Abstract: A uniform gas flow is provided at the surface of a planar device or wafer in a processing system having a substantially cylindrical chamber through which processing gases flow toward an asymmetrically located outlet port by using an appropriately disposed collar or baffle along the gas stream in the chamber in the plane of the surface of the planar device or wafer.
Type:
Grant
Filed:
March 18, 1997
Date of Patent:
August 4, 1998
Assignee:
International Business Machines Corporation
Inventors:
Anthony John Canale, Randy Dean Cox, Dennis Stanley Grimard, Tracy Charles Hetrick