Patents Examined by Quochien B. Vuong
  • Patent number: 11664779
    Abstract: An acoustic impedance matching device can facilitate acoustic transmission across an interface formed by materials having a very large acoustic impedance mismatch (e.g. air-water, or air-elastic polymer). The device can include a first medium. The first medium can have a first acoustic impedance. The device can include a second medium. The second medium can have a second acoustic impedance. The second acoustic impedance can be substantially greater than the first acoustic impedance. Thus, the first acoustic impedance and the second acoustic impedance are substantially mismatched. An interface can be defined between the first medium and the second medium. A bubble can be located in the second medium or the interface. The bubble can act as a resonator and can enable efficient sound transmission despite the large impedance mismatch of the first medium and the second medium.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: May 30, 2023
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Taehwa Lee, Hideo Iizuka
  • Patent number: 11638210
    Abstract: Methods and circuits for reducing power dissipation in wireless transceivers and other electronic circuits and systems. Embodiments of the present invention use bias current reduction, impedance scaling, and gain changes either separately or in combination to reduce power dissipation. For example, bias currents are reduced in response to a need for reduced signal handling capability, impedances are scaled thus reducing required drive and other bias currents in response to a strong received signal, or gain is increased and impedances are scaled in response to a low received signal in the presence of no or weak interfering signals.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: April 25, 2023
    Assignee: Theta IP, LLC
    Inventor: Yannis Tsividis
  • Patent number: 11637573
    Abstract: An apparatus comprises a digital processing device configured to generate a digital transmission signal, a digital-to-analog converter connected to the digital processing device and configured to convert the digital transmission signal into an analog transmission signal, and a power amplifier connected to the digital-to-analog converter and configured to amplify the analog transmission signal. An antenna filter is connected to the power amplifier and configured to filter the amplified analog transmission signal; the antenna filter is configured to pass frequencies in at least one passband and to attenuate frequencies in at least one stopband. The digital processing device is configured to perform a process of reducing peak power in the digital transmission signal; in this process error components having different frequencies are produced. A frequency spectrum of the error components is manipulated such that a part of the error components is deposited in the stopband of the antenna filter.
    Type: Grant
    Filed: October 10, 2022
    Date of Patent: April 25, 2023
    Assignee: NOKIA SOLUTIONS AND NETWORKS OY
    Inventors: Gunter Wolff, Radoslaw Ceszkiel, Grzegorz Haza, Björn Jelonnek, Michael Weber
  • Patent number: 11621733
    Abstract: A radio-frequency circuit is used in simultaneous transfer of a radio-frequency signal of 4G and a radio-frequency signal of 5G, and includes a first transfer circuit that selectively receives the 4G radio-frequency signal or the 5G radio-frequency signal, and transfers a radio-frequency signal of a first communication band including a first transmission band and a first reception band and a radio-frequency signal of a second communication band including a second transmission band and a second reception band. The first and second transmission bands at least partially overlap. The first transfer circuit includes a first power amplifier that amplifies transmission signals of the first and second communication bands, and a first transmission filter that has a first passband including the first and second transmission bands, and passes the transmission signals of the first and second communication bands output from the first power amplifier.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: April 4, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Ono, Satoshi Tanaka, Hirotsugu Mori
  • Patent number: 11616865
    Abstract: An electronic device according to various embodiments of the present invention can comprise: a foldable housing, which comprises a hinge structure, a first housing structure connected to the hinge structure and including a first surface facing a first direction, a second surface facing a second direction that is opposite to the first direction, and a first side member that encompasses at least a portion of the space between the first and second surfaces and includes at least one first conductive part, and a second housing structure connected to the hinge structure, including a third surface facing a third direction, a fourth surface facing a fourth direction that is opposite to the third direction, and a second side member that encompasses at least a portion of the space between the third and fourth surfaces and includes at least one second conductive part, and which comes into contact with the first housing structure with the hinge structure as the center thereof, wherein the first surface faces the third su
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: March 28, 2023
    Inventors: Iiltaek Jeong, Myeongsu Oh
  • Patent number: 11616521
    Abstract: A radio-frequency module includes an integrated circuit (IC) device and an external inductor provided outside the IC device. The IC device includes a plurality of low-noise amplifiers, one or more inductors, and a switching circuit. The plurality of low-noise amplifiers includes a plurality of transistors in one to one correspondence. The one or more inductors are coupled to one or more of the plurality of transistors. Each inductor is coupled to the emitter or source of a corresponding one of the plurality of transistors. The switching circuit is coupled between the emitter or source of each of the plurality of transistors and the external inductor. The external inductor is coupled between the switching circuit and ground in series with each of the one or more inductors via the switching circuit.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: March 28, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Daisuke Yoshida
  • Patent number: 11616525
    Abstract: One variation of a device case includes a device case body: configured to accept and retain a mobile device; defining a strap receptacle; and including a first set of magnetic features arranged across a base surface of the strap receptacle. The device case further includes a strap: coupled to the device case body; configured to seat within the strap receptacle in a retracted position; configured to accept a finger of a user in a deployed position; and including a second set of magnetic features configured to transiently couple to the first set of magnetic features to drive the strap from the deployed position to the retracted position and to retain the strap within the strap receptacle in the retracted position.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: March 28, 2023
    Assignee: Peak Design
    Inventors: Joseph Cunningham, Robb Jankura, Matthew Thomas James, Peter Dering, Peter Lockett, Arthur Viger, Andrew Wheeler Gans, Kiran Malladi, Max A. Maloney, Dane Jones, Colin Maginnis, Rachel Roberts, Jaimee Erickson, Adrienne Rowell
  • Patent number: 11601096
    Abstract: A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: March 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Isao Takenaka
  • Patent number: 11582592
    Abstract: A communication device may include a first type of interface and a second type of interface. The communication device may execute the communication of object data with a mobile device using the second type of interface after executing a specific process for causing the communication device to shift to a communication-enabled state, in a case where it is determined that the communication device is not currently in the communication-enabled state. Also, the communication device may execute the communication of the object data with the mobile device using the second type of interface without executing the specific process, in a case where it is determined that the communication device is currently in the communication-enabled state.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: February 14, 2023
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Takanobu Suzuki, Hirotaka Asakura, Munehisa Matsuda, Satoshi Tanaka
  • Patent number: 11581963
    Abstract: An interference detection system comprises memory storing computer instructions to cause a processor to perform gathering a temporal snapshot of radio parameter values associated with a first site of a point-to-point radio system, the radio parameter values including at least a receive signal level (RSL) value and at least one other radio parameter value correlated with signal degradation; determining whether the RSL value is greater than an RSL threshold; determining whether the other radio parameter value indicates a threshold level of signal degradation; when the RSL is greater than the RSL threshold and the other parameter indicates a threshold level of signal degradation during the temporal snapshot, determining that external interference is present during the temporal snapshot; when the RSL is not greater than the RSL threshold, determining that the external interference is not present; and performing a responsive action to a determination of the external interference being likely present.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: February 14, 2023
    Assignee: Aviat U.S., Inc.
    Inventors: Gary Croke, Sergio Licardie, Robert Vilhar, Sreco Plevel, Marius Koegelenberg
  • Patent number: 11574898
    Abstract: A radio-frequency module including a module substrate having a first main surface and a second main surface on opposite sides; a low-noise amplifier disposed on the second main surface; and a power amplifier circuit in a Doherty configuration. The power amplifier including a first phase circuit; a second phase circuit; a carrier amplifier disposed on the first main surface and including an input terminal connected to a first end of the first phase circuit and an output terminal connected to a first end of the second phase circuit; and a peaking amplifier disposed on the first main surface and including an input terminal connected to a second end of the first phase circuit and an output terminal connected to a second end of the second phase circuit.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Goto, Kazuhito Nakai
  • Patent number: 11575400
    Abstract: An apparatus, method and computer program product is disclosed. The apparatus may comprise means for transmitting and receiving radio frequency signals using a radio system coupled to an external antenna via an additional combiner or diplexer, means for receiving one or more reference signals usable for measurement of passive intermodulation from one or more nodes provided in a signal path external to the radio system, a first one of said nodes being associated with a signal path between the additional combiner or diplexer and the external antenna, and means for performing passive intermodulation cancellation based on the received one or more reference signals, including a first reference signal from the first node.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: February 7, 2023
    Assignee: Nokia Solutions and Networks Oy
    Inventor: Aaron Mullins
  • Patent number: 11576057
    Abstract: The disclosure provides a method of operating a communication network. The method includes receiving input data related to a state of the communication network and operation of the communication network. The method then includes determining a policy for the communication network based on the input data. The policy is a set of features for forming a plurality of communication links in the communication network over a time interval. The plurality of communication links provides one or more paths through the communication network. Determining the policy is based at least in part on utility values of previous policies. The utility values of previous policies are derived using simulation and/or real-world implementation of the previous policies. The communication network is then operated to implement the policy in the time interval.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: February 7, 2023
    Assignee: Aalyria Technologies, Inc.
