Patents Examined by Rhonda E Sands
  • Patent number: 6230394
    Abstract: The present invention relates to a transfer type circuit board fabricating system including a conveyor device for transferring circuit boards in a predetermined transfer direction through a component placing device for placing electronic components on the circuit boards. The conveyor device includes a pair of conveying surfaces for conveying the circuit boards and a pair of board supports for supporting one of the circuit boards. Each board support extends between and is supported by the pair of conveying surfaces. A table having a surface is situated below both the pair of conveying surfaces and the pair of board supports. A pair of deflection shields extend from and at an acute angle with respect to the surface of the table to terminate at an edge. Each edge is flush with and adjacent to one of the conveying surfaces and is also beneath the pair of board supports.
    Type: Grant
    Filed: June 16, 1999
    Date of Patent: May 15, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Larry W. McWilliams
  • Patent number: 6219902
    Abstract: An efficient and repeatable method for manufacturing a protectively coated helical conductor antenna. The helical conductor is threaded onto a temporary, removable support, such as a bolt including a shaped head and a shank having threads to hold the helical conductor. After being threaded on the bolt, the entire winding and the bolt shank are placed within an injection mold cavity. The mold also includes a recess outside of the injection cavity for accommodating the bolt head, with the recess being shaped to permit a specific orientation for the bolt. The shape of the bolt head and the recess define a repeatable orientation for the bolt and helical conductor. As a result, the point of injection relative to the helical winding may be exactly repeated time and time again. This allows selection of an injection point relative to the helical winding that produces minimal deformation, and the obtainment of consistent results thereby reducing variation and necessary manufacturing tolerances.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: April 24, 2001
    Assignee: T & M Antennas
    Inventors: Stephan D. Memmen, Douglas Schneiderman
  • Patent number: 6205658
    Abstract: A metal wiring forming process in which an insulating film is formed on the principal surface of a substrate. Grooves or via holes are formed in the insulating layer and then a barrier film and a metal film in this order are formed on the substrate. Thereafter, the principal surface of the resulting substrate is smoothed until the insulating film is exposed completely and the grooves or via holes are filled with the metal film. The surface smoothing process includes a first polishing stage of conducting chemical mechanical polishing until the surface of the barrier film is exposed, and a second polishing stage of conducting mechanical polishing to polish the whole resulting surface at a constant rate.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: March 27, 2001
    Assignee: NEC Corporation
    Inventor: Masaya Kawano
  • Patent number: 6186904
    Abstract: A weighted sport training assembly used to overload the muscles while making sport specific movements during sport training. The principle can be applied to several sports implements such as a golfclub, a tennis or squash racquet, hockey stick, baseball bat, and other similar sports devices. The Golf Swing Training Club is an assembly of golfclub pieces and weights combined to offer an individual training a golf swing, or performing exercises that are either technical in nature, or fitness related, the opportunity to change the shape, length, or weight of the club by adding an extension shaft and inserting a variety of weights into the assembly.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: February 13, 2001
    Inventor: Richard S. Bass
  • Patent number: 6178629
    Abstract: A replaceable chip module for electrically connecting one or more first circuit members to a second circuit member. The replaceable chip module includes a module housing has a plurality of device sites each capable of receiving at least one first circuit member. A first connector is located in each of the device sites. The first connector includes one or more first contact members having a first compliant member defining a first circuit interface engageable with the first circuit member, a resilient, dielectric encapsulating material defining a second compliant member surrounding a portion of the first contact member, the first and second compliant members providing a first mode of compliance, and at least one end stop positioned to engage with the first contact member in a second mode of compliance. A second connector is positioned to electrically connect the first connector to the second circuit member.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: January 30, 2001
    Assignee: Gryphics, Inc.
    Inventor: James J. Rathburn
  • Patent number: 6170151
    Abstract: An assembly for processing a flexible tape comprises a carrier frame having a slot and a cut-out region contiguous with one end of the slot for selectively transferring the flexible tape from the top surface of the carrier frame to the bottom surface of the carrier frame. An apparatus for processing the flexible tape is also disclosed and includes the carrier frame, a base having an aperture and a platform sized to fit within the aperture of the base. The base is pivotable around one end of the platform.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: January 9, 2001
    Assignee: Tessera, Inc.
