Abstract: An improved system (30) for measuring surface aberrations of concave cylindrical surfaces. In the illustrative embodiment, the invention includes a transmission flat (20), an interferometer (32), and a surface to be measured (28). The transmission flat (20) is a transparent disc that is placed between the interferometer (32) and the surface (28) to be measured. An electromagnetic wave (33,34,36,37) is generated by the interferometer (32), and is directed through the transmission flat (20). The wave (41) bounces off the surface (28) to be measured and is retro-reflected off a first surface (26) of the transmission flat. The electromagnetic wave (42) returns to the opposite side of the surface (28) under test. The wave (43) then bounces off the surface (28) under test and passes through the transmission flat (20). The wave (43) interferes with light (39) that is reflected from a reference surface (26) of transmission flat (20) on a first bounce.

Abstract: The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.