Abstract: In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.

Abstract: A first impurity region is formed on the inner surface of a trench formed on the major surface of a semiconductor substrate. The trench is filled with a vertical portion of a first electric conductor having a reversed L-shaped cross section through an insulating film. A first transistor having a first impurity region serving as a source/drain region is formed on the semiconductor substrate. A second impurity region serving as a source/drain region of a second transistor is formed on the major surface of the semiconductor substrate and spaced from the trench. A second electric conductor having a reversed L-shaped cross section for connecting the vertical portion to the second impurity region is formed, and a horizontal portion of the second electric conductor is formed to be stacked on a horizontal portion of the first electric conductor with an insulating film formed therebetween.