Abstract: A display device includes: a display panel which displays an image with light and a drive unit which is electrically connected to the display panel and drives the display panel. The drive unit includes a drive circuit board and a drive circuit film. The drive circuit board overlaps the display panel, generates a drive signal to drive the display panel and defines a receiving hole therein. The drive circuit film electrically connects the display panel to the drive circuit board and is bent from the display panel toward the drive circuit board. The drive circuit film includes a driver chip which provides a control signal in response to the drive signal from the drive circuit board. The driver chip is received in the receiving hole defined in the drive circuit board.

Abstract: One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.

Abstract: Thermal management systems and corresponding use methods are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an outer surface and an inner surface. The computing device also includes a heat generating component supported by the housing. The computing device includes a phase change device adjacent or physically connected to the heat generating component. The phase change device includes a first side and a second side. The first side is closer to the heat generating component than the second side. The second side is opposite the first side. The phase change device is compressible, such that when a force is applied to the outer surface of the housing, the inner surface of the housing flexes towards the second side of the phase change device and the phase change device is compressed.

Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

Abstract: An apparatus includes a base, one or more first fins, one or more second fins and one or more thermoelectric generation units. The base may be thermally couplable to an electrical module that generates heat while operational. The first fins may be thermally connected to the base. The second fins may be thermally isolated from the base. The thermoelectric generation units may be (i) disposed between the first fins and the second fins and (ii) configured to convert a heat difference between the first fins and the second fins into an electrical signal at a port thereby cooling the electrical module.

Abstract: A computing system includes one or more rack rows comprising one or more racks. The racks includes one or more tanks that hold liquid coolant for at least one of the one or more servers, and a liquid coolant to remove heat from at least one of the one or more servers. An aisle is provided next to a rack row or between two of the rack rows. The aisle includes a floor. The floor can be walked on by service personnel to access at least one of the one or more racks in at least one of the rows. Cooling components at least partially below the aisle move a liquid to remove heat from at least one of the servers in at least one of the racks. The racks, floor and cooling components may be fire-resistant.

Abstract: The disclosed apparatus may include (1) a plurality of vapor chambers that (A) are mounted to a plurality of individual power components that dissipate heat within a computing device and (B) absorb heat dissipated by the plurality of individual power components within the computing device and (2) at least one thermal coupling that (A) physically bridges the plurality of vapor chambers to one another within the computing device and (B) facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An inverter device includes a heat generator, a cooler, and a cooler-side housing that covers the cooler and includes an opening that exposes a side of the cooler closer to the heat generator, and a circumferential rib that comes into contact with the cooler is provided in a vicinity of a peripheral edge of the opening of the cooler-side housing.

Abstract: An electronic device able to regulate its own working temperature and keep the same constant notwithstanding light or heavy processor activity includes a shell, a circuit board mounted on the shell, a control module and a heating element mounted on the circuit board, and a heat dissipation assembly. The connecting assembly includes a first heat dissipation component, a second heat dissipation component, and a connecting assembly. The first heat dissipation component includes a first heat-conducting board. an elastic component, and a second magnetic component. The second heat dissipation component includes a second support with a second heat-conducting board rotatably mounted. The connecting assembly rotatably connects the first support and the second support and brings the heat dissipation components together for high-temperature heat dissipation and separates same when low working heat is generated. The electronic device dissipates heat evenly through the heat dissipation assembly.

Abstract: The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.

Abstract: A cooling arrangement for a computer system includes a printed circuit board with first and second heat-generating components; a first heat sink thermally coupled to the first heat-generating component, and a second heat sink thermally coupled to the second heat-generating component; and a first fan that generates an airflow in a direction of the first heat sink, wherein the second heat sink is arranged behind the first heat sink in a direction of airflow generated by the first fan; and an airscoop is arranged between the first heat sink and a blow-out opening of the first fan such that a first part of generated airflow is directly supplied through the airscoop to the first heat sink and a second part of the generated airflow flows around the airscoop and the first heat sink such that the second part of the generated airflow flows to the second heat sink.

Abstract: A variable speed drive includes a converter connected to an AC power source, a DC link connected to the converter, and an inverter connected to the DC link. The inverter converts DC voltage into an output AC power having a variable voltage and frequency. The inverter includes at least one power electronics module and associated control circuitry; a heat sink in thermal communication with the power electronics module and in fluid communication with a manifold. The manifold includes a tubular member having at least one vertical member portion and at least one horizontal member portion in fluid communication. A plurality of ports conduct cooling fluid into and out of the manifold. A bracket attaches the manifold to a structural frame. Brackets are provided for attachment of power electronics modules to the manifold.

Abstract: A semiconductor device includes a cooling jacket having an inlet for coolant and an outlet for the coolant, a base plate, a first semiconductor element provided on the base plate, a second semiconductor element provided on the base plate, a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket, a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket, and a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin.

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

Abstract: A power amplifier arrangement for a motor vehicle includes a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board. A power amplifier is mounted on the second side of the printed circuit board. A bracket is supported by the housing. A clamping spring is supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink.

Abstract: In some examples, a computing device may include a heatsink, a thermal spreader, a first thermal pad located between the heatsink and the thermal spreader, a circuit board comprising a plurality of components, and a second thermal pad located between the thermal spreader and the circuit board. A plurality of standoffs may be located between the heatsink and the circuit board. Each standoff of the plurality of standoffs may pass through a corresponding spring of a plurality of springs and pass through a corresponding mounting hole of a plurality of mounting holes in the thermal spreader. Each screw of a plurality of screws may engage with a corresponding standoff of the plurality of standoffs. The plurality of springs may cause the thermal spreader and the second thermal pad to a relatively uniform amount of pressure to each component of the plurality of components.

Abstract: A ducting apparatus, switch, and rack of electronic devices are disclosed in which the ducting apparatus is configured to convey air from a cold aisle at a first face of the rack to a side air inlet of the switch. The ducting apparatus also hinders or prevents exhaust air from the switch from reaching the cold aisle.

Abstract: The present invention proposes a protective case for a motor vehicle computer, the case including a ventilation filter (50) and at least one wall (41) including a mounting portion (410) for mounting the ventilation filter, in which portion an opening (42) and at least one air flow channel (43) extending from the opening are formed, the ventilation filter including a membrane (51) covering the opening and a protective member (52) for protecting the membrane, mounted on the mounting portion and defining at least one aperture opening onto the flow channel (43), the flow channel being configured so as to prevent the membrane from being reached by a flow of water traveling along a straight path from the aperture, in order to prevent damage to the membrane by the flow of water.

Abstract: A chassis includes a front and back portion. The front portion includes a plurality of compute devices and a first plurality of fans. The back portion includes a plurality of input/output devices and a second plurality of fans. A first airflow zone extends from the front portion to the back portion, the first airflow zone to direct a first airflow from the compute device to the second fans. A second airflow zone extends from the front portion to the back portion, the second airflow zone to provide a second airflow from the first fans to the input/output devices, and to isolate the second airflow from the first airflow zone.