Patents Examined by Peter Vo Dungba
  • Method of producing a leadframe
    Patent number: 5271148
    Abstract: A leadframe includes a dambar separated from the to be formed molded package edge by temporary slugs. The temporary slugs are partially stamped through the thickness of the leadframe and are then pushed back into position. During encapsulation, unwanted encapsulation or flash flow is prevented from flowing farther than the closest edge of the temporary slugs. In a subsequent operation, the dambar and slugs are punched away in a single operation.
    Type: Grant
    Filed: November 5, 1992
    Date of Patent: December 21, 1993
    Assignee: National Semiconductor Corporation
    Inventors: Alphee J. Desrochers, Gary R. Hamming