Patents Examined by Robert E. Sellers
  • Patent number: 6730772
    Abstract: A polymer of a ring-opened functionalized epoxide is formed by the polymerization of a functionalized epoxide monomer having the structure E-CHR-G wherein E represents an epoxide group, R is hydrogen or an alkyl group, and G is a derivatizable group such as an unsaturated functionality or ester substituent.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: May 4, 2004
    Inventor: Venkatram P. Shastri
  • Patent number: 6723803
    Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: April 20, 2004
    Assignee: Raytheon Company
    Inventors: Ralph D. Hermansen, Steven E. Lau
  • Patent number: 6680018
    Abstract: A method of producing a stain-resistant and soil-resistant polyamide yarn comprises the steps of (a) melt compounding a sulfonated aromatic acid with a thermoplastic polyester or polyamide carrier resin to form a concentrate; (b) adding said concentrate to a fiber-forming polyamide to form a fiber-forming polyamide composition; (c) melt extrusion spinning said fiber-forming polyamide composition to form a yarn; and (d) drawing said yarn.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: January 20, 2004
    Assignee: Prisma Fibers, Inc.
    Inventor: Matthew B. Studholme
  • Patent number: 6673877
    Abstract: Binders for aqueous corrosion protection systems, comprising products A′ABC of reaction of epoxy resins, fatty acids, and amines, having a number average molar mass Mn of at least 5000 g/mol, obtained by reacting epoxide compounds A′ containing at least two epoxide groups per molecule and reaction products ABC of epoxide compounds A, fatty acids B, and amines C, wherein, where appropriate, the epoxide compounds A′ and/or the epoxide compounds A have been modified prior to further reaction, in whole or in part, by reaction with compounds D containing at least one acid group or hydroxyl group reactive toward epoxide groups, and wherein, where appropriate, the amines C have been modified prior to further reaction, in whole or in part, by reaction with aliphatic or aromatic monoepoxide compounds A″ or mixtures thereof.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: January 6, 2004
    Assignee: Solutia Austria GmbH
    Inventors: Willibald Paar, Manfred Krassnitzer, Maximilian Friedl, Roland Feola, Johann Gmoser
  • Patent number: 6667194
    Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: December 23, 2003
    Assignee: Henkel Loctite Corporation
    Inventors: Lawrence N. Crane, Mark M. Konarski, J. Paul Krug, Andrew D. Messana, John G. Woods
  • Patent number: 6664344
    Abstract: The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: December 16, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Hiromi Oki, Yoshiyuki Go, Sumiya Miyake, Yoshihito Akiyama
  • Patent number: 6660805
    Abstract: Epoxy-modified, two-part acrylic structural adhesives are disclosed. These adhesives are not inhibited by oxygen. Representative embodiments include 2-part acrylic structural adhesives comprising, in a first package from about 10 to about 90 percent by weight of at least one methacrylate selected from C3-C10 alkyl monosubstituted-, C1-C6 alkyl disubstituted-, C1-C4 alkyl tri-substituted, and F1-C4 alkyl tetra-substituted cyclohexyl methacrylate. The ring substituents are prefereably in the 3, 4, and/or 5 ring position, and linear or branched C4-C10 branched alkyl methacrylates; from about 10 to about 80 percent by weight of a toughener, and an adhesion promotor; and in a second package, a bonding activator, and optional epoxy resin.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: December 9, 2003
    Assignee: Lord Corporation
    Inventors: Robin F. Righettini, Jeffrey A. Hatcher
  • Patent number: 6660373
    Abstract: Curable thermoset resin compositions are described which are useful for imparting water and/or solvent resistance to gel coated fiber-reinforced polymers. Those compositions contain at least 5 weight-percent of an at least partially end-capped unsaturated polyetherester resin, an unsaturated polyester resin in a specified amount having a specified range of unsaturation, about 10 to about 70 weight-percent of at least one vinyl monomer and a curing agent. Methods and intermediates for making those compositions, use of the curable thermoset resin compositions to make fiber-reinforced polymer composites and skin laminate intermediates for the same, and articles manufactured using the same are also described. These compositions, methods and uses improve the chemical and/or water resistance of resin compositions, particularly composite materials having a gel coat.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: December 9, 2003
    Assignee: Cook Composites and Polymers Co.
