Abstract: A light emitting element includes: a sapphire substrate having a front surface and a rear surface opposite the front surface; a first conductive type semiconductor layer stacked on the front surface of the sapphire substrate; a light emitting layer stacked on the first conductive type semiconductor layer; a second conductive type semiconductor layer stacked on the light emitting layer; a reflective layer which contains Ag and is disposed on the rear surface of the sapphire substrate, the reflective layer reflecting light from the sapphire substrate toward the front surface of the sapphire substrate; and an adhesive layer which is interposed between the sapphire substrate and the reflective layer and is made of ITO, the adhesive layer being adhered to the reflective layer.
Abstract: Provided are a fine-particulate organic semiconductor material, a thin organic semiconductor film and an organic transistor. The fine-particulate organic semiconductor material is in a form of fine particles and is usable as an organic semiconductor material. The fine particles are fine thermotropic liquid crystal particles that undergo a phase transition into a liquid crystal state when heated to a temperature of from 50° C. to 350° C. The fine-particulate organic semiconductor material can easily and uniformly form the thin organic semiconductor film over a large area by a film printing process or a dispersion coating process. The thin organic semiconductor film has high electron mobility and high ON/OFF value.
Type:
Grant
Filed:
August 17, 2011
Date of Patent:
December 13, 2016
Assignees:
Shinshu University, Dainichiseika Color & Chemicals Mfg. Co., Ltd.
Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.