Patents Examined by Rakesh Patel
  • Patent number: 10122340
    Abstract: An LC filter includes a laminate including insulating layers laminated in a lamination direction, an inductor having a spiral or helical shape around an axis parallel or substantially parallel to the lamination direction, and a capacitor in which capacitor conductors face each other. The inductor and the capacitor do not overlap as viewed from the lamination direction and all directions orthogonal or substantially orthogonal to the lamination direction.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: November 6, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Masuda
  • Patent number: 10122061
    Abstract: A coaxial resonator is provided. The coaxial resonator has a first side and a second side, the coaxial resonator comprising a dielectric disc having a first surface, a second surface and a hole, wherein the second side of the coaxial resonator is connected to the first surface of the dielectric disc, wherein the coaxial resonator further comprises a conductive element connected to second surface of the dielectric disc. A filter comprising a housing, comprising a lid/cover and a chassis having one or more cavities adapted for receiving a coaxial resonator is also provided.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: November 6, 2018
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Anis Letaief, Hamed Jahja, Piotr Jedrzejewski
  • Patent number: 10116028
    Abstract: An RF dielectric waveguide duplexer filter module with antenna and lower and upper Tx and Rx signal transmission blocks of dielectric material attached together in a side-by-side and stacked relationship. The blocks are covered with conductive material. Antenna and Tx and Rx input/outputs are defined at opposite ends of the filter module. RF signal transmission windows define direct coupling RF signal transmission paths between the antenna and the Tx and Rx blocks and between the lower and upper Tx and Rx blocks. One or more bridges of dielectric material on the lower Tx and Rx blocks define inductive cross-coupling Tx and Rx signal transmission paths. The Tx signal is transmitted only in the direction of the antenna block or between the upper and lower Tx blocks. The Rx signal is transmitted only in the direction of the Rx RF signal input/output or between the upper and lower Rx blocks.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: October 30, 2018
    Assignee: CTS Corporation
    Inventor: Reddy Vangala
  • Patent number: 10116034
    Abstract: A twin axial cable structure is provided for transmitting signals that makes use of insulative materials that are not easily extruded, such as expanded polyethylene (ePE) and expanded polytetrafluoroethylene (ePTFE). The cable structure includes an insulative body portion having a pair of open channels defined through an outer longitudinal surface of the insulative body portion, in which are disposed a pair of conductive wires. A conductive sheet is disposed on the insulative body portion, and a grounding element is placed in contact with the conductive sheet, such as by applying planar conductive sheets and grounding elements and/or ground wires to the insulative body portion. Corresponding methods and apparatuses for manufacturing the same are also provided. The cable structures, methods, and apparatuses described herein can produce a cable structure for transmitting multiple differential signals within the same structure, with minimal negative effects on other, neighboring transmissions.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: October 30, 2018
    Assignee: Mellanox Technologies, Ltd.