    Inventors: Chih-Pin Hsu, Ming Yang Zhao, Linda Bergstrom
  • Patent number: 6656531
    Abstract: A method for forming a coated film comprises (1) applying a water or solvent based coating composition on an undercoated or intercoated substrate to form a base coating, (2) applying a clear coating composition thereon to form a clear coating without curing the base coating, and (3) heating and curing both the base coating and clear coating, wherein the clear coating composition comprises as a binder (a) from 10-70% by weight of an acrylic polycarboxylic acid having on average 2 or more carboxyl groups per molecule obtained by copolymerizing an acid anhydride group-containing ethylenically unsaturated monomer with an ethylenically unsaturated monomer having no acid anhydride group, then reacting the resulting copolymer with a monoalcohol; (b) from 5-70% by weight of a polyester polycarboxylic acid having an acid value of from 50-350 mg KOH/g (solid) obtained by reacting a polyester polyol having 3 or more hydroxyl groups with an acid anhydride group-containing compound; (c) from 10-80% by weight of a po
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: December 2, 2003
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Manabu Yoshioka, Akira Fushimi, Seigo Miyazoe, Masanobu Inoue, Yoshio Eguchi
  • Patent number: 6255364
    Abstract: A crosslinkable waterborne dispersion of an epoxidized polydiene block polymer composition which comprises: (a) 10 to 65% w of a polydiene block polymer containing at least five olefinic epoxy groups per molecule which are sterically hindered, (b) 0.2 to 25% w of a compatible aminoplast, (c) 0.1 to 10% w of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. The invention also describes a water-continuous process and an inversion processes for making such dispersions.
    Type: Grant
    Filed: February 16, 1995
    Date of Patent: July 3, 2001
    Assignee: Shell Oil Company
    Inventors: David John St. Clair, James Robert Erickson
  • Patent number: 6153672
    Abstract: A process for preparing a tris-lactam crosslinking agent, tris-pyrrolidonyl triazine, from N,N',N"-tris(4-chlorobutyryl)melamine by treatment of the chlorobutyryl derivative with a base such as sodium or potassium carbonate to effect intramolecular cyclization to the tris-lactam. A curable composition comprised of tris-pyrrolidonyl triazine as the crosslinking agent and a hydroxyfunctional or aminofunctional material as a resin. Thick films with no pinholes are prepared from the curable compositions using powder coating techniques.
    Type: Grant
    Filed: January 7, 1993
    Date of Patent: November 28, 2000
    Assignee: Cytec Technology Corp.
    Inventors: Ram B. Gupta, Robert G. Lees
  • Patent number: 6136305
    Abstract: A thickener comprises a water-in-oil reverse emulsion and a copolymer having moieties derived (i) from a monounsaturated monocarboxylic acid monomer containing from 3 to 5 carbon atoms, the monocarboxylic acid either being in free form or in the form of an inorganic salt, and (ii) from a monoacrylamide monomer. The copolymer is in solution in the aqueous phase constituting the emulsion, the oil phase of this emulsion consisting of a mixture of at least one volatile oil and at least one non-volatile oil. The weight ratio between the volatile oil and the non-volatile oil is between 90/10 and 10/90. The oil phase represents from 10 to 60% by weight of the whole. Water represents from 30 to 70% by weight of the whole. The copolymer represents from 10 to 30% by weight of the whole and a surfactant represents from 5 to 20% by weight of the whole.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: October 24, 2000
    Assignee: Societe d'Exploitation de Produits pour les Industries Chimiques, S.E.P.P.I.C.
    Inventors: Nelly Michel-Lecocu, Chantal Amalric
  • Patent number: 6136922
    Abstract: A curable composition comprisingA) a mixture ofA1) at least one polymer based on acrylate and/or methacrylate monomers and containing on average 0.1 to 4.0 equivalents of free carboxyl groups per kilogram of polymer, andA2) at least one carboxyl-terminated polyester which contains on average0.
