Patents Examined by Robert Karacsony
  • Patent number: 11063371
    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: July 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghyun Baek, Seungtae Ko, Kijoon Kim, Juho Son, Sangho Lee, Youngju Lee, Jungyub Lee, Yonghun Cheon, Dohyuk Ha
  • Patent number: 11063366
    Abstract: A foldable and deployable assembly for use to transfer RF signals comprises a RF transmitter/receiver adapted to operate in the RF range S and up, a transmit/receive horn unit to attach the assembly to an antenna operable in the RF range S and up and a foldable/deployable RF waveguide connected between the RF transmitter/receiver and the transmit/receive horn and operable in the RF range of S and up, the waveguide is formed as a hollow elongated piece made of at least one of silicone based shape memory composite carbon fiber reinforced silicone (CFRS) and graphite with silicone.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: July 13, 2021
    Assignee: NSL COMM LTD
    Inventors: Daniel Rockberger, Raz Itzhaki-Tamir, Daniel Spirtus
  • Patent number: 11056794
    Abstract: A method for producing a dual-polarized antenna includes providing first, second and third dielectric substrates with first and second main surfaces. The method includes patterning a conductive film on the first main surface of the first dielectric substrate to form a first ground conductor having an opening and a metal patch as a radiation element, the patch aligned to the opening in a lamination direction, patterning a conductive film on the first main surface of the second dielectric substrate to form a first feed probe configured to excite the metal patch, patterning a conductive film on the second main surface of the second dielectric substrate to form a second ground conductor having a slot generally parallel to the first feed probe, and patterning a conductive film on the second main surface of the third dielectric substrate to form a second feed probe generally perpendicular to the slot.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: July 6, 2021
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Koh Hashimoto, Makoto Higaki, Manabu Mukai
  • Patent number: 11056772
    Abstract: The present disclosure discloses an antenna system with decreased SAR. The antenna system includes a circuit board having a feeding point, an RF switch for making the antenna system work under a number of working modes with different frequency bands, and a system ground. The antenna further includes a radiation body including a feeding portion electrically connected to the feeding point, a ground portion connected to the system ground by the RF switch, and a connecting portion connecting the feeding portion to the ground portion. The ground portion includes a first metal segment for connecting to the connecting portion, and a second metal segment; the feeding portion includes a third metal segment and a fourth segment. The RF switch electrically connects to the second metal segment, and the feeding point electrically connects to the fourth segment. A method for decreasing the SAR value is also provide.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: July 6, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Kai Dong, Dawei Shi
  • Patent number: 11050154
    Abstract: A chip antenna includes: a body portion; a radiating portion disposed on one surface of the body portion in a width direction; and a ground portion disposed on another surface of the body portion in a width direction, wherein the radiating portion includes a dielectric substance and a conductor, and the dielectric substance and the conductor are respectively disposed in different regions in a thickness direction.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 29, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Ju Hyoung Park
  • Patent number: 11050164
    Abstract: An antenna device is provided and includes a plurality of antenna radiators arranged in an array, a ground member in operable communication with the plurality of antenna radiators, a plurality of conductive cells arranged on the plurality of antenna radiators, and a plurality of feeding lines electrically connected to the plurality of antenna radiators.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: June 29, 2021
    Inventors: Je Hun Jong, Se Hyun Park, Tae Young Kim, Ahmed Hussain, Su Min Yun, Igor Shcherbatko, In Young Lee, Jin Woo Jung, Jae Hoon Jo, Kuo Cheng Chen, Jae Bong Chun
  • Patent number: 11050165
    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: June 29, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghyun Baek, Seungtae Ko, Kijoon Kim, Juho Son, Sangho Lee, Youngju Lee, Jungyub Lee, Yonghun Cheon, Dohyuk Ha
  • Patent number: 11050147
    Abstract: Disclosed are devices, systems and methods regarding ceramic-substrate ultra-wideband (UWB) antennas that utilize surface-mount technology (SMT) for installation, integration and connection to external devices, electronics and systems. Numerous configurations are disclosed for elements comprising each antenna. This ensures that the disclosed antennas may be configured in design to address varying performance requirements as well as to optimize performance across portions of the UWB spectrum.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: June 29, 2021
    Assignee: TAOGLAS GROUP HOLDINGS LIMITED
    Inventor: Andela Zaric
  • Patent number: 11050138
    Abstract: An embodiment antenna system includes a first antenna portion configured to transmit a first signal received from a first feed and a second antenna portion configured to transmit a second signal received from a second feed. The second antenna portion is capacitively coupled to the second feed and inductively coupled to the first antenna portion, and the second signal has a frequency greater than a frequency of the first signal.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: June 29, 2021
    Assignee: Futurewei Technologies, Inc.
