Patents Examined by Robert A. Rose
  • Patent number: 10730160
    Abstract: This invention relates to methods and materials for slip ring grinding of a generator rotor, without the need of dismounting the slip ring from the rotor of the generator, and allowing the grinding process to be performed whilst the generator is on full-load operation. As such the methods and materials of the present invention differs from current solution. Whilst allowing on-line grinding of the slip ring, the current solutions require low-speed rotations and accordingly operational shutdown of the generator. Allowing on-load grinding, the present invention greatly shortens the downtime of the generator and to perform maintenance on the slip ring beyond the provided standard maintenance schedule.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: August 4, 2020
    Assignee: MERSEN BENELUX BV
    Inventors: Peter Jacques Ovaere, Pieter-Jan Patrick Schepens
  • Patent number: 10722995
    Abstract: A method of manufacturing a window for a display apparatus according to the present invention includes: providing, on a stage, a substrate including a foldable part bending around a folding axis extending in a first direction, and forming a groove on the foldable part. The forming the groove includes: grinding the foldable part by using a first machining wheel; grinding the foldable part by using a second machining wheel; and machining the foldable part by using a polishing wheel. The groove has at least one radius of curvature. The first machining wheel includes first abrasive grains, and the second machining wheel includes second abrasive grains less in size than the first abrasive grains.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: July 28, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Cheolmin Park, Hoikwan Lee, Seung Kim, Jaejoong Kwon, Eun-kyung Yeon, Minsoo Kim, Seungho Kim, Jong-hoon Yeum
  • Patent number: 10710558
    Abstract: A cleaning device for cleaning and/or polishing a surface having an aperture, such as a wheel rim contact surface of a motor vehicle or the like, comprises a housing, which has a rear rotary portion for rotating the housing about a rotational axis and a front fastening portion for releasably fastening a cleaning body; the cleaning body comprising a stabilising plate which faces the housing and has a centring pin that faces away from the housing and projects centrically towards the outside, and a cleaning means that covers the surface of the stabilising plate that faces away from the housing; and the fastening portion and the stabilising plate each having a corresponding connecting means for rotationally stable connection to one another.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: July 14, 2020
    Inventor: Michael Mueller
  • Patent number: 10702968
    Abstract: A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: July 7, 2020
    Assignee: M Cubed Technologies, Inc.
    Inventors: Edward J. Gratrix, Brian J. Monti
  • Patent number: 10702935
    Abstract: A process for improving the excitation behavior of a ground bevel gear set by altering the surface structure of a gear set member from tooth slot to tooth slot (Teeth 1-3). The method comprises shifting the roll-positions in a way that not every facet or flat (F) is positioned the same way on each flank (2) and/or changing the distances of the roll angle along a tooth slot (delta RPj) whereby flats are spaced unequally (i.e. varying widths) along the tooth. One or more additional processes for altering the surface structure may be included.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: July 7, 2020
    Assignee: THE GLEASON WORKS
    Inventors: Sebastian Strunk, Hermann J. Stadtfeld
  • Patent number: 10707069
    Abstract: A method of polishing a semiconductor wafer includes polishing a surface of the semiconductor wafer using a polishing pad while supplying a polishing agent slurry containing abrasives during a first step. The polishing pad is free of abrasives and includes a first surface that contacts the semiconductor wafer, the first surface having a surface structure including elevations. Supply of polishing agent slurry is subsequently ended and, in a second step, the surface of the semiconductor wafer is polished using the polishing pad while supplying a polishing agent solution having a pH value of at least 12 that is free of solids.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: July 7, 2020
    Assignee: SILTRONIC AG
    Inventors: Juergen Schwandner, Michael Kerstan
  • Patent number: 10688622
    Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: June 23, 2020
    Assignee: Ebara Corporation
    Inventors: Hiroshi Aono, Kuniaki Yamaguchi, Hiroshi Shimomoto, Koji Maeda, Tetsuya Yashima, Kenji Shinkai, Koichi Hashimoto, Mitsuhiko Inaba, Hidetatsu Isokawa, Hidetaka Nakao, Soichi Isobe
  • Patent number: 10682735
    Abstract: A surfacing apparatus supported adjacent a substantially vertical surface of a structure for applying an even and uniform texture to the surface of the structure using a selectively adjustable force exerted on a texturing means to engage the surface of the structure. The surfacing apparatus is suited for horizontal and vertical movement in controlled prescribed paths under controlled and prescribed pressure from the adjustable tensioning means. The surfacing apparatus can include a texturing head that can be configured to conform to the contour of a curved work surface to apply an even and uniform texture thereon.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: June 16, 2020
    Assignee: Vertical Concrete Polishing Inc.
