Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.
Type:
Grant
Filed:
December 5, 2000
Date of Patent:
August 13, 2002
Assignee:
Tyco Electronics Logistics AG
Inventors:
Wayne S. Alden, William Petrocelli, Peter Wapenski, Arthur G. Michaud, Michael Kirkman, Jeffery Mason, Brian Paul Sharp