Abstract: A semiconductor device includes a first transistor including a GaN-based semiconductor stacked structure formed over a substrate, a first gate electrode having a plurality of first fingers over the semiconductor stacked structure, a plurality of first drain electrodes provided along the first fingers, and a plurality of first source electrodes provided along the first fingers; a second transistor including the semiconductor stacked structure, a second gate electrode having a plurality of second fingers over the semiconductor stacked structure, the second drain electrodes provided along the second fingers, and a plurality of second source electrodes provided along the second fingers; a drain pad provided over or under the first drain electrodes, and coupled to the first drain electrodes; a source pad provided over or under the second source electrodes, and coupled to the second source electrodes; and a common pad coupled to the first source electrodes and the second drain electrodes.

Abstract: A heat dissipation device used for removing heat from a plurality of memory module cards, includes a first bracket, a second bracket placed on the first bracket and a fin set arranged on the second bracket. The first bracket has a plurality of first sheets extending downwardly from a bottom thereof and defines a plurality of slots therein. The second bracket has a plurality of second sheets extending downwardly from a bottom thereof. The first sheets are respectively attached to sides of the memory module cards. The second sheets are respectively extended through the slots of the first bracket and attached to opposite sides of the memory module cards and opposite to the first sheets.

Abstract: A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base.

Abstract: The present invention provides a portable computer in which an increase in temperature of a housing is suppressed. In the present invention, a guide plate is provided to suppress an increase in temperature of a bottom surface. When a cooling fan device operates, outside air taken in from inlet openings flows as an air current through a narrow flow path formed between the guide plate and the bottom surface. A flow velocity of the air current can be increased by narrowing the flow path, and heat exchange with the guide plate can be effectively performed, thereby sufficiently cooling a cooling surface. The cooled guide plate cools an air layer between the guide plate and the heat sink and thermally insulates between the air layer and the bottom surface.

Abstract: A heat dissipation device for dissipating heat from a heat-generating electronic element includes a heat sink for contacting with the heat-generating electronic element, a fan placed on the heat sink for providing an airflow through the heat sink and two wire clips. The fan comprises a frame. Each wire clip comprises a V-shaped main body and two locking parts at two opposite ends of the main body. Middles of the main bodies of the two wire clips are securely attached to two lateral sides of the heat sink by two screws. The locking parts of the wire clips are fastened to the frame of the fan, with the main bodies being deformed and pushing the fan toward the heat sink.

Abstract: A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engaging with the bottom face of the fin assembly and a second face thermally engaging with the condensation portion of the heat pipe. The heat spreader has a profile on the bottom face of the fin assembly, which is in compliance with at least a portion of the heat pipe.

Abstract: A fastener for a heat-dissipating device is adapted to secure a heat sink on a securing seat. The fastener includes a fastening arm having a plate body and a coupling member adapted to couple with one positioning member of the securing seat, a fastening member disposed spacedly below the plate body opposite to the coupling member and adapted to couple with another positioning member, and two linkage sets. Each linkage set is disposed between the plate body and the fastening member, and includes first and second resilient connecting elements connected respectively to the plate body and the fastening member. The linkage sets are pivotable toward each other to cause the plate body to displace toward the fastening member such that the linkage sets engage two openings in the securing seat.

Abstract: The invention relates to a heat dissipation device with a bracket for dissipating heat of a heating element of an expansion card. The heat dissipation device also includes an auxiliary card, a heat dissipating element. The bracket includes a securing element configured for securing the heat dissipating element thereto, a locking element, and a connecting element connecting the securing element to the locking element. The securing element clamps the expansion card, and the locking element is slidably mounted to the auxiliary card, to align the heat dissipating element with the heating element of the expansion card.

Abstract: A system and method are disclosed for enclosing electronic equipment in a noiseproofed and ventilated enclosure. This includes supplying air to an enclosure and removing air from the enclosure through acoustic chambers attached to the enclosure. The acoustic chambers can be constructed of materials or be treated with materials that have noise-absorbing or noise-abating properties. In addition, the acoustic chambers can contain baffles that prevent noise that has entered the acoustic chamber from leaving the chamber. And, the system and method can use a cable egress port that allows cables and wiring to pass through the egress port while blocking the transmission of noise through the egress port.

Abstract: A heat collector includes a heat sink. A recess in the heat sink either forms or receives internal gas and liquid phase lines. A manifold may be integrally formed in the heat sink or may be added on. The manifold combines separate input and output connections into a composite input and output connection. An internal composite line may include the internal gas and liquid phase lines and may be connected to the composite connection of the manifold. The internal liquid phase line is fluidly connected to the internal gas phase line in a transition region of the composite line. Advantageously, the internal liquid phase line may be disposed inside the internal gas phase line for protection and positive heat transfer effects. A cover may hold the composite line in the recess and provide good thermal contact between the lines and the heat sink.