Patents Examined by Robert Decker
  • Patent number: 5554821
    Abstract: A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the portable peripheral card is a PCMCIA card.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: September 10, 1996
    Assignee: National Semiconductor Corporation
    Inventors: Michael W. Patterson, Hem P. Takiar
  • Patent number: 5530202
    Abstract: A metallic RF or thermal shield (200, 200', 200") has a non-perforated area (202) around its center of mass, of a radius (203) sufficient for pick-up and placement of the shield by automatic vacuum pick-up equipment during automated surface-mount circuit assembly.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: June 25, 1996
    Assignee: AT&T Corp.
    Inventors: Jack L. Dais, Khalil N. Nikmanesh