Patents Examined by Pete T Lee
  • Patent number: 11189997
    Abstract: A cable fixing device may include: a first bracket fixed to a housing of an in-wheel driving device, and installed in a shape to cover one side of a cable; a second bracket positioned on the other side of the cable, and fixed to the first bracket; and a buffer installed on at least any one of the first and second brackets, and made of an elastic material to distribute stress transferred to the cable.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: November 30, 2021
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Hae Jun Yang
  • Patent number: 11191163
    Abstract: A flexible printed circuit board with improved ground efficiency is disclosed, and a flexible display module and an electronic device comprising the same is disclosed, wherein the flexible printed circuit board comprises a flexible circuit film having a circuit layer disposed on one surface of a base film, and a ground pad portion disposed on another surface of the base film; and a conductive cover member configured to cover the other surface of the base film and electrically connected with the ground pad portion, wherein the conductive cover member includes a cutting portion overlapped with the ground pad portion.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 30, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: TaeWoo Lee, HeeSeok Noh, Sungwook Park
  • Patent number: 11178766
    Abstract: An inner module with a retainer is installed primarily inside a wireless earphone, including a circuit loop, an insulation seat to fix the circuit loop, and at least a retainer. The circuit loop includes at least a first circuit board, and at least a second circuit board which is extended from the first circuit board. The insulation seat includes at least a base plate to enclose the first circuit board, and a first side wall which is extended from the base plate. The first side wall is provided with a first positioning slot to accommodate the second circuit board. The retainer is fixed on the first side wall to fix the second circuit board in the first positioning slot. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: November 16, 2021
    Assignee: CONCRAFT HOLDING CO., LTD.
    Inventors: Chin-Hsing Lee, Jin-Bo Peng, Chang-Hsien Tung
  • Patent number: 11178767
    Abstract: A cylindrical cell includes a. a cylindrical housing enclosing an interior space and composed of a first and a second metal housing part, wherein the housing includes, at its axial ends, a first planar end face and a second planar end face connected to one another by an annular casing, b. a positive electrode and a negative electrode, at least one of which can intercalate and/or deintercalate lithium ions, wherein the positive electrode electrically connects to the first housing part directly or via a separate electrical conductor, and the negative electrode electrically connects to the second housing part directly or via a separate electrical conductor, c. a first contact lug configured as a sheet-metal part that is welded onto the first end face and which has a planar section extending in a plane parallel to the first end face, and d.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: November 16, 2021
    Assignee: VARTA Microbattery GmbH
    Inventors: Marc Oliver Nestle, Sunil Siddannavar
  • Patent number: 11172581
    Abstract: Disclosed herein is a multi-planar circuit board, as well as related structures and methods. In an embodiment, a circuit board may include a first surface, a first section having the first surface in a first plane, a second section having the first surface in a second plane, and a third section connecting the first and second sections, where the third section defines a gradient between the first and second planes, and where all sections are sections within a contiguous board. In another embodiment, circuit board may further include a first component having a first thickness coupled on the first face of the first section, and a second component having a second thickness, greater than the first component, coupled on the first face of the second section, where the second section is in a lower plane, and where the overall thickness is the circuit board thickness plus the second thickness.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: November 9, 2021
    Assignee: Intel Corporation
    Inventors: Eng Huat Goh, Min Suet Lim, Tin Poay Chuah, Han Kung Chua
  • Patent number: 11166366
    Abstract: A heat dissipating circuit board assembly includes a heat sink having a first wall, a second wall spaced from the first wall, and an end wall extending between the first and second walls. The first wall, the second wall, and the end wall collectively define a cavity. The assembly additionally includes a printed circuit board having a first face and a second face opposite the first face. The printed circuit board is located within the cavity such that the first wall of the heat sink extends over the first face and the second wall of the heat sink extends over the second face to allow heat to be transferred from the printed circuit board to the heat sink. The heat sink is configured to interface with a connector socket when the circuit board is connected to the connector socket for stabilizing the printed circuit board.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: November 2, 2021
    Assignee: TRI-Tech International
    Inventor: Richard P. Zirretta
  • Patent number: 11158440
    Abstract: A capacitive power transmission cable (1) having at least two sets of conductive strands (2) and the strands of the sets are distributed in a transverse cross-section of the cable, whereby the two sets are in capacitive relation to each other, wherein preferably, the capacitance is at least 10 nF/m.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: October 26, 2021
    Assignee: Enertechnos Holdings Limited
    Inventors: Mansour Salehi-Moghadam, Gareth O'Brien, Charles Lucas-Clements, Dominic Quennell
  • Patent number: 11160163
    Abstract: An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: October 26, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Snehamay Sinha, Tapobrata Bandyopadhyay, Makarand Ramkrishna Kulkarni
  • Patent number: 11146049
    Abstract: A cable hanger configured to secure cables to a purlin. The cable hanger includes a first support leg, a second support leg, and a landing compartment positioned between the first support leg and the second support leg. The landing compartment is configured to hold one or more cables. The cable hanger further includes a first securing hook connected to the first support leg, and a second securing hook connected to the second support leg. Wherein, the first securing hook and the second securing hook are configured to secure the cable hanger to the purlin.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: October 12, 2021
    Assignee: Hubbell Incorporated
    Inventors: Devan Emily Johnston, Sarah Jane Parsons
  • Patent number: 11144094
    Abstract: A display device includes a lower substrate that includes a side surface having a first inclined surface. An upper substrate is disposed on the lower substrate and includes a side surface having a second inclined surface. A first electrode is disposed on a surface of at least one of the lower substrate or the upper substrate. An auxiliary electrode is disposed on the first inclined surface of the lower substrate and the second inclined surface of the upper substrate. The auxiliary electrode includes a first portion corresponding to the first inclined surface, a second portion corresponding to the second inclined surface, and a bent portion bent at a predetermined angle with respect to the first and second inclined surfaces. The first electrode may be in contact with the bent portion on the first exposed surface to electrically connect to the auxiliary electrode.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: October 12, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Young-Cheol Jeong
  • Patent number: 11133135
    Abstract: The invention provides an input device, including: a substrate, including at least one connecting portion and at least one limiting portion; at least one key, including at least one first engagement portion and at least one second engagement portion located on two opposite sides, where the first engagement portion is in contact with the connecting portion, so that the key can rotate relative to the substrate by taking the connecting portion as a rotation center, and the second engagement portion faces the limiting portion and is spaced apart from the limiting portion; and a buffer unit, disposed on at least one of two surfaces of the limiting portion and the second engagement portion facing each other. By disposing the buffer unit, noise generated due to the collision between the second engagement portion and the limiting portion can be decreased.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: September 28, 2021
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventor: Kuo-Hui Hsu
  • Patent number: 11133659
    Abstract: A recessed floor box system is provided herein. The recessed floor box system includes a housing having a set of walls defining an interior chamber; a riser; a non-use cover; and an in-use cover. The riser is connected to the housing and includes an interior opening connected to the interior chamber. The non-use cover is positioned on the riser and across the interior opening. The in-use cover is positioned on the riser and at least partially defines an egress opening that provides access to the interior opening. The in-use cover includes an upper portion having a substantially planar surface and a lower portion having a latch mechanism to secure the cover over the riser.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: September 28, 2021
    Assignee: Hubbell Incorporated
    Inventors: Joseph Nicholas Cretella, Emircan Matthew Dumani
  • Patent number: 11129995
    Abstract: A metal outer casing part of an implantable medical electronic device contains at least one inner cavity and/or non-conductive inclusion or portion with multiple small cavities and/or non-conductive inclusions which is closed off in a hermetically sealed manner at least towards the housing outer side by a closed metal layer.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: September 28, 2021
    Assignee: BIOTRONIK SE & Co. KG
    Inventors: Daniel Kronmueller, Thomas Sontheimer
  • Patent number: 11129275