    Inventors: Pierre Avner Badehi, Eyal Frost
  • Patent number: 10116278
    Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: October 30, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hayami Kudo, Kenji Nishiyama, Ryo Okura
  • Patent number: 10116023
    Abstract: An apparatus is provided for causing a phase-shift in reflected signals that are a reflection of surface-traveling wave signals of a select signal frequency. The apparatus comprises a conductive strip having a plurality of slots therein alternatingly arranged orthogonal to each other, each slot having an effective length that is a fraction between 9/16 and ? of the wavelength associated with the select signal frequency, and a plurality of conductive enclosures respectively disposed under each of the plurality of slots. Each of the conductive enclosure have a width and length sufficient to enclose a respective corresponding slot, and a depth that is a fraction of between ? and ? of the wavelength associated with the select signal frequency when transmitted in the dielectric material.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: October 30, 2018
    Assignee: The Boeing Company
    Inventors: Garrett L. Gilchrist, Richard W. Burns, Michael P. Hurst
  • Patent number: 10110114
    Abstract: The invention comprises a high frequency inductor filter apparatus and method of use thereof. In one embodiment, an inductor is used to filter/convert power, where the inductor comprises a distributed gap core and/or a powdered core material. The inductor core is wound with one or more turns, where multiple turns are optionally electrically wired in parallel. In one example, the minimum carrier frequency is above that usable by an iron-steel inductor, such as greater than ten kiloHertz at fifty or more amperes. The core is optionally an annular core, solid rod core, or a core used for multiple phases, such as a ‘C’ or ‘E’ core. Optionally, the inductor is used in an inductor/converter apparatus, where output power has a carrier frequency, modulated by a fundamental frequency, and a set of harmonic frequencies, in conjunction with one or more of a silicon carbide, gallium arsenide, and/or gallium nitride based transistor.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: October 23, 2018
    Inventor: Grant A. MacLennan
  • Patent number: 10110193
    Abstract: A low pass filter includes a first via-hole conductor connected to a first end portion of a first inductor and a third end portion of a second inductor and extending to another side in a lamination direction with respect to a second end portion of the first inductor and a fourth end portion of the second inductor, and a first capacitor electrically connected in parallel with at least a portion of the first inductor and a portion of the second inductor and defined by a first capacitor conductor layer. The low pass filter allows the interval between attenuation poles to be easily adjusted.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: October 23, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Masuda
  • Patent number: 10110196
    Abstract: An electronic component includes a multilayer body, a filter provided at the multilayer body, an input/output terminal provided at the multilayer body, and an impedance-matching loop via inductor at the multilayer body and connected between the filter and the input/output terminal, and including an impedance-matching inductor conductor layer, and first and second impedance-matching via hole conductors extending from the impedance-matching inductor conductor layer in a laminate direction. A capacitor including at least two conductor layers respectively connected with the first and second impedance-matching via hole conductors may not be provided.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: October 23, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yusuke Mukai
  • Patent number: 10103703
    Abstract: The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: October 16, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Jonghae Kim, Mario Francisco Velez, Niranjan Sunil Mudakatte, Robert Paul Mikulka
  • Patent number: 10097153
    Abstract: A bandstop filter is provided that includes an input port, a series bandpass resonator, a first capacitor, a bandstop resonator, a second capacitor and an output port. The combination of the first capacitor, the bandstop resonator and the second capacitor comprises a bandstop impedance magnitude and a bandstop impedance phase. The bandpass resonator impedance magnitude is substantially equal to the bandstop impedance magnitude. The bandpass resonator impedance phase is substantially 180° out of phase with the bandstop impedance phase. The series bandpass resonator, the first capacitor, the bandstop resonator and the second capacitor operate as a band stop for a predetermined frequency within the frequency band.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: October 9, 2018
    Assignee: The United States of America as represented by Secretary of the Navy
    Inventors: Jason F. Rowland, Jia-Chi S. Chieh
  • Patent number: 10090573
    Abstract: An improved high-frequency shielded housing is characterized by the following features, among others: multiple contact sections (K; KG; KD) are formed or provided arranged offset to one another between the housing cover (17) and the housing (3), galvanic separating sections (T; TG; TD) are formed or provided between the contact sections (KG; KD), the housing cover (17) and the housing (3) are galvanically separated in the regions of the galvanic separating sections, and screw connections (25) are provided in the contact sections (K; KG; KD), the housing cover (17) and the housing (3) being galvanically contacted in the regions of the screw connections.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: October 2, 2018
    Assignee: Kathrein-Werke KG