    Inventors: Joseph Link, Kurt Raab
  • Patent number: 6167612
    Abstract: An apparatus for the making and breaking of a plug and socket connection within a hazardous environment by remote handling means includes at least one receiving bracket adapted to receive a positioning and retaining plate. The positioning and retaining plate has one of a plug and a socket fixed thereto in a predetermined orientation to permit making or breaking of a connection with the other of a plug and a socket. The at least one receiving bracket and the fixed plug or socket are movable in a direction parallel to the axis of the fixed plug or socket on slider means. The apparatus includes means for moving the at least one receiving bracket and the fixed plug or socket relative to the other of a plug and a socket which is fixed in a co-operating axial and rotational orientation thereto so as to make or break the connection. The at least one receiving bracket has means to permit the fixed plug or socket to be placed in or removed from the at least one receiving bracket by the remote handling means.
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: January 2, 2001
    Assignee: British Nuclear Fuels plc
    Inventor: David Frank Cunliffe
  • Patent number: 6167602
    Abstract: The present invention provides a novel lamp removal tool which can be used to advantageously remove a hot lamp from a lamp module that has limited access space by not requiring the cool-down of the system such that a burned-out lamp can be quickly removed and replaced causing minimal impact on the fabrication process.
    Type: Grant
    Filed: May 6, 1999
    Date of Patent: January 2, 2001
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chao Sheng Yang, Jing Long Yang
  • Patent number: 6125531
    Abstract: A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, providing a fill member including a quantity of fill material and reinforcement means located within the fill material, positioning the fill member on the dielectric over the holes and thereafter applying a predetermined force sufficient to cause only the fill material to be forcibly driven into the accommodating hole(s), not the reinforcement means. Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: October 3, 2000
    Assignee: International Business Machines Corporation
    Inventors: Donald S. Farquhar, Voya R. Markovich, Kostas I. Papathomas, Leonard L. Schmidt
  • Patent number: 6120364
    Abstract: A grinding fixture that allows a variety of helical shapes to be ground upon a variety of cutting inserts. The grinding fixture includes a bottom sine base for varying a first angle. A shaft is rotatably attached to the bottom sine base for providing rotation of the insert about an axis. A primary slide is rotatably attached to the shalt in parallel relation to the top surface of the bottom sine base for adjusting the position of a locating point on the insert in a first direction relative to the axis of rotation. The locating point is adjusted in a second direction relative to the axis of rotation by a cross slide attached to, and disposed in perpendicular relation with, the primary slide. A top sine assembly is fixedly attached to the cross slide for varying a second angle and includes a connection surface for fixedly connecting the insert holder to the sine assembly.
    Type: Grant
    Filed: July 6, 1999
    Date of Patent: September 19, 2000
    Inventor: Robert Laflamme
  • Patent number: 6101712
    Abstract: A connector assembly useful in grounding applications is provided which includes an insulative housing and a conductive ground shell. The insulative housing includes a passage into which a contact and a cable may be inserted, and a passage which provides access to an inserted contact and cable to facilitate electrical and mechanical connection thereof. Passages in the insulative housing are also provided for inserting legs of the conductive ground shell into the insulative housing to electrically engage the ground wire braid of the cable. The insulative housing and conductive ground shell are constructed and arranged so that the various components readily mate with one another.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: August 15, 2000
    Assignee: Osram Sylvania Inc.
    Inventor: John O. Wright
  • Patent number: 6098277
    Abstract: A tool for removing a part, such as stand-off, associated with a circuit board includes a generally cylindrical elongated housing which includes open top and bottom ends and defines a recess therein. An elongated punch member is slidably disposed in the recess. First and second stopper members are positioned in the recess adjacent top and bottom ends, respectively, and a third stopper member is positioned in the recess between the first and second stopper members. A spring member is biased between the first and third stopper members. The second and third stopper members are fixedly attached to the punch member and the first stopper member is fixedly attached to the housing.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: August 8, 2000
    Inventors: William C. Hess, Alan D. Slayton