Patents Examined by Rhadames Alonzo Miller
  • Patent number: 11848121
    Abstract: An electrical feed-through apparatus is prevents or substantially reduces partial corona discharges in penetrators for high voltage supply for underwater facilities. A flange of a first thickness has an opening providing a passage between first and second oppositely located sides of the flange. An elongated tube of a solid, electrically insulating material has a first length greater than the first thickness, and is positioned in the passage, with first and second parts of the tube protruding from the first and second sides of the flange, respectively. First and second attachment sleeves are positioned on the tube and are attached to the first and second parts of the tube, respectively, at a distance from respective first and second ends of the tube. The sleeves are attached to the respective first and second oppositely located sides of the flange.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: December 19, 2023
    Assignee: Sentech AS
    Inventors: Morten Halleraker, Helmut Mayer, Gunter Bitz
  • Patent number: 11811180
    Abstract: Provided herein are semiconductor packages with improved electrical contacts (e.g. pins). In some embodiments, an assembly may include a substrate and an electrical contact coupled to the substrate, the electrical contact consisting of a first component defined by a complex 3D designed receiving pin. The electrical contact may further include a second component defined by another complex 3D designed penetrating pin, wherein the first component engages the second component to deform mechanically and to weld when the first component and the second component are coupled together.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: November 7, 2023
    Assignee: IXYS Semiconductor GmbH
    Inventors: Yong Ai-Ong, Thomas Spann
  • Patent number: 11791069
    Abstract: A grommet includes a fitting body causing a circumferential edge portion of a through hole provided in a wall body to be fitted into a fitting groove provided in an outer wall, and a first cylinder and a second cylinder causing a harness body to be extracted through the cylinder. The fitting body includes a cylindrical portion, a plurality of ribs rising from an outer circumferential wall surface of the cylindrical portion and disposed on the outer circumferential wall surface at equal intervals in a circumferential direction, and a first support portion and a second support portion provided for each of the ribs. The first support portion and the second support portion project from the outer circumferential wall surface to be high enough to suppress elastic deformation of the rib in the circumferential direction toward the outer circumferential wall surface.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: October 17, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Hirotaka Kiyota, Masaru Kiuchi, Takeshi Onoda, Junya Kato
  • Patent number: 11784625
    Abstract: A packaging method and package structure for a filter chip. The packaging method includes providing a circuit substrate, covering a first surface of the circuit substrate and/or filter chip with adhesive material and forming recessed cavities or closed cavities in the adhesive material. The method further includes adhering the filter chip to the first surface of circuit substrate via the adhesive material, such that surface acoustic wave transmitting regions of the filter chip correspond to the recessed cavities or closed cavities in the adhesive material to form a gap therebetween, and encapsulating the filter chip with encapsulating material. The method further includes forming interconnecting holes extending from a second surface of the circuit substrate to pins of the filter chip, filling the interconnecting holes with conductive material, so that the conductive material is in electrical contact with a chip pin bump or pad metal of the filter chip, and forming external pin pads on the second surface.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: October 10, 2023
    Assignee: GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
    Inventors: Yingqiang Yan, Chuan Hu, Zhitao Chen
  • Patent number: 11783965
    Abstract: The application discloses a flat cable assembly, which includes a plurality of cables arranged in a row and an insulating film. The cables have a center line and include connecting portions, a signal wire and a grounding wire respectively. The connection portions are located on one side of the center line. The insulating film is disposed on the connecting portion of any one of the cables and located on one side of the central line. The cables are exposed from the insulating film. The insulating film is disposed on a single side of the cables, whereby the cables are exposed from the insulating film. The flat cable assembly is easily manufactured and the amount of the cables therein can be varied according to real practice condition. The grounding wire is integrated to each cable, whereby the flat cable assembly has an excellent anti-EMI effect and performance in signal transmission.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: October 10, 2023
    Assignee: LUXSHARE TECHNOLOGIES INTERNATIONAL, INC.