    Type: Grant
    Filed: July 26, 1996
    Date of Patent: October 24, 2000
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Isabelle Frischinger, Jacques-Alain Cotting, Jacques Fran.cedilla.ois
  • Patent number: 6133377
    Abstract: The present invention provides an epoxy resin composition comprising: (a) an epoxy resin having two or more epoxy groups in each molecule; (b) a phenolic resin composition comprising a condensation product of: (i) a phenol; (ii) a compound having a triazine ring; and (iii) an aldehyde, the mixture or condensation product being substantially free from any unreacted aldehydes, or methylol groups; (c) a rubber component; and (d) a curing accelerator. The epoxy resin composition has minute protrusions having a maximum height (Ry) .ltoreq.1.0 .mu.m, formed on its surface by thermosetting at or above 80.degree. C. The invention also provides a process for manufacturing a multilayer printed-wiring board of the build-up type which has a formed copper plating layer.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: October 17, 2000
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Yuki Miyazawa, Tadahiko Yokota
  • Patent number: 6130297
    Abstract: A crosslinker composition based on a combination of 1,3,5-tris-(2-carboxyethyl)isocyanurate and a dicarboxylic acid crosslinking agent is provided. Also provided is a curable epoxy composition employing, as the crosslinker component, a combination of 1,3,5-tris-(2-carboxyethyl)isocyanurate and a dicarboxylic acid crosslinking agent, which curable composition finds use, for example, in coating applications.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: October 10, 2000
    Assignee: Cytec Technology Corp.
    Inventor: Subban Ramesh
  • Patent number: 6127508
    Abstract: An epoxy resin composition containing a) an epoxy resin and b) a liquid amine terminated polyamine curing agent prepared by condensing an aminoalkylpiperazine and a dicarboxylic acid. The epoxy resin composition typically requires less than 35% of solvent to produce a sprayable viscosity. A hydroxy-functional flexibilized resin is also produced by reacting (a) an epoxy resin, (b) a liquid aminoalkylpiperazine-based amine terminated polyamine and (c) a hydroxy-functional amine.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: October 3, 2000
    Assignee: Shell Oil Company
    Inventors: Larry Steven Corley, Martin L. Ehrlich
  • Patent number: 6119743
    Abstract: A tire tread comprises a copolymer of butadiene with isoprene and/or styrene having a room temperature elasticity of between 5 and 35% at 22.degree. C., polybutadiene rubber and an aromatic oil selected from the group consisting of an aromatic oil, naphthenic oil, paraffinic oil, and a mixture thereof.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: September 19, 2000
    Assignee: Huels Aktiengesellschaft
    Inventor: Walter Hellermann
  • Patent number: 6121339
    Abstract: An epoxy resin composition according to the present invention is one initiating cationic polymerization upon irradiation with energy rays. The epoxy resin composition is formed of at least bisphenol epoxy resin (A) as an active ingredient, epoxy resin (B) shown in the following formula and cationic polymerization catalyst (C).
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: September 19, 2000
    Assignee: Sony Chemicals Corporation
    Inventors: Hiraku Kominami, Kozaburo Hayashi, Kazuki Shibata
  • Patent number: 6117952
    Abstract: A powder coating composition comprising(A) a solid epoxy resin mixture that comprises at least one epoxy resin component (A1) and one epoxy resin component (A2) and(B) a free-carboxyl-group-containing polyester in an amount sufficient for the full cure of the composition,in which the epoxy resin component (A1) consists of one or more epoxy resins and has overall a mean epoxy functionality that is greater than 2,wherein the epoxy resin component (A2) consists of one or more advanced epoxy resins each of which has a mean epoxy functionality of at least 1.2 but less than 1.95 and is the product of a reaction in which (i) at least one diglycidyl compound is simultaneously reacted with (ii) at least one bisphenol compound and (iii) at least one monophenol as starting materials, and the difference between the mean epoxy functionality of the epoxy resin mixture (A) and the mean epoxy functionality of component (A2) of the mixture is at least 0.05 but less than 0.8.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: September 12, 2000
    Assignee: Ciba Specialty Chemicals Corp.
    Inventors: Jurgen Finter, Isabelle Frischinger, Christine Poget
  • Patent number: 6114450
    Abstract: An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: September 5, 2000
    Assignee: International Business Corporation
    Inventors: Krishna Gandhi Sachdev, Michael Berger, Anson Jay Call, Frank Louis Pompeo Jr.