Abstract: An electrical wire jacketing configuration used in an electrical junction box herein has a body portion in which a recess is formed. The electrical wire jacketing configuration includes a gutter-shaped portion configured to pass an electrical wire therethrough, a slidable engaging portion formed in both end portions of the gutter-shaped portion in the across-the-width-direction, and is slidingly engabeable with a guide portion of the recess, and a projection extending from the gutter-shaped portion toward the recess so as to prevent possible erroneous or wrong attachment of the electrical wire jacketing configuration to the recess. The recess may have a secondary guide portion configured to proceed the projection into the recess such that the projection can engage with the recess. The electrical wire jacketing configuration to which the electrical wire is fixed slidably moves toward the recess in a longitudinal direction of the electrical wire, and thereby mates with the recess.

Abstract: A cable holder includes a pair of holding members that are relatively moved in a predetermined sliding direction to sandwich and hold a cable therebetween. The pair of holding members each include a plurality of guide planes each parallel to the sliding direction and a plurality of sliding contact surfaces parallel to the sliding direction. One of the pair of holding members is guided in the sliding direction by sliding the sliding contact surfaces thereof on the guide planes of the other holding member. The other holding member is guided in the sliding direction by sliding the sliding contact surfaces thereof on the guide planes of the one of the holding members. The pair of holding members are fixed to each other by a frictional force between the sliding contact surfaces and the guide planes in a state of holding the cable.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

Abstract: A connection unit includes: a ceramic substrate; a first signal line on the ceramic substrate; a first grounded conductor on the ceramic substrate and electromagnetically coupled to the first signal line; a first lead pin having a first end connected to an upper surface of the first signal line and a second end protruding beyond the ceramic substrate; a second lead pin having a first end connected to an upper surface of the first grounded conductor and a second end protruding beyond the ceramic substrate; a flexible substrate including an insulating layer through which the first and second lead pins penetrate, a second signal line on a first major surface of the insulating layer and connected to the second end of the first lead pin, and a second grounded conductor on a second major surface of the insulating layer and connected to the second end of the second lead pin.

Abstract: An electric connecting structure comprising preferred oriented Cu6Sn5 grains and a method for fabricating the same are disclosed. The method of the present invention comprises steps: (A) providing a first substrate; (B) forming a first nano-twinned copper layer on part of a surface of the first substrate; (C) using a solder to connect the first substrate with a second substrate having a second electrical pad, in which the second electrical pad comprises a second nano-twinned copper layer, and the solder locates between the first nano-twinned copper layer and the second nano-twinned copper layer; and (D) reflowing at the temperature of 200° C. to 300° C. to transform at least part of the solder into an intermetallic compound (IMC) layer, in which the IMC layer comprises plural Cu6Sn5 grains with a preferred orientation; wherein at least 50% in volume of the first and second nano-twinned copper layer comprises plural grains.

Abstract: A high voltage electric cable including a cable core, a cooling pipe for cooling the cable core including a polymer and adapted for carrying a cooling fluid, and a cable covering enclosing the cable core and the cooling pipe. The electric cable further includes a heat conducting element surrounding the cable core, and being arranged in thermal contact with the cable core and the cooling pipe.

Abstract: A capacitive touch panel sensor in which waviness generated in a film furnished with a transparent electrode pattern can be small. The touch panel sensor according to the present invention includes a first film, a first transparent electrode pattern formed on the first film, a first adhesive layer laminated on the first film so as to cover the first transparent electrode pattern, a second film laminated on the first adhesive layer, a second adhesive layer laminated on the second film, a third film laminated on the second adhesive layer, and a second transparent electrode pattern formed on the third film, wherein Da/Db is 0.5 to 0.9 where a total thickness of the second film and the second adhesive layer is Da, and a distance between the first transparent electrode pattern and the second transparent electrode pattern is Db.

Abstract: A utility box assembly includes a housing structure having an open upper end, a first peripheral channel around the open upper end, and a second peripheral channel disposed below the first peripheral channel and inwardly therefrom. A first sealing element is seated in the first peripheral channel, and a second sealing element is seated in the second peripheral channel. A cover is configured to cover the open upper end. The cover has an outer peripheral portion configured to engage the first sealing element, and a downward-depending flange configured to engage the second sealing element. A liquid-tight seal is provided by the compression of the first and second sealing elements within their channels when the cover is secured to the open upper end of the housing.