Abstract: Methods are provided for forming a die package. The method comprises stiffening a flexible substrate to provide a first flexibility of the flexible substrate, forming a mounting element on a first side of the flexible substrate, and mounting a first side of a die on a second side of the flexible substrate. In addition, the method comprises adjusting the stiffening to provide a second flexibility of the flexible substrate that is greater than the first flexibility, and positioning the flexible substrate to couple a contact of the flexible substrate with a second side of the die.