    Inventors: Maximilian Göttl, Thomas Haunberger, Manfred Stolle
  • Patent number: 10079414
    Abstract: Systems and method are provided for a switching circuit that enables attenuation of high power signals in relatively small band(s) without attenuating information in other bands. Embodiments of the present disclosure provide switching circuits with intrinsically switched filters that enable channelized limiting without affecting adjacent channels. Further, embodiments of the present disclosure provide a unique filter coupling topology that enables filters to be switched on or off without changing the input impedance of the filters.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: September 18, 2018
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Andrew C. Guyette, Eric J. Naglich
  • Patent number: 10079585
    Abstract: An LC filter that is able to obtain high insertion loss in a high-frequency band. The LC filter includes: a core including a core portion and a pair of flange portions formed at both sides of the core portion; a winding; and a pair of signal outer electrodes. At least one of the pair of flange portions is composed of a multilayer body in which inner electrodes and dielectric layers are alternately laminated, and includes a ground outer electrode. The inner electrodes include a first inner electrode and a second inner electrode alternately arranged. The first inner electrode is connected to the signal outer electrode, and the second inner electrode is connected to the ground outer electrode.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 18, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yang Guan
  • Patent number: 10069537
    Abstract: Aspects of the subject disclosure may include, for example, a coupling device including a receiving portion that receives a radio frequency signal conveying data from a transmitting device. A magnetic coupler magnetically couples the radio frequency signal to a transmission medium as a guided electromagnetic wave that is bound by an outer surface of the transmission medium. Other embodiments are disclosed.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: September 4, 2018
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Robert Bennett, Paul Shala Henry, Irwin Gerszberg, Farhad Barzegar, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 10062941
    Abstract: Disclosed is an indirect transmission type automatic frequency modulation filter including a microwave body, a moving plate, a fastener, and a motor unit. The microwave body has plural openings. The moving plate includes a board, plural lugs and a first moving member, and the lugs and the first moving member form the board. The fastener includes a support base and a second moving member. The motor unit includes a rod and a driver, and the driver determines a clockwise rotation or a counterclockwise rotation and drives the rod to move the moving plate towards or away from the microwave body so as to insert the lugs into cavities to a desired depth and adjust a center frequency.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: August 28, 2018
    Inventors: Yu-Cheng Chen, Chien-Chih Li, Jen-Ti Peng, Chun-Wei Chen, Chun-Kai Wang, Chun-Yu Chu
  • Patent number: 10062943
    Abstract: A method for fabricating microstrip line structure is disclosed. First, a substrate is provided, ground patterns are formed on the substrate, an interlayer dielectric (ILD) layer is formed on the ground patterns, contact plugs are formed in the ILD layer, a ground plate is formed on the ILD layer, and a signal line is formed on the ground plate. Preferably, the ground plate includes openings that are completely shielded by the ground patterns.
    Type: Grant
    Filed: September 10, 2016
    Date of Patent: August 28, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: Tzung-Lin Li
  • Patent number: 10062948
    Abstract: One embodiment is directed to a microwave cavity resonator comprises a cavity housing forming a cavity. A resonator element is arranged in the cavity and extends longitudinally along a longitudinal axis, wherein the resonator element comprises, when viewed along the longitudinal axis, a first end connected to a first housing wall and a second end opposite the first end, the second end being arranged at a distance from a second housing wall. The resonator element, at its second end, comprises at least one first capacitor element and the cavity housing comprises at least one second capacitor element reaching into the cavity and arranged at a distance, when viewed along a direction perpendicular to the longitudinal axis, from the at least one first capacitor element such that a gap between the at least one first capacitor element and the at least one second capacitor element is formed.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: August 28, 2018
    Assignee: Andrew Wireless Systems GmbH
    Inventor: Erik Madle
  • Patent number: 10063209
    Abstract: A noise filter inserted between the power source side and the load side of a main circuit for which noise is reduced to attenuate noise of the main circuit using a filter circuit including the coil and the capacitor. In the noise filter, the board ground pattern is separated into a plurality of board ground patterns, the separated board ground patterns are connected to a common ground member present outside the board, the separated board ground patterns are formed as solid patterns, and adjacent board ground patterns of the separated board ground patterns are disposed so as to have a spacing equal to or less than a predetermined distance.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: August 28, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventor: Mao Kawamura
  • Patent number: 10056670
    Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: August 21, 2018
    Assignee: HARRIS CORPORATION
    Inventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith