Abstract: Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded onto the first layer such that the photonic die is bonded onto the electronic die.

Abstract: A resin composition for primary coating of an optical fiber contains a photopolymerizable compound, a photopolymerization initiator, and a silane coupling agent, wherein the photopolymerizable compound contains a urethane (meth)acrylate and an ultraviolet curable polyrotaxane, and the content of the polyrotaxane is 0.05% by mass or more and 11% by mass or less based on the total amount of the photopolymerizable compound.

Abstract: The MCF of the present disclosure suppresses occurrence of structural abnormality such as air bubbles in the vicinity of a boundary between a marker and a cladding. The MCF includes a glass optical fiber including a plurality of cores, a marker, and a cladding, and a resin coating. On a cross section of the MCF, centers of the plurality of cores and a center of the marker constitute a plane figure having a rotational symmetry of order 1 with respect to a center of the cross section. Moreover, on the cross section, the marker is disposed so as to be located on a circumference of a circle having a center coinciding with the center of the cross section and having the circumference passing through the respective centers of the plurality of cores.

Abstract: Remote measuring and sensing. Some example embodiment related to optical energy harvesting by identification device, such as infrared identification device (IRID devices). Other embodiments relate to RFID device localization using low frequency source signals. Yet still other embodiments related to energy harvesting by RFID in electric fields in both conductive and non-conductive environments.

Abstract: A photonic semiconductor device including a light-emitting component and a photonic integrated circuit is provided. The light-emitting component at least includes a gain medium layer, a first contact layer and a first optical coupling layer stacked to each other. The photonic integrated circuit includes a second optical coupling layer. The light-emitting component and the photonic integrated circuit are stacked in a stacking direction, the first optical coupling layer has a first taper portion, the second optical coupling layer has a second taper portion, and the first taper portion and the second taper portion overlap in the stacking direction. Accordingly, the light emitted from the gain medium layer may be transmitted to the second taper portion from the first taper portion by optical coupling in a short length of an optical coupling path.

Abstract: An optical assembly may comprise an input fiber to provide a beam, a process fiber comprising a ring-shaped outer core surrounded by a cladding, and a first beam shifter arranged to receive the beam from the input fiber and to shift the beam spatially to illuminate the ring-shaped outer core of the process fiber. The optical assembly may further comprise a second beam shifter arranged to receive the beam from the first beam shifter and to add skew to the beam that is launched into the ring-shaped outer core of the process fiber.

Abstract: An optical fiber comprises a glass fiber including a core and a cladding, and a coating resin layer for coating the glass fiber; the coating resin layer has a primary resin layer in contact with the glass fiber for coating the glass fiber, and a secondary resin layer for coating the primary resin layer; the primary resin layer includes a cured product of a first resin composition containing a silicone (meth)acrylate and a photopolymerization initiator; the secondary resin layer includes a cured product of a second resin composition containing a urethane (meth)acrylate and a photopolymerization initiator; and the amount of tin contained in the coating resin layer is 150 ppm or less in a mass ratio.

Abstract: An optical modulator includes a semiconductor substrate and an optical waveguide portion disposed on the semiconductor substrate. A signal contact that extends alongside the optical waveguide portion is disposed on the semiconductor substrate. A first ground line is disposed on the semiconductor substrate spaced away from the signal contact by a first spacing. A second ground line is disposed on the semiconductor substrate spaced away from the signal contact by a second spacing opposite the first ground line. The first spacing is different from the second spacing.

Abstract: Embodiments described herein relate to a method of using an apparatus for forming waveguides. The method includes positioning a substrate at a first rotation angle, exposing the substrate to an ion beam, forming first partial trenches defined by adjacent angled device structures with the first device angle, rotating the substrate to a second rotation angle, exposing the substrate to the ion beam, etching the first partial trenches, and repeating the method from about 1 cycle to about 100 cycles to form a plurality of trenches defined by adjacent angled device structures. The first rotation angle is selected to form one or more angled device structures with a first device angle relative to a vector parallel to the substrate. The ion beam is configured to contact the substrate at a beam angle ? relative to a surface normal of the substrate.

Abstract: An optical device including a waveguide and an electrode is described. The waveguide includes at least one optical material having an electro-optic effect. The electrode includes a channel region and extensions protruding from the channel region. The extensions are closer to a portion of the waveguide than the channel region is.

