Abstract: One aspect of the present invention involves a hold-down and release mechanism (“HDRM”) that includes a hold-then-release mechanism configured to hold an element until the hold-then-release mechanism is commanded to release the element; and an integral sensor configured to sense an amount of a parameter of interest associated with the HDRM and to communicate the sensed amount of the parameter of interest to a receiving device. The parameter of interest comprises one of tensile preload, temperature, vibration, shock, and time from application of an HDRM firing current to HDRM release of the element.