Abstract: Deicing performance of a total air temperature (TAT) probe may be improved by reducing the size of a frontal projected area upstream of an inertial bend of the TAT probe. In accordance with various embodiments, a TAT probe may comprise an airflow inlet having a first surface substantially parallel to an incoming airflow, a primary airflow passage through the TAT probe from the airflow inlet to a primary airflow outlet, and a total air temperature sensor assembly disposed within a sensor flow passage. In various embodiments, the sensor flow passage may be oriented perpendicular to a mounting surface of the TAT probe. Further, the first surface may be perpendicular to the sensor flow passage. In various embodiments, the airflow inlet may have a second surface that is inclined relative to the first surface to help facilitate a desirable pressure gradient and boundary bleed passage function.

Abstract: A low pressure temperature sensor for measuring the temperature of a substrate during semiconductor device manufacturing is generally described. Various embodiments describe a gas chamber having an opening disposed within a dielectric plate of a platen with a seal disposed around the opening in the gas chamber such that the opening in the gas chamber may be sealed against the substrate. Furthermore, a temperature sensor and a spring are disposed in the gas chamber, the spring biased to place the temperature sensor in contact with the substrate. Additionally, a gas source configured to pressurize the gas chamber with a low pressure gas in order to increase thermal conductivity between the substrate and the temperature sensor is provided.

Abstract: At least one or more sensor for detecting a load acting on a wheel support bearing apparatus is provided in such bearing device, a signal processor for processing an output signal of those sensors to generate a signal vector and a load calculator for calculating the load, which acts on a vehicle wheel, from the signal vector, are provided. The load calculator has a function of determining the presence or absence of a predetermined state of a vehicle, which may affects a result of calculation of the load, and performing two types of calculation process appropriate to the presence or absence. The presence or absence of the predetermined state of the vehicle, which is determined by the load calculator is, for example, ON/OFF of a brake.

Abstract: The present invention relates to a retrievable pressure sensor for in situ measurement of pressure in a process fluid in a pipe/chamber. The pressure sensor comprising a pressure-transferring device and an outer sensor part having a pressure sensing element attached at a distance from the pipe/chamber where the pressure is to be measured. The pressure-transferring device comprises a first device for sealing attachment in an opening in a wall of the pipe/chamber where the pressure is to be measured, and has a first separation diaphragm for separating between the process fluid and the pressure-transferring fluid. The pressure-transferring device further comprises a second device for attachment at a distance from the pipe/chamber where the pressure is to be measured. The pressure-transferring device comprises a first cavity with a pressure-transferring fluid, wherein the first cavity comprising a capillary tube for pressure transferring connection between the first device and the second device.

Abstract: Technical solutions are described for detecting leaks in a pipeline network that are not detectable by a SCADA system over an extended period of time. An example method includes identifying a subsystem in the pipeline network that includes a first station and accessing historical temporal sensor measurements of the stations in the subsystem. The method also includes selecting a subset of temporal sensor measurements corresponding to timestamps without leak events and determining a benchmark value for the sensor measurements for the first station based on the subset. The method also includes detecting a leak computing a difference between a sensor measurement and the benchmark value, adding the difference to a cumulative sum of differences computed over a predetermined duration of time, and triggering a leak detection indication if the cumulative sum of differences being larger than a first predetermined threshold or smaller than a second predetermined threshold.

Abstract: A wide range temperature control system for semiconductor manufacturing equipment uses a thermoelectric element applied to a chiller that is a temperature control device for semiconductor manufacturing equipment. The refrigerant circulated through a refrigerant tank passes through thermoelectric element block groups and is cooling and heating controlled, outputs of the thermoelectric element block groups are then supplied to a load, a heat exchanger using process cooling water (PCW) is configured in the refrigerant tank in which the refrigerant recirculated from a working load is stored, a heater for high temperature heating is further configured, some of the thermoelectric element block groups at a high temperature are bypassed through a variable valve, the polarity of a voltage is reversed in the thermoelectric element block groups through which a high-temperature refrigerant passes, and a part of an insulating element adjacent to the refrigerant is maintained at a lower temperature than the refrigerant.

Abstract: Disclosed are improved methods and apparatus for determining a kinetic parameter of a sample via thermogravimetry. According to the methods, accuracy of the measured parameter is improved and made less susceptible to noise across a temperature range, in particular at near-zero values of the rate of change of the weight of the sample. The disclosed methods avoid taking a logarithm of the first derivative of a thermogravimetric signal related to the sample weight detected during the experiment.

Abstract: A MEMS pressure sensor wherein at least one of the electrode arrangements comprises an inner electrode and an outer electrode arranged around the inner electrode. The capacitances associated with the inner electrode and the outer electrode are independently measured and can be differentially measured. This arrangement enables various different read out schemes to be implemented and also enables improved compensation for variations between devices or changes in device characteristics over time.

Abstract: A lithography apparatus comprises a structural element, a sensor having a detection region for detecting a physical quantity in at least one detection direction with respect to the structural element, and a sensor receptacle for mounting the sensor to the structural element, wherein the sensor is arranged in such a way that the maximum displacement of the detection region in the detection direction relative to the structural element is not greater than the maximum displacement of the detection region in the detection direction in the case of an arrangement of the sensor orthogonally with respect thereto.

Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Abstract: An apparatus configured to sense presence and motion in a monitored space includes one or more thermal sensing devices and a lens array. Each thermal sensing device is configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing device. The lens array is coupled to the one or more thermal sensing devices and includes multiple lenses, each of which is configured to direct incident thermal energy from at least a respective one of multiple different physical zones located within the monitored space onto the one or more thermal sensing devices.

Abstract: A device is provided with a measurement window, which is provided in a heat treat furnace and which permits direct visual observation of a surface to be measured of a heat-treated workpiece, and a temperature sensor, which is provided outside the measurement window and which is capable of carrying out noncontact measurement of the surface temperature of the surface to be measured through the measurement window. The temperature sensor has a measurement wavelength range in which the absorptivity by water is low (e.g., 1.95 ?m to 2.5 ?m). Further, the measurement window is composed of a window material having a high transmittance in the measurement wavelength range (e.g., germanium).

Abstract: An acoustic volume sensing device is disclosed. The device includes a housing comprising a reference volume chamber and a variable volume chamber, the reference volume chamber and the variable volume chamber connected by a resonant port, a first MEMS microphone located in acoustic relation to the variable volume chamber, a second MEMS microphone located in acoustic relation to the reference volume chamber, a MEMS speaker located in acoustic relation to the reference volume chamber, and a circuit board in electric connection with the first and second MEMS microphones and the MEMS speaker.

Abstract: An electronic circuit (10) to monitor a temperature of a light emitting diode (1) comprises a current generating circuit (110) to generate a current flow of at least a first and second current (IC1, IC2) through the light emitting diode (1) and a voltage monitoring circuit (120) to monitor a voltage of the light emitting diode (1). The voltage monitoring circuit (120) is further arranged to determine a difference of a respective value of a first and second voltage (Vf1, Vf2) of the light emitting diode (1) to monitor the temperature of the light emitting diode (1), wherein the first voltage (Vf1) and second voltage (Vf2) of the light emitting diode (1) is determined while driving the first and second current (IC2) through the light emitting diode (1).

Abstract: The present invention relates to an infrared sensor assembly for measuring temperature in a vehicle, including: a support bracket 3 configured to be detachably coupled with an inner surface of a garnish on one side inside the vehicle to form a base; a casing 5 configured to be detachably coupled on the support bracket 3 and form an inner installation space between the support bracket 3 and the casing 5; a main PCB 7 configured to be inserted into a PCB housing 17 so as to be interposed between the support bracket 3 and the casing 5; and an infrared sensor 9 configured to be inclinedly bound with the main PCB 7 to measure the temperature in the vehicle. By this configuration, the overall size of the infrared sensor assembly may be compacted, the infrared sensor assembly may be easily commonly used in different types of vehicles, and the infrared sensor assembly may be embedded in a garnish of an interior material, such as an A-pillar to improve an aesthetic of the interior of the vehicle.

Abstract: A method and apparatus for monitoring waterbed environment are described. The method may comprise determining a first temperature at a location within the water column of a surface body of water that is representative of the upper thermal boundary condition between surface water and pore water environments, and determining at least a second temperature at the location at a first depth below a waterbed surface. The first and second temperatures are then used to monitor a waterbed environment. Certain embodiments are particularly useful for monitoring spatiotemporal variations of riverbed surface elevations, such as scour and deposition, over a time period. Probe/sensor assemblies are disclosed for practicing the method.

Abstract: Temperature monitoring systems for data centers include a plurality of ceiling-mounted infrared sensor arrays. Each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of equipment racks that are mounted in rows in the data center. These systems may further include a controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays.

Abstract: Torque transmitted via a drive shaft of a motor is contactlessly determined using organic magnetoresistive semiconductor element, unlike known torque sensors that can generate greatly fluctuating measurement signals even at a constant torque. The organic magnetoresistive semiconductor element is mounted on a drive shaft or a coupling thereof. For this purpose, a field generator is provided, which is rigidly connected to the drive shaft or the clutch and which in the environment of the drive shaft generates a magnetic field that is dependent upon the torque. In the environment, the OMR semiconductor element is arranged to be stationary. The OMR semiconductor element has two electrodes between which a voltage source generates an electrical voltage.

Abstract: In an electronic device, a heat generation part pattern is connected to a heat generating element to heat from the heat generating element. A temperature detecting element is disposed adjacent to a first surface of a substrate. A direct under layer pattern is disposed on a second surface of the substrate opposite to the temperature detecting element in an area including a portion corresponding to the temperature detecting element. An interlayer connection pillar connects between the heat generation part pattern and the direct under layer pattern to conduct heat. The heat generated from the heat generating element is effectively conducted to the temperature detecting element through the heat generation part pattern, the interlayer connection pillar, and the direct under layer pattern, and thus the temperature detecting element accurately detects the temperature of the heat generating element.

Abstract: A temperature sensor includes a current generator that detects a temperature and generates a temperature dependent current, the temperature dependent current having a current level corresponding to the detected temperature. A current-to-voltage converter converts the temperature dependent current into a temperature dependent voltage, the temperature dependent voltage having a voltage level corresponding to the detected temperature. A signal generator generates a pulse signal having a period determined from a voltage difference between the temperature dependent voltage and a reference voltage. A counter counts a number of cycles of a reference clock signal that occur during one cycle of the pulse signal to output a temperature code indicative of the temperature.