    Inventor: Mark Jack Richardson
  • Patent number: 10682736
    Abstract: A power tool is provided including a motor driving a shaft and a drive spindle. The drive spindle includes an outer spindle rotatably driven by the shaft and an inner spindle disposed within the outer spindle. The outer spindle includes an end portion defining an engagement surface for mounting a working accessory, and the inner spindle is axially moveable along a longitudinal axis of the outer spindle but rotationally fixed to the outer spindle. A spring member is arranged to apply a biasing force on the inner spindle in a first direction with respect to the outer spindle. Securing the working accessory on the drive spindle against the engagement surface of the outer spindle applies an axial force on the inner spindle in a second direction opposite the first direction with respect to the outer spindle.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: June 16, 2020
    Assignee: Black & Decker Inc.
    Inventors: Kyle J. Christophersen, Earnest N. Copeland, Jr.
  • Patent number: 10661407
    Abstract: A hand-held machine tool (1) for sanding or polishing a workpiece features a housing (2); a motor (4) for rotating a tool shaft (5) of the machine tool about its axis of rotation (6); and a backing pad (3) for releasable attachment of a sanding or polishing element thereto and eccentrically attachable to the tool shaft by an eccentric element (11) to allow the backing pad to perform a working movement. The machine tool implements different working movements of the backing pad attached thereto. The housing includes first magnetic elements (16) facing the backing pad. The backing pad attached to the eccentric element includes second magnetic elements (17) facing the housing. The machine tool implements a first working movement if a magnetic force is active between some first and second magnetic elements and a second working movement if no magnetic force is active between the first and second magnetic elements.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: May 26, 2020
    Inventor: Guido Valentini
  • Patent number: 10654143
    Abstract: The machine for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, includes a base framework, means for advancing at least one sheet-like element on a movement plane (A) along an advancement direction (B), the sheet-like element being provided with a pair of opposite first sides to be ground and a front side transversal to the first sides and defining the advancement front of the sheet-like element, means for machining the first sides adapted to intercept the sheet-like element in the motion thereof along the advancement direction (B), means for square-positioning the sheet-like element on the movement plane (A) comprising at least one abutment element which defines at least two support points adapted to contact the front side for arranging it in a position orthogonal to the advancement direction (B).
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: May 19, 2020
    Assignee: ANCORA S.P.A.