    Inventors: ZhongChao Peng, JinChang Dai, BenTao Hu, HuanZhong Yan, Andrew John Nowak, Charles Lloyd Grant
  • Patent number: 11776711
    Abstract: A wire harness including: a first wire bundle that includes a plurality of wires; a second wire bundle that includes fewer wires than the first wire bundle; a splice body; and a waterproofing cover, wherein: the wires of the first wire bundle and the second wire bundle each include a conductor and an insulating covering that covers an outer circumference of the conductor, and each include an exposed portion at which the conductor is exposed from the insulating covering, at the splice body, the exposed portions of the first wire bundle and the exposed portions of the second wire bundle are bonded, and the waterproofing cover integrally covers the splice body, the outer surfaces of the insulating coverings of the first wire bundle, and the outer surfaces of the insulating covering of the second wire bundle with a resin material.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: October 3, 2023
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yutaka Takata, Shintaro Nambara
  • Patent number: 11777291
    Abstract: A sanitary wall installation connection box unit, including a box housing body having a rear-side base portion and a sleeve portion projecting to the front from the base portion, which sleeve portion peripherally surrounds a sanitary component mounting space, which space is accessible via an open front end face of the sleeve portion, and a connector body disposed on the base portion of the box housing body, which connector body includes a sanitary component connection contour facing the sanitary component mounting space, a fluid line connection interface structure accessible on an outer side of the box housing body, a fluid conduit structure for fluid connection of the fluid line connection interface structure to the sanitary component connection contour and at least one electric line feed-through opening leading from an outer side of the connector body through the connector body to the sanitary component mounting space.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: October 3, 2023
    Assignee: Hansgrohe SE
    Inventors: Joachim Blattner, Jürgen Schorer, Günther Lehmann, Thomas Doll, Philip Stephan, Christoph Heizmann, Marika Krämer
  • Patent number: 11751330
    Abstract: A dielectric substrate may support conductive traces that form windings for a least one pole of a planar armature of an axial flux machine. At least a portion of the dielectric substrate, which is adapted to be positioned within an annular active area of the axial flux machine, may include a soft magnetic material. Such a planar armature may be produced, for example, by forming the conductive traces on the dielectric substrate, and filling interstitial gaps between the conductive traces with at least one epoxy material in which the soft magnetic material is embedded.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: September 5, 2023
    Assignee: E-Circuit Motors, Inc.
    Inventors: George Harder Milheim, Steven Robert Shaw, Ryan Terrence Duffy, Edward Charles Carignan
  • Patent number: 11745675
    Abstract: A wiring harness (1010), a motor vehicle component (1000), a mold (15) for manufacturing a wiring harness (1010), a mold system (10) and a method for manufacturing the wiring harness (1010), the wiring harness (1010) comprising at least one bunch (1020) of at least two cables (1025) and a sheath (1030), at least some sections of the bunch (1020) of cables being embedded in the sheath (1030).
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: September 5, 2023
    Assignee: YAZAKI SYSTEMS TECHNOLOGIES GMBH
    Inventors: Martin Einert, Gotz Roderer, Dietrich Von Knorre, Aldo Navarro Malaga, Adam Neal
  • Patent number: 11742109
    Abstract: Provided are a flexible flat cable and a method of producing the same.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: August 29, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bumhee Bae, Youngkun Kwon, Minseok Kim, Younho Kim, Changwon Jang, Jeongnam Cheon
  • Patent number: 11742645
    Abstract: Disclosed are embodiments of a round floor grommet and a rectangular floor grommet. These floor grommets can be constructed in any desired shape other than round or rectangular. Frame portions that hold foam pieces are joined together to form a primary slit in the floor grommet. Cross slits can also be formed in the foam material. The foam is a semi-closed cell foam that is constructed from PVC and nitrile butadiene rubber which has superior sealing effects since the foam can conform around objects passing through the slits in the floor grommet and seal any flow of air through the slits.
    Type: Grant
    Filed: March 7, 2023
    Date of Patent: August 29, 2023
    Assignee: Raymond & Lae Engineering, Inc.
    Inventors: Donald M. Raymond, Jeremy D. Swanner, Timothy L. Hirschenhofer, James M. Schneider
  • Patent number: 11735339
    Abstract: A current feedthrough seal assembly (1) for insertion into and sealing a wall opening (WO) of a climate chamber (KK) comprises a plastic core (10) formed in a step-like shape in an axial direction thereof so as to be inserted into the wall opening (WO) of the climate chamber (KK), so that, when inserted, substantially the whole of the plastic core (10) is located in the wall opening (WO), and a flange (11) is formed at an axial end of the plastic core (10) to protrude beyond the wall opening in the radial direction of the plastic core (10) to abut against one (I) of an internal or external wall (I, A) of the climate chamber (KK), at least two elongated power conducting members (20) accommodated in parallel to each other inside the plastic core (10) and extending through the plastic core (10) and a press ring seal (30) interposed between an inner peripheral surface of the wall opening (WO) and an outer peripheral surface of the plastic core (10) on an opposite axial side thereof with respect to the flange (11)
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: August 22, 2023
    Assignee: National Instruments Germany GmbH
    Inventor: Michael Hanigk
  • Patent number: 11699536
    Abstract: A shielded electrical ribbon cable includes adjacent first and second longitudinal conductor sets where each conductor set includes two or more insulated conductors. The first conductor set also includes a ground conductor that generally lies in the plane of the insulated conductors of the first conductor set. At least 90% of the periphery of each conductor set is encompassed by a shielding film. First and second non-conductive polymeric films are disposed on opposite sides of the cable and form cover portions substantially surrounding each conductor set, and pinched portions on each side of each conductor set. When the cable is laid flat, the distance between the center of the ground conductor of the first conductor set and the center of the nearest insulated conductor of the second conductor set is ?1, the center-to-center spacing of the insulated conductors of the second conductor set is ?2, and ?1/?2 is greater than 0.7.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: July 11, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Douglas B. Gundel, Rocky D. Edwards, Mark M. Lettang, Charles F. Staley
  • Patent number: 11695263
    Abstract: Methods for installing electronic connections into a Factory Mutual certified cabinet may comprise providing a double walled cabinet. The double walled cabinet ay comprise an outer cabinet wall, and inner cabinet wall, and an airgap between the inner cabinet wall and the outer cabinet wall. The method may comprise the steps of including a first large hole in a surface of the outer cabinet wall and including a first small hole in a surface of the inner cabinet wall. Methods can additionally include the steps of inserting a first bulkhead fitting into the first small hole in the surface of the inner cabinet wall via the first large hole and covering the first large hole in the surface of the outer cabinet wall. Methods may additionally include the first small hole at least partially overlapping the first large hole when viewed from a plane normal to the first large hole.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: July 4, 2023
    Assignee: JUSTRITE MANUFACTURING COMPANY, L.L.C.
