Patents Examined by R. Dean, Sr.
  • Insulating resin composition and semiconductor device using the same
    Patent number: 5132386
    Abstract: Insulating resin composition for a semiconductor device having a multilevel interconnection layers formed by the resin and having a superior planarizing capability relative to a lower interconnection layer is provided, which resin being a cured product of a polyamic acid ester oligomer obtained by reacting an aromatic diamine and/or a diaminosiloxane with an aromatic tetracarboxylic acid ester obtained by reacting an aromatic tetracarboxylic acid dianhydride with an alcohol or alcohol derivative.
    Type: Grant
    Filed: May 2, 1989
    Date of Patent: July 21, 1992
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hiroshi Suzuki, Shunichiro Uchimura, Hidetaka Sato
  • Organosiloxane elastomers exhibiting improved physical properties
    Patent number: 5073583
    Abstract: A group of substituted benzotriazoles unexpectedly improves the physical properties, particularly the tensile strength and tear strength, of peroxide cured organosiloxne elastomers.
    Type: Grant
    Filed: October 10, 1989
    Date of Patent: December 17, 1991
    Assignee: Dow Corning Corporation
    Inventor: Dennis W. Broderick