    Inventors: Mario Corradini, Antonio Stefani
  • Patent number: 10646976
    Abstract: There is furnished a working tool comprising a rotating shaft (6), a polishing plate (3) mounted on the shaft, an expandable elastomer sheet (4) attached to the polishing plate (3), an abrasive cloth (5) attached to the elastomer sheet (4), and means for pressing the elastomer sheet (4) at a plurality of positions under respective predetermined different pressures such that a lower surface of the abrasive cloth (5) is deformed to the desired inverted convex shape in accordance with differences of pressing force applied to the elastomer sheet (4) at the plurality of positions. A substrate is produced by bringing the inverted convexly deformed surface of the abrasive cloth (5) in contact with a substrate stock, and rotating and moving the working tool for polishing the substrate over a selected area.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: May 12, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoko Ishitsuka, Atsushi Watabe, Masaki Takeuchi
  • Patent number: 10639763
    Abstract: A method of grinding a surface of a crankshaft is provided. The method includes grinding the surface of the crankshaft by a grinding wheel, and polishing the surface of the crankshaft ground by the grinding wheel by oscillating a polishing wheel in a transverse direction perpendicular to a longitudinal direction of the crankshaft.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 5, 2020
    Assignee: Ford Motor Company
    Inventor: Michael A. Kopmanis
  • Patent number: 10632552
    Abstract: A saw blade is provided having a noise and stress-reduction structure, the saw blade having a structure in which a plurality of diamond segments are mounted at a first unit and the first unit has a second unit, thereby reducing the noise generated during a cutting operation, while increasing heating performance with a relatively simple configuration, and simultaneously dispersing impact stress so as to prevent the occurrence of cracks.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: April 28, 2020
    Assignee: SHINHAN DIAMOND IND. CO., LTD.
    Inventor: Shin kyung Kim
  • Patent number: 10632587
    Abstract: To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: April 28, 2020
    Assignee: EBARA CORPORATION
    Inventors: Masayuki Nakanishi, Toshifumi Watanabe, Kenji Kodera
  • Patent number: 10632590
    Abstract: The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 28, 2020
    Assignees: FUJIKOSHI MACHINERY CORP., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masayuki Tsukada, Kazutaka Shibuya, Takayuki Fuse, Yoshio Nakamura, Shiro Hara
  • Patent number: 10625393
    Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for planarizing at least one of semiconductor, optical and magnetic substrates comprising a polishing layer that has a geometric center, and in the polishing layer a plurality of offset circumferential grooves, such as circular or polygonal grooves, which have a plurality of geometric centers and not a common geometric center. In the polishing layer of the present invention, each circumferential groove is set apart a pitch distance from its nearest or adjacent circumferential groove or grooves; for example, the pitch increases on the half or hemisphere of the polishing layer that is farthest from the geometric center of its innermost circumferential groove and decreases on the half of the polishing layer nearest that geometric center. Preferably, the polishing layer contains an outermost circumferential groove that is complete and continuous.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 21, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh
  • Patent number: 10625392
    Abstract: The present invention is a polishing pad formed by foamed polyurethane, with a content of S phase in the foamed polyurethane, as determined by pulsed NMR measurement at 25° C., exceeding 70%.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: April 21, 2020
    Assignee: NITTA HAAS INCORPORATED
    Inventors: Yohei Murakami, Nobuyuki Oshima, Hiroyuki Nakano
  • Patent number: 10625390
    Abstract: A polishing apparatus of the present disclosure polishes a polishing target by pressing the polishing target against a polishing pad. An eddy current sensor measures an impedance that is changeable according to a change of a film thickness of the polishing target, at a plurality of positions of the polishing target, and outputs measurement signals. A difference calculator generates data corresponding to a film thickness based on a measurement signal. The difference calculator calculates a difference between data at different times based on measurement signals output by the eddy current sensor at different times at a center of the polishing target. An end point detector detects a polishing end point indicating the end of polishing based on the difference calculated by the difference calculator.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 21, 2020
    Assignee: EBARA CORPORATION
    Inventors: Taro Takahashi, Akihiko Ogawa
  • Patent number: 10625397
    Abstract: The present invention relates to a grind machining apparatus, which comprises a grinding wheel and an electrochemical processing module. The grinding wheel has a grinding surface on the surface. The electrochemical processing modules is disposed at the grinding wheel. The processing surface of the electrochemical processing module faces the direction away from an axle of the grinding wheel and is located lower than the grinding surface. By using the above grind machining apparatus, alternate compound machining including electrochemical oxidation processing and mechanical grind machining can be performed.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: April 21, 2020
    Assignee: Metal Industries Research & Development Centre
    Inventors: Zhi-Wen Fan, Jia-Jin Li, Da-Yu Lin