Patents Examined by Robert B. David
  • Patent number: 5368802
    Abstract: A heat stake press apparatus is described for fixing a connecter to a circuit board by heat staking pegs of the connector, which facilitates alignment of the circuit board holes with forming tips in a low cost press. A pair of aligners (110, 112, FIG. 6 ) is provided that are each mounted at a forward edge of the board in alignment with a peg hole (22) of the board. The board is mounted on support guides (62, 64) of the press, and the board is slid forwardly until a pair of forming tips (52) are received in slots (124) of the aligners to sidewardly align the board. The support guides are then moved sidewardly so board guide pins (74A, 76A, FIG. 2 ) move against side edges (80, 82) of the board. Thereafter, the aligners are removed, a connector (14) is placed on the board with its pegs projecting down through the board holes, and the board is again placed in the press on the support guides.
    Type: Grant
    Filed: May 13, 1993
    Date of Patent: November 29, 1994
    Assignee: ITT Corporation
    Inventor: Christopher D. Wanha
  • Patent number: 5340294
    Abstract: A curing mold for pneumatic tires includes a plurality of segments which are detachably adjoined with each other in a direction corresponding to circumferential direction of a product tire. Each segment has a plurality of fitting pieces with fixing portions at both ends at least one which is complementary to part of the land portion of the tire. The fitting pieces are secured to and supported by a supporting block having an inner surface which is complementary to the land and groove portions of the tire, which is formed with fitting grooves for engaging the fixing portions of the fitting pieces therein.
    Type: Grant
    Filed: July 10, 1992
    Date of Patent: August 23, 1994
    Assignee: Bridgestone Corporation
    Inventor: Takehiro Kata