Abstract: A plasma diagnosis device and a method for manufacturing the plasma diagnosis device are provided. The plasma diagnosis device includes: a process chamber in which processes using plasma are performed; a probe structure which includes a protective layer having a first face abutting the plasma, a second face opposite to the first face, and an outer wall connecting the first face and the second face inside the process chamber, and a conductive measuring unit spaced apart from the first face of the protective layer and configured to measure a status of the plasma; and a wafer on a periphery of the probe structure and in contact with the outer wall of the protective layer, in which the wafer and the protective layer include materials different from each other.

Abstract: A method and a device for analyzing defects by means of reflectometry which are based on estimating a transfer function at a frequency resolution which is larger than that normally allowed by taking account of the limitations which are intrinsic to analog-to-digital and digital-to-analog converters and notably of their sampling frequencies.

Abstract: A fault detection system for detecting a fault condition in a direct current (DC) system. The system may include a DC power transmitter to energize a cable and a DC power receiver connected to the cable. A signal generator at the receiver employs orthogonal frequency division multiplexing (OFDM) and combines symbols for messaging or data communications with redundant symbols dedicated to fault detection. At a signal receiver, the transmitted OFDM signal is used to measure changes in the channel transfer function by monitoring changes in a parameter of the received redundant symbols. The redundant symbols need not be decoded to detect a greater-than-threshold change in the transfer function that is indicative of a fault on the cable.

Abstract: The present invention relates to a three-dimensional magnetic field measurement device comprising a plurality of modules, wherein each of the modules is configured to be extensible in x-axis, y-axis, and z-axis directions, whereby magnetic field data in a three-dimensional space can be measured in real time without moving the device, a measurement area can be easily enlarged and reduced, power efficiency can be improved, and the size and weight of the device can be reduced.

Abstract: Methods and apparatus for speed sensor having a first detection module with a first sensing element. The first detection module is configured to detect movement of a target during a first mode of operation and a second detection module is configured to detect movement of the target during a low power mode of operation.

Abstract: A medium or high voltage sensor includes a medium or high voltage sensing unit; a primary connection; a cable connection; and at least one fixation part; wherein the primary connection is connected to a first terminal of the medium or high voltage sensor unit; wherein the cable connection is connected to a second terminal of the medium or high voltage sensor unit; wherein the at least one fixation part is located at a base end of the medium or high voltage sensor unit; and wherein the at least one fixation part is configured to connect to an external structure.

Abstract: A method and system of full-field 3D displacement measurement via microwave sensing relates to the field of displacement measurement, such as deformation and vibration measurement. A structure coordinate system (SCS) is established based on a target under measurement, and a device coordinate system (DCS) is established based on microwave transceivers. Measuring points are mapped from the SCS into range-angle heatmaps of the microwave transceivers and thereby matched. Displacement time series of the measuring points on the target under measurement are monitored, obtaining initial 3D displacement time series of the target under measurement in the DCS. Based on a transformation relationship from the DCS to the SCS, transformed 3D displacement time series of the target under measurement in the SCS are calculated. The present application enables automatic full-field selection and matching of measuring points in microwave sensing based 3D displacement measurement in complex applications.

Abstract: An HOD device, comprising: a framework; covering material, covering the frame work; at least one conductive region, provided on or in the covering material; wherein the conductive region is coupled to a capacitance detection circuit or a predetermined voltage level. The HOD device can be a vehicle control device such as a steering wheel. The conductive region comprises conductive wires which can be threads of the covering material. By this way, the arrangements of the conductive wires can be changed corresponding to the size or the shape of the frame work or any other requirements. Also, the interference caused by unstable factors can be improved since the conductive wires can be coupled to a ground source of the vehicle to provide a short capacitance sensing path.

Abstract: Provided is a shaft support structure capable of improving mounting accuracy of a shaft to be press-fitted. The shaft support structure includes a main shaft adapter and a main shaft as a supporting member including a press-fitting portion for press-fitting the main shaft adapter from one end portion. The main shaft adapter has a tapered surface portion having a diameter of one end portion smaller than a diameter of a peripheral surface. The tapered surface portion is subjected to curved surface processing at a connecting portion with the peripheral surface.

Abstract: A wafer probing apparatus is provided with a wafer probe station including a wafer chuck and a chuck movement device disposed under the wafer chuck and configured to move the wafer chuck in which a wafer is adhered to the wafer chuck; a lifting mechanism disposed close to the wafer probe station; a support frame provided with the lifting mechanism; at least one probe card positioning module disposed on the support frame, each probe card positioning module including at least one needle alignment device, each needle alignment device having at least one probe card with at least one probe needle; and a mechatronics control system electrically connected to each probe card positioning module. The combination of probe card positioning module and chuck movement device achieves a precise positioning of the probe cards probing on multiple positions of a wafer surface and supports a parallel testing function for higher productivity.

Abstract: The present disclosure relates to an anomalous Hall sensor, including a Hall cross. The Hall cross includes a layer stack including a ferromagnetic layer. A first arm of the Hall cross formed in the layer stack extends in a first direction. A second arm of the Hall cross formed in the layer stack extends in a second direction perpendicular to the first direction. The anomalous Hall sensor includes a control circuit configured to apply current through the first arm and measure voltage across the second arm, and apply current through the second arm and measure voltage across the first arm. The anomalous Hall sensor further includes a processor configured to compute a component of an external magnetic field in a third direction perpendicular to the first and the second direction based on a combination of the measured voltages.

