Abstract: A data center system includes a housing to house servers arranged in electronic racks and an air supply system to receive contaminated air from an external environment of the housing. The datacenter system further includes a misting and cooling system to clean and cool the contaminated air. The misting and cooling system includes a cooling and cleaning chamber to receive the contaminated air and nozzles to spray liquid droplets into the contaminated air within the cooling and cleaning chamber. The liquid droplets collect and remove at least a portion of the particles contained in the contaminated air to generate non-contaminated air. The data center system further includes an airflow delivery system to generate an airflow from the non-contaminated air to cause the airflow to travel through the servers of the electronic racks to exchange heat generated by the servers due to operations of the servers.

Abstract: An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.