymer. The conductive foil is pretreated with a silane which is capable of improving the bond strength between the conductive foil and a norbornene copolymer.