Abstract: An influence of use orientation on detection accuracy is reduced. A magnetism detection device includes a magnet (Mr) magnetized, an angle sensor (Sr) as a magnetic sensor configured to detect a magnetic flux from the magnet (Mr), a magnet holder holding the magnet (Mr), and a second layshaft gear shaft. The magnet holder is rotatably supported on the second layshaft gear shaft. The second layshaft gear shaft is made of a magnetic material. An attractive force due to a magnetic force is generated between the magnet (Mr) and the second layshaft gear shaft in a direction of a rotation axis of the magnet holder.

Abstract: The magnetic sensor device 3 comprises a sensor unit 4 and substrate-side connectors 24, 25. The sensor unit 4 comprises a magnetic sensor, a yoke, and a casing 19. The magnetic sensor comprises a magnetic wire rod that generates a large Barkhausen effect, a bobbin having the magnetic wire rod disposed therein, a coil formed by winding an electrical wire around the bobbin, a sensor-side connector provided in the left end portion of the bobbin, and a sensor-side connector provided in the right end portion of the bobbin. The magnetic sensor device 3 is provided on the substrate 35 by mounting the substrate-side connectors 24, 25 to the substrate 35 and, thereafter, connecting the sensor unit 4 to the substrate-side connectors 24, 25.

Abstract: This magnetic detection device is provided with a plurality of magnetic sensors each including an excitation coil, a signal coil, and magnetic core layer, a driving circuit, and a detection circuit. A first axis sensor unit is constituted by at least two magnetic sensors out of the plurality of magnetic sensors, the at least two magnetic sensors being each arranged such that a detection direction thereof is aligned with a first axial direction. A second axis sensor unit is constituted by at least one magnetic sensor out of the plurality of magnetic sensors, the at least one magnetic sensor being arranged such that a detection direction thereof is aligned with a second axial direction intersecting with the first axial direction.

Abstract: A final test (FT) handler including a fin structure. The fin structure includes a first side and a second side opposite to the first side. A plurality of protrusions of the fin structure are at the first side and are defined or delimited by a plurality of recesses that extend into the first side of the fin structures. The plurality of protrusions are inserted into a TIM layer of the FT handler and the plurality of recesses are filled by the TIM layer. The plurality of protrusion and plurality of recesses increase a contact area between the TIM layer and the fin structure. The FT handler is configured to, in operation, pick up, hold onto, and transport one or more semiconductor devices to be tested, for example, with a high-performance computing (HPC) test for quality assurance and control purposes.

Abstract: A power distribution system as discussed herein includes one or more interconnected power converters. Each of the one or more power converters in the power distribution system is operative to: receive a respective input voltage; via a closed loop regulation, convert the respective input voltage into a respective output voltage; and dynamically adjust a magnitude of a respective setpoint reference voltage of regulating a magnitude of the respective output voltage based on: i) a magnitude of the respective input voltage, and ii) a magnitude of respective output current supplied by the respective output voltage. Based on analysis of operational parameters such as sample output voltage of the one or more power converters, an analyzer resource determines occurrence of one or more anomaly conditions.

Abstract: A rotation angle detection device includes at least one target rotating in unison with a shaft, a rotating member for rotating at a different rotation speed from the shaft as the shaft rotates, a first sensor whose output signal changes when the target is approached, a second sensor that detects the rotation angle of the rotating member within one rotation, and a computing section that calculates the absolute angle of the shaft based on the output signal of the first sensor and the rotation angle of the rotating member detected by the second sensor. The output signal of the first sensor changes at a period different from the rotation period of the rotating member when the shaft rotates, and the computing section detects the absolute angle of the shaft at that time from the rotation angle of the rotating member when the output signal of the first sensor changes.

Abstract: An arrangement has a sensor pair and a magnet mounted to move relative thereto. Magnetic flux density per spatial coordinate per sensor is measured. A non-differential alteration of position of the magnet per the measured magnetic flux density is calculated. Differences of the measured magnetic flux densities per spatial coordinate are calculated. A differentially calculated alteration of position of the magnet from the calculated magnetic flux densities is calculated. Non-differentially and differentially calculated alterations of position of the magnet based on a null position thereof are normalised. Differences of the differentially calculated alteration of position of the magnet and the non-differentially calculated alterations of position thereof are calculated. A weighting factor based on the calculated differences is calculated.

Abstract: The present application relates to a detection circuit for power load and a method for detection thereof. The detection circuit comprises a sensing circuit and a signal generation circuit. The signal generation circuit includes a calibration circuit. The sensing circuit senses an output power signal of a power supply unit for obtaining a sensing impedance. Thereby, a corresponding power sensing signal is generated according to the sensing impedance and the output power signal. The signal generation circuit generates a power ratio signal. The calibration circuit generates a calibrating signal according to the power ratio signal for driving the signal generation circuit to perform feedback control for generating the power ratio signal. The power ratio signal will match the load condition and be applied to provide the output power signal with less error.

Abstract: A device may perform impedance spectroscopy on a component under test. The frequency response analyzer circuitry may be coupled to the component under test outside of a current loop supplying an operational current to the component under test. The frequency response analyzer circuitry may drive a variable impedance circuit to generate an oscillating current component within the current loop. The frequency response analyzer circuitry may monitor a frequency response of the component under test to the oscillating current component.