Abstract: A transport shield is provided for brittle glass and glass ceramic panels susceptible to scratching and fracturing to be integrated into a cooker, in particular as cooking surfaces. The transport shield remains permanently joined to the panel during installation, assembly and operation and is formed to act as a protector during mounting, a positioning aid, a separator, an elongation compensating medium and/or a sealing member and/or an inspection window in profiled panels.

Abstract: A formed aluminum nitride piece is produced by applying a wiring layer-forming metal paste containing such a high melting temperature metal (wiring metal) as tungsten, for example, to an aluminum nitride green sheet and shaping one layer of the aluminum nitride green sheet now bearing the applied metal paste or superposing a plurality of such layers. In this case, a manganese component destined to densify tungsten is incorporated in at least either of the green sheet and the wiring layer-forming metal paste. The manganese component is either manganese as a simple metallic element or such a manganese compound as manganese oxide. Then, the formed aluminum nitride piece is fired to effect simultaneous sintering of an aluminum nitride and tungsten. Owing to the preparatory addition of the manganese component, a complex compound such as a complex oxide containing manganese and tungsten or a complex such as a eutectic alloy of manganese and tungsten is formed in the wiring metal layer.

Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Abstract: The invention concerns a material containing chemical compounds between a metal from group IV A of the periodic system, nitrogen and oxygen. The optical and electrical properties of this material can be set within wide limits by means of small voids, without the need to alter the chemical composition. The material is suitable in particular for use as a selective radiation converter in the solar energy and power industry. Aside from other processes for its manufacture, it can be produced as a thin coating deposited on a substrate by means of reactive evaporation.

Abstract: A stack of two refractory nitride layers and a magnetoresistive layer are used to facilitate electrical connection between components of a sensor. The stack of tantalum nitride and nickel iron layers are disposed over a silicide layer that is, in turn, disposed on a diffusion of conductive material within the body of a silicon layer. A titanium tungsten layer is disposed on the stack and below a subsequent layer of a conductive metal such as aluminum. A silicon nitride passivation layer is disposed over all of the other layers.

Abstract: A measuring electrode and a reference plate are formed on the front and rear surfaces, respectively, of the electrolytic plate. The vent plate is provided with a vent channel. The heater base comprises a heating element. The electrolytic plate is made of a green sheet of zirconium oxide consisting of 5 to 7 molar % Y.sub.2 O.sub.3 and 0 to 5 parts by weight of aluminum oxide. The average particle diameter of the zirconium oxide powder is less than 2.0 .mu.m. The green sheet of zirconium oxide has a thickness of 50 to 300 .mu.m. The heater base is made of a green sheet of aluminum oxide consisting of aluminum oxide powder having an average particle diameter of less than 1.0 .mu.m and 0 to 10 parts by weight of zirconium oxide or yttria-stabilized zirconium oxide. The green sheet of aluminum oxide is at least 4 times the thickness of the green sheet of zirconium oxide. To complete the oxygen sensor, these four components are sintered together at 1300.degree. to 1600.degree. C. to be integrated.

Abstract: A metallization is coated with a network polymer. The network polymer may be either a cross-linked polyfluorinated polyallylether-polyhydromethylsiloxane copolymer or a network polymer formed from cross-linked fluoromethylene cyanate ester monomers. These polymer networks are resistant to the diffusion of a metallization, such as copper, therethrough.

Abstract: This invention relates to a novel computerized laser inlay and inlay printing process. More particularly, this invention pertains to a novel process for engraving by use of computer a first excavated image in an inlay base, and secondly engraving a second corresponding relief image on an inlay wafer, and then inlaying the second relief image of the inlay wafer in the first excavated image of the inlay base.

Abstract: A superconducting wire saved in weight and enhanced in mechanical properties is provided without damaging electric and thermal characteristics as an Al stabilizer, and further a method for producing the same, a high strength Al sintered alloy and powders used for the process are provided. A superconducting wire comprising an Al alloy of a high purity Al in which a small amount of ceramic ultrafine particles are dispersed and superconducting filaments embedded in the Al alloy, in which a large number of the ceramic ultrafine particles are dispersed in the area of 1 .mu.m.sup.2, and the areas of 1 .mu.m.sup.2 in which a large number of the ceramic ultrafine particles are dispersed, are formed over nearly the whole of the alloy.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: A corona electrode, such as a roller electrode, having an outer dielectric layer and an undercoat of a copper layer that permits the electrode to operate at a lower temperature for a specific power input over a similar electrode without the copper undercoat.

Abstract: A layer of glass, and an optically clear or transparent coating layer bonded to at least one surface of the glass layer by an interposed layer of optically clear adhesive having a peel strength of at least 3,000 grams per square inch. The coating layer generally includes a plurality of polymeric plies or strata, which are preferably made of a polyester material. The adhesive layer is preferably a pressure sensitive acrylic resin. The coating layer preferably includes an ultraviolet absorbing polyester ply, a reflective polyester ply which will generally include a metallized surface, and an outermost scratch resistant ply that prevents scratching of the coating layer which will reduce optical transparency. The coating layer may additionally include a protective polyester ply adjacent to the metallized surface of the reflective ply.

Abstract: The present invention is to provide an electrostatic chucking device having improved heat conductivity and at the same time increased adsorption area and improved adsorptity as well as having no uneveness on the wafer-provided face. The electrostatic chucking device of the present invention comprises a metal base, an adhesive layer, an electrode layer comprising a metal-deposited or metal-plated layer, and an electrically insulating layer possessing a face for providing a substance to be adhered by suction, laminated thereon in this order.

Abstract: A coating protective film which comprises a substrate, which is made of a colored polyolefin film and has a maximum per cent transmission of ultraviolet within a wavelength range of 190 to 370 nm of not more than 10%, and a pressure sensitive adhesive layer, which is made of a pressure sensitive adhesive containing as the main component at least one of polyisobutylene, butyl rubber and polybutene, satisfies the requirements for weatherability of protective pressure sensitive adhesive film which is temporarily attached to finished automobiles for the purposes of protection of automotive coating during transfer and storage, and is also so excellent in peelability as not to pollute the coating on the automobiles.

Abstract: A surface structure of a magnetoresistive film involved in a magnetosensitive portion surrounded by a peripheral portion including at least an electrode film and a magnetic film underlying the electrode film for applying a unidirectional magnetic field onto the magnetosensitive portion, side edges of the magnetoresistive film are covered by the magnetic film so as to keep the side edges separate from the electrode film, an insulation film is provided on at least a peripheral area of a top surface of the magnetoresistive film so that a part of the electrode film extends on the insulating film thereby the top surface of the magnetoresistive film is separated by the insulating film from the electrode film so as to keep an effective area of the magnetoresistive film in an actual area thereof.

Abstract: Disclosed is a method of manufacturing a semiconductor device, in which a silicon oxide film containing fluorine, said film exhibiting a low dielectric constant and a low hygroscopicity and acting as an insulating film for electrically isolating wirings included in a semiconductor device, is formed by a plasma CVD method using a source gas containing at least silicon, oxygen and fluorine, under the conditions that the relationship between the gas pressure P (Torr) and the ion energy E (eV) satisfies formula A given below:P.gtoreq.5.times.10.sup.-4, P.ltoreq.10.sup.-1.times.10.sup.-E/45( A)and the relationship between the ion energy E (eV) and the plasma density D (/cm.sup.3) satisfies the formula B given below:D.gtoreq.2.times.10.sup.11.times.10.sup.-E/45, 10 .ltoreq.

Abstract: The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.

Abstract: A superconducting thin film system (10) is provided for high frequency microwave applications where a single crystal high temperature superconducting layer (18) is integrated with a garnet substrate (12). A first perovskite compound buffer layer (14) is epitaxially grown on an upper surface of the garnet substrate layer (12) and defines a lattice constant less than the lattice constant of the garnet substrate layer (12). A second perovskite layer (16) is epitaxially grown on an upper surface of the first perovskite layer (14) and defines a lattice constant less than the lattice constant of the first perovskite layer. A high temperature superconducting layer (18) is epitaxially grown on an upper surface of the second perovskite layer (16) and is lattice matched to the second perovskite compound layer (16) for incorporation of passive components within the high temperature superconducting layer (18) having high frequency microwave applications.

Abstract: A ceramic susceptor with an embedded metal electrode. The metal electrode has multiple apertures, and the ceramic material is cross-linked through the apertures. An electrical connection to the electrode protects the electrode from the environment in the processing chamber. The ceramic may be aluminum nitride, and the metal electrode may be a mesh of molybdenum wires. To form the electrical connection, the susceptor may be heated until an eutectic forms between a conductive connector and the metal electrode. Alternately, a brazing material may be placed between the metal layer and a conductive connector.

Abstract: An electrostatic image-bearing dielectric member comprises a support and a dielectric layer formed on the support. The dielectric layer is formed of at least one of amorphous carbon, diamond-like carbon and diamond. The dielectric layer may contain not larger than 60 atomic percent of at least one of hydrogen and fluorine. An intermediate layer may be provided between the support and the dielectric layer in order to improve the adhesion therebetween.