Abstract: A polishing pad is provided. The polishing pad includes a base layer, a top layer, and multiple grooves. The top layer is located over the base layer and has a polishing surface and a bottom surface opposite to each other. The bottom surface is connected to the base layer. The grooves are formed on the bottom surface of the top layer.

Abstract: Provided is a polishing pad capable of sufficiently reducing minute defects to be generated after polishing on a workpiece which are detected in measurement for a particle size of 26 nm or smaller and capable of providing the workpiece with excellent surface flatness. The polishing pad includes a polishing layer having a polishing surface to polish a workpiece, and includes, in the side opposite to the polishing surface of the polishing layer, an intermediate layer having an amount of deformation C larger than that of the polishing layer, a hard layer having an amount of deformation C smaller than that of the polishing layer, and a cushion layer having an amount of deformation C larger than that of the intermediate layer, in which each of the amounts of deformations C is defined as an amount of deformation in the case of compression in a thickness direction, and the intermediate layer, the hard layer, and the cushion layer are laminated in this order from the side of the polishing layer.

Abstract: Disclosed herein is a method for inner surface finishing of a workpiece, in which the inner surface of the workpiece defines an opening with axial symmetry around the longitudinal axis of the workpiece. The method may include the following steps. An abrasive medium may be poured inside the opening; urging the abrasive medium to rotate about the longitudinal axis, thereby imposing a centrifugal force on the abrasive medium to accelerate the abrasive medium outwards from the center of rotation towards the inner surface of the opening, where the abrasive medium impacts the inner surface of the opening; and the workpiece may be rotated about the longitudinal axis in a direction opposite the first direction, concurrently.

Abstract: A material loading apparatus includes a movable material support surface that is pivotally mounted to the frame. The loading apparatus also includes a first link that extends between the support surface and the frame and is pivotally connected to the support surface at a first end of the first link and pivotally connected to the frame at a second end of the first link. The loading apparatus also includes a second link that extends between the support surface and the frame and is pivotally connected to the support surface at a first end of the second link and pivotally connected to the frame at a second end of the second link. The loading apparatus also includes an actuator that is pivotally connected to the frame and configured to move the support surface between a generally horizontal position and a generally vertical position.

Abstract: A knife sharpener for the manual sharpening of knives that includes a knife clamp member having first and second clamping members, a guide member that defines upper and lower guide members, and a base member. Each upper and lower guide member includes a plurality of apertures sized and shaped for receiving a guide rod that includes a sharpening stone. The knife clamp member further includes embodiments assuring the knife blade is held securely and positioned between the first and second clamping members in the same position in which the knife blade was installed the last time it was sharpened.

Abstract: The invention relates to a sample carrier for a sample (70). Said sample carrier comprises a supporting base (10), a carriage (20) having a receiving region (30) for the sample (70), the carriage (20) being supported on the supporting base (10), a guide (40), the carriage (20) being movably arranged along the guide (40), and a disc (60) that is rotationally movable about an axis of rotation (50), said disc being operatively connected to the carriage (20), wherein a center (65) of the disc (60) is located outside of the axis of rotation (50).

Abstract: An articulated boom assembly comprises a base and a primary boom arm extending from the base. There is a power system for actuating the primary boom arm between an extended position and a retracted position. There is an attachment operatively connected to the primary boom arm which supports a nozzle. The attachment may include an actuating mechanism for reciprocating the nozzle along the length of the attachment.

Abstract: The present disclosure relates to lapping pads which include an abrading layer, wherein the abrading layer includes a working surface and a second surface opposite the working surface having a projected area Ap, and at least one cavity having a cavity opening located at the second surface, the at least one cavity being defined by at least one rib, each rib having a distal end at the second surface; and a phase transition material having a thermally reversible phase transition, wherein the phase transition material is disposed in the at least one cavity. The present disclosure further relates to a lapping system, the lapping system includes a lapping pad of the present disclosure and a working fluid; a method of making a lapping pad; and a method of lapping using a lapping pad of the present disclosure.

Abstract: Described herein is an improved abrasive material (300) in which the cutting performance is orientation-independent. The abrasive material (300) comprises an abrasive structure (310) including a plurality of elongate abrasive elements (320, 330) aligned to be define a first open square. A plurality of pyramidal abrasive elements (340, 350) arranged in a second open square are located within the first open square defined by the elongate elements (320, 330).

