Patents Examined by Randy Golakowski
  • Patent number: 7098266
    Abstract: Molding compositions comprise A) from 1 to 98.8% by weight of at least one polyarylene ether sulfone, B) from 1 to 98.8% by weight of at least one thermoplastic polyamide, C) from 0.1 to 60% by weight of at least one filler, D) from 0 to 40% by weight of at least one impact-modifying rubber, E) from 0 to 40% by weight of one or more different additives, and F) from 0.1 to 30% by weight of at least one thermotropic polymer, where the total of the percentages by weight of components A to F is 100%, wherein component B has a viscosity number of from 180 to 350 ml/g (measured in a 0.5% strength by weight solution in 96% strength by weight sulfuric acid to DIN 53 727).
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: August 29, 2006
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Joachim Queisser
  • Patent number: 6921577
    Abstract: A water-based metal surface treatment agent for the surface treatment of metals including aluminum products such as pre-coated aluminum sheets gives excellent coating film adhesion, flexibility and acid resistance. The water-based metal surface treatment agent contains the following components (1) to (3): (1) A copolymer, containing in a side chain, a diketene or ketoester capable of switching between keto and enol tautomeric forms, and containing at least one hydrophilic side chain containing a cationic group, an anionic group, or a nonionic group; (2) An epoxy resin modified with a phosphoric acid type compound; and (3) A water-soluble curing agent.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: July 26, 2005
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Takashi Ouchi, Katsuyuki Tsuchida, Masashi Kumagai
  • Patent number: 6748960
    Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: June 15, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Maximilian Albert Biberger, Frederick Paul Layman, Thomas Robert Sutton
  • Patent number: 6640821
    Abstract: A cleaning tube into which an endoscope is inserted for cleaning is formed with a flexible tube and curled like a loop. A bypass channel is used to link a first end of the cleaning tube and a second end thereof. A cleaning solution present in the cleaning tube is forcibly refluxed from one end of the cleaning tube to the other end over the bypass channel, whereby a circulation of the cleaning solution is produced in the cleaning tube. The endoscope is cleaned with the circulation.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: November 4, 2003
    Inventor: Shoichi Ochiai
  • Patent number: 6546941
    Abstract: A wafer cleaning device is provided with a roll brush extending in an axial direction and having an end portion supported so that the roll brush can be rolled around its axis freely for performing cleaning by touching a rolled contact surface of the roll brush to a cleaned surface of a wafer. The end portion of the roll brush is supported so that the roll brush can be displaced by a dial adjusting screw to enable the axis to be tilted to the cleaned surface of the wafer.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: April 15, 2003
    Assignee: Sony Corporation
    Inventor: Jun Nishihara
  • Patent number: 6423152
    Abstract: The invention relates to a method for generating a scale-removing or coat-applying system based on a vacuum-balancing low-pressure multicomponent two-phase fluid flow. A cleaning site such as, e.g., a pipe circuit (A) or the inner cavities of a heat exchanger (B) is supplied with an already used cleaning agent in a two- or multiphase flow made up of ca. 10% liquid and ca. 90% air or gas, which after separation is used again by way of continuously monitoring the ion density of the separated liquid, using a conductivity apparatus which determines whether it shall be filtered and reused, be supplied with new liquid and/or solids, or be dumped. A liquid flow and separated air/gas flow from an air pump meet at a mixing point from where an intended two-phase flow flows to the cleaning site (A), (B), or similar, through this and then forward to return as a re-use medium. A gas-injected liquid/powder flow from a mixing unit is also used for coating, e.g.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: July 23, 2002
    Assignee: Intel Sampling AS
    Inventor: Torstein Landaas
  • Patent number: 6136273
    Abstract: A closure device is provided which includes a flexible cover with an array of protruding hollow caps which are formed integrally with and depend from the cover. The caps have cup shaped noses with cylindrical side walls joined to the cover by inwardly tapered intermediate wall sections. The caps form a friction fit with an array of mutually spaced receptacles, for example test tubes, deep well blocks or microwell plates.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: October 24, 2000
    Assignee: Matrix Technologies Corporation
    Inventors: Daniel J. Seguin, Margaret M. Banar