Abstract: Described herein are systems, methods, and articles of manufacture for a spatially nonuniform scattering profile along its length, whose backscattering signal can be used for sensing even after fiber attenuation increases due to the conditions in the sensing environment. In one embodiment, the fiber has been pre-exposed to the conditions that produce attenuation, and the spatially nonuniform profile compensates for this. Subsequent exposure then results in very little or at least acceptable levels of additional attenuation. An exemplary fiber comprises a fiber length and an optical back scatter along the fiber length greater than a Rayleigh back scattering over the fiber length, wherein the optical back scatter does not decrease along the fiber length by more than 3 dB after exposure to a hydrogen-rich first environment having a given pressure and temperature.

Abstract: An optical device including a waveguide and an electrode is described. The waveguide includes at least one optical material having an electro-optic effect. The electrode includes a channel region and extensions protruding from the channel region. The extensions are closer to a portion of the waveguide than the channel region is. Each extension includes a connecting portion coupled to the channel region and a retrograde portion. The connecting portion is between the retrograde portion and the channel region. The retrograde portion and/or the channel region has a width of not more than one micrometer.

Abstract: A parallel position manipulator includes a top plate, a baseplate and a plurality of prismatic joint actuators. Each actuator includes an actuator joint having five Degrees of Freedom (DOF) at either the base plate or the top plate. When one or more of the actuators extends or contracts, the pivot points, or five DOF actuator joint, of the remaining actuators are allowed to shift in any axis other than that actuator's primary axis of motion.

Abstract: A resin composition for primary coating of an optical fiber includes a photopolymerizable compound and a photopolymerization initiator. The photopolymerizable compound includes a urethane oligomer and an N-vinyl compound represented by the formula (I) below: (where R represents an alkyl group having 1 to 5 carbon atoms).

Abstract: Various embodiments provide alignment devices and methods of manufacturing and methods of using alignment devices. In an example embodiment, an alignment device includes a first substrate comprising inputs at respective input positions, outputs at respective output positions, and waveguides configured to provide optical paths from respective inputs to respective outputs. The respective input positions are fabricated in accordance with an input position array determined based on measured positions of optical fiber cores of optical fibers secured to a coupling element array. The coupling element array comprises a plurality of coupling elements having a respective one of the optical fibers secured therein. Each optical fiber is associated with a respective input and the input position array indicates the position of each respective input. The respective output positions are configured to provide respective optical signals to the respective target locations of the receiving device.

Abstract: An optical semiconductor device includes a first optical device formed on a silicon substrate having a first surface, and a second optical device including a compound semiconductor, mounted on the first optical device, and having a second surface facing the first surface. The first optical device includes a first protrusion that protrudes toward the second surface, and a portion of the second surface makes contact with the first protrusion. In a plan view, the first protrusion is located on an inner side of an outer edge of the second optical device.

Abstract: Various embodiments of the present disclosure are directed towards an optical module comprising an optical modulator device (OMD) for pulse amplitude modulation (PAM) in which the OMD comprises multiple modulator segments. A first modulator segment and a second modulator segment are spaced from each other along a ring-shaped waveguide. Further, a length of the second modulator segment is twice a length of the first modulator segment. As such, a power factor of the second modulator segment is twice a power factor of the first modulator segment. During use of the OMD, the first and second modulator segments are driven by separate non-return-to-zero (NRZ) electrical signals. The NRZ electrical signals are generated by a driver, which generates the NRZ electrical signals so as to coordinate operation of the first and second modulator segments to generate a PAM optical signal.

Abstract: A resin composition for secondary coating of an optical fiber includes a photopolymerizable compound including a urethane (meth)acrylamide, and a photopolymerization initiator. The urethane (meth)acrylamide has a (meth)acrylamide group at at least one end of a urethane bond.

Abstract: An all-optical-fiber device (optionally produced with the use of laser machining) containing constituent optical fiber components in which the corresponding ends are segmented (and—in one specific case—quartered) and optionally tapered (while portions of the original cores and claddings are maintained) and operationally joined back to form an aggregate end of the device with the round aperture and the corresponding round facet. The end of the device may be cooperated with a quadrant detector for automatic guidance that is based on steering the output light, that was launched into the round facet and propagated through the device, toward the quadrant with the strongest signal in iterations until the signal in each quadrant of the detector is substantially balanced. Constituent optical fiber component(s) and overall detection system and method for manufacture and/or use of same.

Abstract: A semiconductor structure has a substrate and a thermally-tunable photonics device in or over the substrate. A tantalum nitride (TaN) resistive heater is over the substrate and proximate to the thermally-tunable photonics device. The TaN resistive heater is configured to tune the thermally-tunable photonics device.