Patents Examined by Rence R. Berry
  • Planarization process using artificial gravity
    Patent number: 5714417
    Abstract: The time needed to planarize the surface of an integrated circuit is reduced by causing the planarization liquid to settle in the presence of artificial gravity that supplements natural gravity. A number of different ways to achieve artificial gravity are described. These include centrifuging, magnetic repulsion, vertical pulling by a motor, and providing a pressure differential between the top and bottom sides of the wafer holder.
    Type: Grant
    Filed: August 22, 1996
    Date of Patent: February 3, 1998
    Assignee: Vanguard International Semiconductor Corporation
    Inventor: Linliu Kung