    Inventors: Wei Huang, Ping Shi, Xiaoyin He
  • Patent number: 11024945
    Abstract: Embodiments of the present disclosure relate to the field of communications technologies, and disclose an antenna system and a mobile terminal. The antenna system is applied to the mobile terminal. The mobile terminal includes a metal frame and a metal middle frame accommodated in the metal frame and connected to the metal frame, and the antenna system includes at least one antenna group formed on the metal middle frame and the metal frame, and each antenna group includes a first antenna and a second antenna away from each other, where the first antenna and the second antenna are spaced away from each other along a circumferential direction of the metal frame. In the present disclosure, at least one antenna group is added to the terminal based on the original structure, ensuring that the terminal can satisfy a multi-band working requirement and a data transmission requirement.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: June 1, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventor: Jing Wu
  • Patent number: 11022714
    Abstract: An antenna 200, 300, 400 and associated systems 1400, 1500 and methods of use of an antenna 200, 300, 400 in downhole communication or detection. The antenna 200, 300, 400 comprises a plurality of planar substrates and wherein at least two of the plurality of planar substrates each comprise at least one conductive coil 830A-J, and the plurality of planar substrates are spaced apart. The system comprises a downhole arrangement defining a throughbore, a primary antenna and a secondary antenna. At least one of the primary and secondary antennae comprise a plurality of planar substrates. At least two of the plurality of planar substrates each comprise at least one conductive coil. The plurality of planar substrates are spaced apart.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: June 1, 2021
    Assignee: Weatherford U.K. Limited
    Inventor: Hugh Clarkson
  • Patent number: 11018407
    Abstract: According to a notebook-sized personal computer of an embodiment, a base housing retains an arithmetic unit, an antenna having antenna elements, and covers. An LCD housing retains an LCD. Hinges rotatably couple the base housing and the LCD housing to each other. In the base housing, a pair of depression sections are formed by depressing both ends of one side thereof. In each of the pair of depression sections, an antenna element is accommodated. On the base housing, to end sections respectively adjacent to the pair of depression sections along the one side of the base housing, the hinges are respectively provided. The covers respectively accommodate each of the antenna elements, and are constituted of a material through which a radio wave is passed.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: May 25, 2021
    Assignee: Toshiba Client Solutions CO., LTD.
    Inventors: Toshiyuki Hirota, Takeshi Iwata, Kazuya Fukushima, Yusuke Sugiura, Tomomi Murayama, Shogo Maeshima, Tomofumi Miyamoto, Shingo Koide, Hikaru Hirata
  • Patent number: 10998636
    Abstract: An antenna includes a coupling device having first and second coupling plates, e.g. rectangular plates, connected at opposite ends of a conducting bar that acts as a stripline signal feed. A radio-frequency (RF) source may be connected to the conducting bar via a signal feed network. Multiple instances of the device may be arranged vertically in an antenna array assembly to operate together such that the radiation pattern of the antenna assembly is generally directed horizontally. The array may operate to provide a relatively flat azimuthal gain up to 180° across the UHF or VHF bands.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: May 4, 2021
    Assignee: Nokia Shanghai Bell Co., Ltd
    Inventors: Benedikt Scheid, Yan Cao, Ernest Fardin
  • Patent number: 10998643
    Abstract: The present invention discloses a signal integrated terminal, comprising at least a housing, an antenna module and a circuit module, wherein the antenna module comprises a first antenna for receiving TV signals and second antennas for receiving and transmitting wireless signals, which are both matched with the housing and respectively electrically connected with the circuit module, and the circuit module is arranged in the housing. The present invention comprises two antenna types which can cover the common household antenna types to meet the use of common terminals nowadays, the two types of antennas are integrated in one device, so that the user can reduce the purchase cost without buying and installing different devices separately, besides, the user only needs to repair and maintain one device, namely the integrating terminal, which reduces the operating complexity.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: May 4, 2021
    Assignee: SHENZHEN ANTOP TECHNOLOGY LIMITED
    Inventor: Ruidian Yang
  • Patent number: 10992021
    Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: April 27, 2021
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Georgios C. Dogiamis
  • Patent number: 10992022
    Abstract: A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: April 27, 2021
    Assignee: SONY CORPORATION
    Inventors: Wasif Tanveer Khan, Ali Eray Topak, Arndt Thomas Ott
  • Patent number: 10965016
    Abstract: An electronic device casing adapted to cover an antenna is provided. The electronic device casing includes a supporting layer and a carbon fiber layer. The carbon fiber layer is disposed on a surface of the supporting layer and includes a signal passing region having a plurality of slits and a plurality of microstructures separated by the slits. The signal passing region is adapted to cover the antenna, and a signal excited by the antenna is adapted to pass through the supporting layer and the slits so as to pass through the electronic device casing. An electronic device having the electronic device casing is further provided.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: March 30, 2021
    Assignee: HTC Corporation
    Inventors: Ying-Hao Yeh, Sheng-Wen Su
  • Patent number: 10965040
    Abstract: An antenna device is provided. The antenna device includes a first antenna pair. The first antenna pair includes a first antenna unit and a second antenna unit arranged juxtaposed to the first antenna unit. The first antenna unit includes a first membrane extending in a first longitudinal direction. The second antenna unit includes a second membrane extending in a second longitudinal direction. An angle between the first longitudinal direction and the second longitudinal direction is in a range from 75 to 105 degrees.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: March 30, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Tsung-Han Tsai, Kuan-Feng Lee, Yuan-Lin Wu
  • Patent number: 10950952
    Abstract: An antenna array system includes a feed antenna and circuit boards. Each circuit board has pickup antenna elements disposed on a curved edge portion of a first edge of the circuit board, radiating elements disposed on a second edge portion of the circuit board, and transmit receive modules disposed between the pickup elements and the radiating elements on the circuit board. The antenna array can be part of an active electronically scanned array (AESA) antenna assembly.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: March 16, 2021
    Assignee: Rockwell Collins, Inc.
    Inventors: James B. West, Jeremiah D. Wolf, Aimee M. Matland
  • Patent number: 10923827
    Abstract: Embodiments of a wide band multi-polarization antenna system are described, which can be attached to the back or front of a soldier's vest or backpack. The antenna system can allow for release of pre-shaped integral radiating elements that spring into a geometric configuration suitable for circular polarization radiation or linear polarization over a desired band of frequencies. The antenna system can provide, when collapsed, linear polarized line-of sight capability over a wide band of frequencies. In a collapsed low-profile state, the antenna system can remain on the soldier, but out of the way for maneuvering.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: February 16, 2021
    Assignee: Trivec-Avant Corporation
    Inventors: Allen R. Muesse, Steven R. Mills, John E. Fenick, Fernando J. Navarro, David F. Macy