Abstract: A chemical mechanical polishing (abbreviated as CMP) conditioner comprises a bottom substrate, an intermediate substrate and a diamond film The intermediate substrate is provided on the bottom substrate. The intermediate substrate comprises a hollow portion, an annular portion surrounding the hollow portion, and at least one projecting ring projecting out of the annular portion away from the bottom substrate. The projecting ring comprises a plurality of bumps arranged to be spaced apart from each other along an annulus region. The bumps are extended in a radial direction of the intermediate substrate. The diamond film is provided on the intermediate substrate. The diamond film is allowed for conforming to the bumps, so as to form a plurality of the abrasive projections.

Abstract: A tile cutter includes a base, and a cutting head assembly including a supporting arm having one end pivotally connected to the base and an opposite end connected to the saw base for enabling the cutting head assembly to be biased relative to the base and selectively positioned in a standby position, a cutting position or a received position. When shifting the cutting head assembly from the standby position to the cutting position, the supporting arm is received by a stopper to limit the cutting depth of the cutting head assembly. When shifting the cutting head assembly from the cutting position to the received position, the stopper is moved to release the supporting arm. When the cutting head assembly is shifted to the received position, a part of the saw base and the saw blade are received in a sink in the base.

Abstract: A machining apparatus for a workpieces includes an upper turn table support mechanism supporting an upper turn table from above to be vertically movable by a cylinder extending along a rotational axis direction of the table, a horizontal plate fixed to the cylinder so that a main surface thereof becomes perpendicular to a longitudinal axis of the cylinder, at least three displacement sensors which measure horizontal plate surface height positions when the upper turn table has moved down to a fixed position, and a control apparatus to calculate a relative upper turn table height position and an angle formed between the upper turn table rotational axis and the cylinder longitudinal axis from the horizontal plate surface height positions measured by the displacement sensors. A workpiece holding abnormality can be accurately and quickly detected before machining the workpiece to avoid damage, and an cylinder eccentric angle can be detected during machining.

Abstract: A method for polishing a polishing pad includes detecting a presence of a defect formed on a groove of a polishing pad; removing the defect from the groove of the polishing pad; after removing the defect, measuring a remaining depth of the groove; and based on the measured remaining depth of the groove, applying a polishing condition on the groove.

Abstract: A polishing brush (1) includes a plurality of linear abrasive members (32) each formed by hardening an aggregated yarn of inorganic filaments by a resin binder, and a holder (2) that holds the linear abrasive members (32). The linear abrasive members (32) are held by a base (31). The base (31) is secured to a spindle (25) in the holder (2). In the spindle (25), a flow path (28) for discharging a liquid cutting agent toward a side on which free ends (33) of the linear abrasive members (32) are located is provided.

Abstract: An impeller for a centrifugal blast wheel machine includes a hub provided at one end of the impeller, with the hub being configured to be coupled to the motor. The hub further includes a ring provided at an opposite end of the hub, with the ring defining a media inlet to receive blast media. The impeller further includes a plurality of cylindrical vanes positioned between the hub and the ring. The plurality of cylindrical vanes is spaced from one another on peripheries of the hub and the ring. The plurality of cylindrical vanes defines a plurality of impeller media outlets constructed and arranged to allow egress of blast media upon rotation of the impeller.

Abstract: A polishing liquid for CMP, comprising: an abrasive grain including a cerium-based compound; a 4-pyrone-based compound; a polymer compound having an aromatic ring and a polyoxyalkylene chain; a cationic polymer; and water.

Abstract: The diamond surface polishing method according to the present invention involves polishing a polished object, the surface of which is made of diamond, by rubbing a polishing member having an elongated shape such as a linear or belt-like shape and containing at least a metal or a metal oxide against the diamond surface, wherein a pressing force of the polishing member is controlled in accordance with material properties of the polishing member and/or a shape of the polished object and a diamond crystal size in a rubbing section so that contact surface pressure in a machining area becomes uniform.

Abstract: An automated rover device removes material from opposite surfaces of an elongate part, such as a composite stiffener. The device includes a pair of material removal tools along with a vacuum assembly for vacuuming away material removed by the tools.

Abstract: The invention relates to a method for controlling an automated orbital sander, in which method an electrically powered orbital sander is moved around automatically, at constant pressure, over the surface of an object, along at least one predefined sanding path so as to perform sanding, characterized in that the instantaneous power consumed by the sander along the sanding path is measured and in that the measurement thus taken is processed in order to deduce therefrom information regarding the level of abrasion along said path and/or to detect any sanding incident that has occurred along the latter.

Abstract: The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).