    Inventor: Ronald Frank Auer
  • Patent number: 11678439
    Abstract: A circuit board includes a substrate, a plurality of contacts disposed on a surface of the substrate, and a solder mask. The contacts have a plurality of plating regions and a metal layer on the plating regions, and the plating regions have at least two different sizes. The solder mask covers the surface of the substrate and covers edges of the plating regions, in which topmost surfaces of the contacts are below a top surface of the solder mask, and a gap between the topmost surfaces of the contacts and the top surface of the solder mask is larger than 0 ?m and is smaller than 5 ?m.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: June 13, 2023
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Pei-Chi Hu, Jui-Chung Lee, Chi-Wen Lin
  • Patent number: 11678472
    Abstract: A signal transmission cable includes a signal line, an insulation layer covering the signal line, and a shield layer covering the insulation layer. A first oxygen amount A1 on an outer peripheral surface of the insulation layer is 1.2 times or greater than a second oxygen amount A2 inside the insulation layer, or a contact angle on the outer peripheral surface the insulation layer is 130° or less, or an adhesion-wetting surface energy on the outer peripheral surface the insulation layer is 27 mJ/m2 or greater, or a first amount of a hydroxy group on the outer peripheral surface of the insulation layer is greater than a second amount of a hydroxy group inside the insulation layer.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: June 13, 2023
    Assignee: Proterial, Ltd.
    Inventors: Kazufumi Suenaga, Takahiro Sugiyama, Hideyuki Sagawa
  • Patent number: 11670445
    Abstract: An inductor component includes first and second inductor wiring lines, a first vertical wiring line, a second vertical wiring line, and a third vertical wiring line, wherein the first vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the first inductor wiring line, respectively, and the third vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the second inductor wiring line, respectively.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: June 6, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshimasa Yoshioka, Kouji Yamauchi
  • Patent number: 11665812
    Abstract: A metal member-equipped circuit board 21 includes: a printed circuit board 22 including a through hole 25; a metal member 30 including a shaft portion 31 that is inserted into the through hole 25, and a head portion 32 that is arranged outside the through hole 25, the head portion 32 having a diameter larger than a diameter A1 of the through hole 25, and a conductive bonding material 35 for bonding the shaft portion 31 and an inner wall of the through hole 25 to each other.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: May 30, 2023
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Koki Uchida, Yukinori Kita
  • Patent number: 11664137
    Abstract: A shielded electrical ribbon cable includes adjacent first and second longitudinal conductor sets where each conductor set includes two or more insulated conductors. The first conductor set also includes a ground conductor that generally lies in the plane of the insulated conductors of the first conductor set. At least 90% of the periphery of each conductor set is encompassed by a shielding film. First and second non-conductive polymeric films are disposed on opposite sides of the cable and form cover portions substantially surrounding each conductor set, and pinched portions on each side of each conductor set. When the cable is laid flat, the distance between the center of the ground conductor of the first conductor set and the center of the nearest insulated conductor of the second conductor set is ?1, the center-to-center spacing of the insulated conductors of the second conductor set is ?2, and ?1/?2 is greater than 0.7.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: May 30, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Douglas B. Gundel, Rocky D. Edwards, Mark M. Lettang, Charles F. Staley
  • Patent number: 11659648
    Abstract: A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: May 23, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik AG
    Inventors: Marco Gavagnin, Jonathan Silvano de Sousa