    Inventors: Sharath Ananth, Brian Barritt, Jin Zhang
  • Patent number: 11564164
    Abstract: Methods and circuits for reducing power dissipation in wireless transceivers and other electronic circuits and systems. Embodiments of the present invention use bias current reduction, impedance scaling, and gain changes either separately or in combination to reduce power dissipation. For example, bias currents are reduced in response to a need for reduced signal handling capability, impedances are scaled thus reducing required drive and other bias currents in response to a strong received signal, or gain is increased and impedances are scaled in response to a low received signal in the presence of no or weak interfering signals.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: January 24, 2023
    Assignee: THETA IP, LLC
    Inventor: Yannis Tsividis
  • Patent number: 11557828
    Abstract: An electronic device having antennas according to an implementation is provided. The electronic device may include a first antenna disposed on a rim thereof and configured to receive a first signal that is a Long-Term Evolution (LTE) signal or a New Radio (NR) signal of a first band, a second antenna disposed to be spaced apart from the first antenna by a predetermined interval, and configured to receive a second signal that is an LTE or NR signal of a second band higher than the first band, and a transceiver circuit operably coupled to the first antenna and the second antenna. In one implementation, the electronic device may include a baseband processor configured to control the transceiver circuit to receive the first signal through the first antenna and the second signal through the second antenna.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: January 17, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Dongjin Kim, Youngbae Kwon, Byungwoon Jung, Jihun Ha
  • Patent number: 11552659
    Abstract: A transmission circuit includes a data input pin, a serial-to-parallel converter, an interface decoder, a parallel-to-serial converter, and a processor circuit. The serial-to-parallel converter is electrically coupled to the data input pin. The serial-to-parallel converter converts a plurality of data signals received by the first data input pin into a set of parallel data signals. The interface decoder is electrically coupled to the serial-to-parallel converter. The interface decoder decodes the set of parallel data signals to generate a set of decoded data signals for parallel transmission. The parallel-to-serial converter is electrically coupled to the interface decoder. The parallel-to-serial converter converts the set of decoded data signals into a plurality of input data signals for serial transmission. The processor circuit is electrically coupled to the parallel-to-serial converter. The processor circuit receives and processes the plurality of input data signals.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: January 10, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yan-Guei Chen, Liang-Wei Huang
  • Patent number: 11553416
    Abstract: Technologies directed to dynamic memory reallocation and offload channel state information (CSI) processing for device power savings are described. A method includes receiving, by a radio, first data from a processing device. The first data is sent to a second wireless device over a wireless channel. The method measures, by the radio, first CSI values that represent channel properties of the wireless channel. The method sends, by the radio, the first CSI values to the processing device with a first periodicity. The method receives, by the radio from the processing device, second data that specifies a transfer interval and an amount of memory to reserve in a memory buffer for second CSI values measured during the transfer interval. The method measures, by the radio, the second CSI values and sends the second CSI values to the processing device at the end of the transfer interval.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: January 10, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Ravi Ichapurapu, Durga Laxmi Narayana Swamy Inti, Amit Kachroo
  • Patent number: 11546005
    Abstract: Disclosed is a digital radio-frequency transmitter, which includes a digital logic mixer, a digital power amplifier and an antenna, wherein an output terminal of the digital logic mixer is connected with an input terminal of the digital power amplifier; an output terminal of the digital power amplifier is connected to the antenna; the digital logic mixer is configured to perform logic mixing on baseband data and a radio-frequency local oscillator clock signal which are input into the digital radio-frequency transmitter to generate radio-frequency data; the digital power amplifier is configured to convert the radio-frequency data into an analog power signal; and the antenna is configured to transmit the analog power signal out. According to the digital radio-frequency transmitter of the present application, the circuit layout area and the circuit operation consumption can be effectively reduced.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: January 3, 2023
    Assignee: Shenzhen Giant Microelectronics Company Limited
    Inventors: Hui Shao, Lefeng Shen, Shaohua Zhao, Weimin Zhang
  • Patent number: 11546003
    Abstract: A radio frequency module includes: a module substrate including a first principal surface and a second principal surface opposite to each other; a plurality of external-connection terminals (e.g., a plurality of post electrodes) disposed on the second principal surface; a semiconductor component disposed on the second principal surface and including a first low-noise amplifier and/or a second low-noise amplifier; and a metal member set at a ground potential and covering at least part of a surface of the semiconductor component, the surface being opposite to a surface that faces the module substrate.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: January 3, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Nishikawa
  • Patent number: 11538774
    Abstract: A wireless transmission module, chips, a passive component, and a coil are integrated into an integral structure, so that an integration level of the wireless transmission module is improved. In addition, the integral structure can effectively implement independence of the module, and the independent module can be flexibly arranged inside structural design of an electronic device, and does not need to be disposed on a mainboard of the electronic device. Only an input terminal of the wireless transmission module needs to be retained on the mainboard of the electronic device. In addition, the integral structure can further effectively increase a capability of a product for working continuously and normally in an extremely harsh scenario, and improve product reliability. In addition, in the structure of the wireless transmission module, the chips and the coil are integrated, and signal transmission paths between the chips and the coil are relatively short.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: December 27, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Qijing He, Xiaojing Liao, Zhaozheng Hou