Patents Examined by Paul Schwarzenberg
  • Patent number: 9909815
    Abstract: An assembling structure of heat dissipation device includes at least one heat pipe, a first and a second radiating fin assembly. The heat pipe has a heat absorption section, at least one heat releasing section and a curved section between the heat absorption section and the heat releasing section. The heat releasing section is fitted in multiple perforations of the second radiating fin assembly. The curved section is fitted in multiple notches of the first radiating fin assembly. Each notch is defined with an open side and a closed side. The closed side extends along a curved outer side of the curved section and contacts and attaches to the curved outer side of the curved section. Accordingly, the utility ratio of the heat pipe is increased. Also, the heat dissipation area of the heat pipe is increased and the heat dissipation efficiency of the heat dissipation device is enhanced.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: March 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Patent number: 9909814
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: March 6, 2018
    Assignee: KELVIN THERMAL TECHNOLOGIES, INC.
    Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
  • Patent number: 9862252
    Abstract: An engine driven heat pump includes a compressor clutch to switch between an ON state where drive from an engine is transmitted to a compressor and an OFF state where transmission of the drive from the engine to the compressor is cut off, an engine actuation battery to actuate the engine, a battery charging circuit configured to charge the engine actuation battery, and an inverter configured to convert output power from a generator into a predetermined voltage and a predetermined frequency, and when the compressor clutch is placed into the ON state from the OFF state or placed into the OFF state from the ON state during a self-sustaining operation, engine revolutions, which are revolutions of the engine, are set to reference revolutions required for the generator to supply predetermined power.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: January 9, 2018
    Assignee: YANMAR CO., LTD.
    Inventors: Hideshi Okada, Kyoko Hashimoto