    Abstract: A power supply comprises a main circuit board and a multilayer power transmission board electrically coupled to the main circuit board. The multilayer board includes a conductive neutral layer having an inner side, a conductive line layer having an inner side facing the inner side of the conductive neutral layer, and a dielectric medium positioned between the conductive neutral layer and the conductive line layer. The power supply also comprises a first conductive outer layer positioned adjacently to an outer side of the conductive neutral layer, a second conductive outer layer positioned adjacently to an outer side of the conductive line layer, and a conductive plating material positioned within a slot formed in the multilayer power transmission board and covering an interior portion of the multilayer power transmission board facing the slot. The conductive plating material electrically couples the first and second conductive outer layers.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: September 21, 2021
    Assignee: Astec International Limited
    Inventors: Prabou Ranganathan, Norman Oliva
  • Patent number: 11121532
    Abstract: A connector for joining respective axial extremities of associated first and second axial sections of electrical conduit which includes a cylindrical sleeve that has an interior surface and an exterior surface as well as a first axial extremity and a second axial extremity and a geometric axis. The cylindrical sleeve has an exterior surface proximate to the first axial extremity that includes a first peripheral rib extending around the entire circumferential extent of the exterior surface. The first peripheral rib has an outside diameter that is greater than the diameter of the cylindrical sleeve proximate to the first axial extremity. The cylindrical sleeve has an exterior surface proximate to the second axial extremity that includes a second peripheral rib extending around the entire circumferential extent of the exterior surface, the rib has an outside diameter is greater than the diameter of the cylindrical sleeve proximate to the second axial extremity.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: September 14, 2021
    Inventor: Glenn Crewl
  • Patent number: 11114221
    Abstract: A dielectric cover for an insulator and conductor in an electrical distribution includes an insulator cover for covering the insulator, an arm for covering a portion of the conductor extending from under the insulator cover, and an arm adapter for securing the arm to the insulator cover. The arm adapter has a raised outer first rib, and the arm has a raised outer second rib and an inner first groove. The lineman positions the insulator cover and arm adapter over the insulator, such as by using a hotstick. Then, the lineman slides the arm down over the arm adapter so that the first rib enters the first groove to secure the arm to the arm adapter. Retaining pins are then inserted through holes in the insulator cover and arm to secure the dielectric cover over the insulator and conductor. The arm's raised second rib acts as a water dam to prevent flashovers.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: September 7, 2021
    Assignee: Eco Electrical Systems
    Inventor: Michael Lynch
  • Patent number: 11116083
    Abstract: A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: September 7, 2021
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Annie Tay, Mikael Tuominen
  • Patent number: 11114828
    Abstract: An electrical receptacle cover, comprising a cover base, configured to be affixed to an electrical receptacle assembly. The cover base including a base surface having at least one opening configured to be aligned with an electrical receptacle of the electrical receptacle assembly. The cover base includes a base wall disposed about and extending from a perimeter of the base surface and the base surface and the base wall together define a base cavity. There is a cover lid interconnected with the cover base and it is moveable, via a hinge, from an open position, in which the base cavity is exposed, to a closed position in which the base cover is substantially disposed within the base cavity.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: September 7, 2021
    Inventor: Sorin Ioan Mortun
  • Patent number: 11116089
    Abstract: A component assembly that includes a connection between two components, in particular an electronic circuit board and a housing. The connection includes a pin-shaped connector via which the electronic circuit board is held on the housing, and the pin-shaped connector in a passage of the housing being connected to the housing via a housing caulking. The pin-shaped connector, in the area of the housing caulking, includes a recess that cooperates with the housing caulking in such a way that the pin-shaped connecting means is held in the passage.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: September 7, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Andreas Moehrle, Hans-Georg Drotleff
  • Patent number: 11107607
    Abstract: A cable separator includes a body, and the body includes a polycarbonate-based material that is at least a partially foamed. Cables and methods of manufacturing such cables having a separator are also provided.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: August 31, 2021
    Assignee: General Cable Technologies Corporation
    Inventors: Srinivas Siripurapu, Scott M. Brown, Stephen A. Thwaites