Abstract: A process for preparing a vesicle composition based upon mixing an organopolysiloxane having at least one hydrophilic substituent group, a water miscible solvent, and water is disclosed. The vesicle compositions produced by the method are useful in various personal, household, and health care applications.

Abstract: The present invention relates to curable silicone compositions which include a fluorescent agent for detection purposes and which have a cure system which enables the silicone compositions to possess improved depth of cure. The silicone compositions are photocurable, and may also be moisture or heat curable.

Abstract: The present invention has its object to provide a curable composition which allows slight bleedout of a liquid compound to occur to the cured product and shows good curability and adhesiveness using a non-organotin catalyst, an amine compound, as a silanol condensation catalyst. The present invention relates to a non-organotin-based curable composition which comprises: (A) an organic polymer having a silicon-containing group capable of crosslinking by siloxane bond formation, and (B) a specific amidine compound and/or a guanidine compound having a melting point of not lower than 23° C., as a silanol condensation catalyst.

Abstract: A composition comprises a blend of an aromatic polyketone and a polysiloxane/polyimide block copolymer. The composition can further comprise one or more additives.

Abstract: Moisture-curing compositions include at least one silane-functional polymer P with at least two terminal groups of formula (I) and at least one reaction product R which is produced from at least one aminosilane AS with at least one primary amino group and at least one silane group-free alkene M which is capable of entering in 1,4 addition reactions with primary amino groups. The compositions have improved adhesive properties and are especially suitable for use as adhesives, sealing materials or coatings, especially as elastic adhesive or sealing materials.

Abstract: A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.

Abstract: A liquid composition which can achieve superior scratch resistance of images at such a level that coloring materials are hardly scraped off even when images are scratched with finger nails under application of such strong pressure as to scratch a recording medium at its non-recorded areas. The liquid composition contains at least a modified siloxane compound having specific structure and a polymer whose acid value and hydrogen bond parameter (?h) are specified.

Abstract: Ru(0) complexes containing sulfoxide ligands and aliphatically unsaturated ligands are effective hydrosilylation catalysts useful in particular for addition curing organosilicon compositions.

Abstract: A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.

Abstract: Disclosed herein are polymer compounds, a method for preparing thereof. More specifically, provided are polymer compounds with well-connected, narrow size distribution free-volume element and a method for preparing the polymer compounds by thermal rearrangement for aromatic polyimides containing ortho-positioned functional groups in the solid state.

Abstract: A composition and composite article have improved adherence with an addition-curable material. The composition and therefore the composite article, which includes at least one substrate formed from the composition, include a resin and an additive that is incorporated into the resin. The resin is organic and polymeric and free of ethylenically unsaturated and silicon hydride functional groups. The additive is selected from the group of a fluorine-substituted organopolysiloxane, an amino-functional organopolysiloxane, an unsaturated carboxylic acid or carboxylic acid salt, and combinations thereof. Further, the additive includes a hydrosilylation reactive group present at a surface of the substrate for reaction with the addition-curable material. This improves adherence of the substrate with the addition-curable material. The substrate and the addition-curable material bond together to make the composition article.

Abstract: A hydrophilic composition contains (A) a hydrophilic polymer represented by the following general formula (I); and (B) an alkoxide compound of an element selected from Si, Ti, Zr and Al: wherein the symbols in the formula are defined in the specification.

Abstract: The present invention relates to a method for concentrating organic silicate polymer solution, and more precisely, a method for concentrating organic silicate polymer solution by distillation which is characterized by remarkably reduced distillation time realized by the short-term continuous distillation at low temperature under low pressure, minimized physical property changes attributed to the inhibition of the heat-induced reaction by making the solution pass through the thin film evaporator shortly, concentration without cake generation, and easy manipulation with high capacity, making the method highly economical.

Abstract: Provided in one aspect is a method of melt blending comprising providing an extruder possessing addition points from a zero point to a 100 point the length of the extruder; adding at least one thermoplastic and at least one curable polymer at the zero to 10 point of the extruder; adding at least one silicone hydride at the 5 to 30 point of the extruder; adding at least one metal catalyst at the 20 to 60 point of the extruder, with the proviso that the metal catalyst is added at least 5 points farther down the extruder than the silicone hydride. Provided in another aspect is a hydrosilylation curative composition comprising a silicone hydride having the formula wherein H is hydrogen, and each R? is independently selected from hydrogen and C1 to C10 alkyl groups; R? is selected from C1 to C10 alkyl groups; n is an integer from 5 to 45; and m is an integer from 5 to 45.

Abstract: Storage stable compounds having at least two organopolysiloxane groups and at least one methylol group are useful as coatings on textile, paper, and other substrates, and are post-crosslinkable.

Abstract: An optical bonding composition and LED light source comprising the composition are disclosed, as well as a method of making the LED light source. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from (R1SiO1.5)n wherein R1 is an organic group and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Abstract: The present invention has its object to provide, by using a non-organotin curing catalyst, a curable composition having a practical level of curability. Furthermore, the present invention has its object to provide a curable composition excellent in adhesiveness while it secures a practical level of curability. The present invention relates to a curable composition which comprises: (A) an organic polymer containing a silicon-containing group capable of crosslinking by siloxane bond formation and (B) a silanol condensation catalyst: and that the silanol condensation catalyst is an amine compound and that an aqueous solution prepared by adding 5 millimoles of the amine compound to 100 g of a mixed solvent composed of isopropyl alcohol and water in a weight ratio of 10:3 has a pH value of not lower than 13.4 as measured at 23° C. according to JIS Z 8802.

Abstract: An electrical wire comprising a conductor and a covering disposed over the conductor. The covering comprises a thermoplastic composition. The thermoplastic composition comprises a blend of an aromatic polyketone and a polysiloxane/polyimide block copolymer. The composition can further comprise one or more additives.

Abstract: The instant invention relates to oligo- and poly-carbonates terminated with silicon containing groups which are useful as reducers of surface energy for organic materials such as polycarbonates, polyesters or polyketones or their mixtures, blends or alloys. Polymers with such reduced surface energy possess self-cleaning, anti-soiling, anti-graffiti, oil resistance, solvent resistance, chemical resistance, self-lubricating, scratch resistance, low moisture absorption, dirt pickup resistance, slip properties and a hydrophobic surface; and display anti-adhesion properties against proteins and against microorganisms such as for example, bacteria, fungi and algae.

Abstract: A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent.